| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 12/16/2004 | WO2004109816A2 Encapsulant for opto-electronic devices and method for making it |
| 12/16/2004 | WO2004109802A1 Memory expansion and integrated circuit stacking system and method |
| 12/16/2004 | WO2004109800A1 Electronic device, information processor, and electromagnetic radiation suppressing member |
| 12/16/2004 | WO2004109799A1 Power distribution network of an integrated circuit |
| 12/16/2004 | WO2004109798A1 Method and assembly for thermally protecting electronic units in an electronic device |
| 12/16/2004 | WO2004109797A1 Heatsink for integrated circuit such as cpu |
| 12/16/2004 | WO2004109795A2 Thermal interconnect system and method of production thereof |
| 12/16/2004 | WO2004109792A1 Electronic component as well as semiconductor wafer and component support for the production of said component |
| 12/16/2004 | WO2004109774A2 Selective reference plane bridge(s) on folded package |
| 12/16/2004 | WO2004109771A2 Stackable semiconductor device and method of manufacturing the same |
| 12/16/2004 | WO2004109770A2 Through wafer via process and amplifier with through wafer via |
| 12/16/2004 | WO2004109769A2 Microelectromechanical systems and methods for encapsulating |
| 12/16/2004 | WO2004109763A2 High impedance radio frequency power plastic package |
| 12/16/2004 | WO2004109759A2 Integrated heat spreader lid |
| 12/16/2004 | WO2004109756A2 Method and system for using ion implantation for treating a low-k dielectric film |
| 12/16/2004 | WO2004109753A2 Methods and apparatus for defining power grid structures having diagonal stripes |
| 12/16/2004 | WO2004109584A1 Method for producing an integrated fingerprint sensor, sensor circuit arrangement, and injection arrangement |
| 12/16/2004 | WO2004109237A1 Octagonal pedestal for stabilizing filling |
| 12/16/2004 | WO2004095583A3 Radiation-hardened transistor fabricated by modified cmos process |
| 12/16/2004 | WO2004073019A3 Semiconductor die package with reduced inductance and reduced die attach flow out |
| 12/16/2004 | WO2004032186B1 Thermal enhanced package for block mold assembly |
| 12/16/2004 | WO2004004004A3 Forming contact arrays on substrates |
| 12/16/2004 | WO2002103755A9 Semiconductor die including conductive columns |
| 12/16/2004 | US20040255259 Device, design and method for a slot in a conductive area |
| 12/16/2004 | US20040254305 Two or more epoxy resins, hardeners and hardening accelerator; excellent light transmittance as well as good reflow heat resistance and low moisture absorption |
| 12/16/2004 | US20040253875 Circuitized connector for land grid array |
| 12/16/2004 | US20040253874 Connector or other circuit element having an indirectly coupled integrated circuit |
| 12/16/2004 | US20040253862 Method for providing socket on substrate and socket applied with such method |
| 12/16/2004 | US20040253846 Land grid array connector including heterogeneous contact elements |
| 12/16/2004 | US20040253845 Remountable connector for land grid array packages |
| 12/16/2004 | US20040253829 Methods to planarize semiconductor device and passivation layer |
| 12/16/2004 | US20040253828 Fabrication method of semiconductor integrated circuit device |
| 12/16/2004 | US20040253825 Semiconductor device |
| 12/16/2004 | US20040253818 Fabrication method of IC inlet, ID tag, ID tag reader and method of reading data thereof |
| 12/16/2004 | US20040253812 Method for BARC over-etch time adjust with real-time process feedback |
| 12/16/2004 | US20040253810 Dummy structures to reduce metal recess in electropolishing process |
| 12/16/2004 | US20040253807 Barrier layer stack to prevent Ti diffusion |
| 12/16/2004 | US20040253803 Packaging assembly and method of assembling the same |
| 12/16/2004 | US20040253802 Method of plating electrode formation |
| 12/16/2004 | US20040253798 Manufacturing method for SOI semiconductor device, and SOI semiconductor device |
| 12/16/2004 | US20040253783 Semiconductor device and method for fabricating the same |
| 12/16/2004 | US20040253778 Method for manufacturing a memory cell for modification of revision identifier in an integrated circuit chip |
| 12/16/2004 | US20040253770 Semiconductor device and process for fabrication thereof |
| 12/16/2004 | US20040253769 Method of manufacturing semiconductor device |
| 12/16/2004 | US20040253768 Method of manufacturing an electronic component and electronic component obtained by means of said method |
| 12/16/2004 | US20040253767 Thermally enhanced component substrate |
| 12/16/2004 | US20040253766 Diamond composite heat spreader and associated methods |
| 12/16/2004 | US20040253765 Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging |
| 12/16/2004 | US20040253764 Bumped chip carrier package using lead frame and method for manufacturing the same |
| 12/16/2004 | US20040253763 Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor |
| 12/16/2004 | US20040253762 Chip stack package, connecting board, and method of connecting chips |
| 12/16/2004 | US20040253754 System and method for testing a semiconductor chip |
| 12/16/2004 | US20040253749 Method for inspecting a connecting surface of a flip chip |
| 12/16/2004 | US20040253130 Electronic thermal management |
| 12/16/2004 | US20040253077 Apparatus and method for a cooling solution fastening assembly |
| 12/16/2004 | US20040252931 Multilayer monolithic electronic device and method for producing such a device |
| 12/16/2004 | US20040252535 Apparatus for conditioning power and managing thermal energy in an electronic device |
| 12/16/2004 | US20040252477 Contact grid array formed on a printed circuit board |
| 12/16/2004 | US20040252475 Module part |
| 12/16/2004 | US20040252463 Mounting device for heat sink |
| 12/16/2004 | US20040252462 Land grid array assembly using a compressive load |
| 12/16/2004 | US20040252461 Heat sink assembly incorporating mounting frame |
| 12/16/2004 | US20040252459 Air guiding device for electronic components |
| 12/16/2004 | US20040252458 Electronic apparatus and method of cooling the electronic apparatus |
| 12/16/2004 | US20040252427 Semiconductor device |
| 12/16/2004 | US20040252251 Method and apparatus for transferring blocks |
| 12/16/2004 | US20040252113 Interconnect structure for electronic devices |
| 12/16/2004 | US20040251793 Micromachine and method of fabricating the same |
| 12/16/2004 | US20040251790 Surface acoustic wave device, package for the device, and method of fabricating the device |
| 12/16/2004 | US20040251561 Thermoplastic fluxing underfill composition and method |
| 12/16/2004 | US20040251559 Hybrid integrated circuit package substrate |
| 12/16/2004 | US20040251557 Integrated circuit package having stacked integrated circuits and method therefor |
| 12/16/2004 | US20040251556 Method for forming barrier layer and structure |
| 12/16/2004 | US20040251555 Interconnection structure of semiconductor device |
| 12/16/2004 | US20040251554 Semiconductor device, circuit board, electronic instrument, and method of manufacturing semiconductor device |
| 12/16/2004 | US20040251553 Semiconductor device and manufacturing method thereof |
| 12/16/2004 | US20040251552 Semiconductor device and manufacturing method the same |
| 12/16/2004 | US20040251550 Semiconductor device and method of manufacturing the same |
| 12/16/2004 | US20040251549 Hybrid copper/low k dielectric interconnect integration method and device |
| 12/16/2004 | US20040251548 Method for forming barrier layer and structure |
| 12/16/2004 | US20040251547 Method of a non-metal barrier copper damascene integration |
| 12/16/2004 | US20040251546 Package and method for bonding between gold lead and gold bump |
| 12/16/2004 | US20040251545 Semiconductor chip with bumps and method for manufacturing the same |
| 12/16/2004 | US20040251544 Interconnection pattern design |
| 12/16/2004 | US20040251543 Semiconductor device |
| 12/16/2004 | US20040251542 Flip-chip interconnect with increased current-carrying capability |
| 12/16/2004 | US20040251540 Semiconductor module and mounting method for same |
| 12/16/2004 | US20040251538 Semiconductor package with heat sink |
| 12/16/2004 | US20040251537 Flexible substrate for a semiconductor package, method of manufacturing the same, and semiconductor package including flexible substrate |
| 12/16/2004 | US20040251536 Semiconductor device |
| 12/16/2004 | US20040251535 Automatic wiring method for semiconductor integrated circuit, program for the same, and semiconductor integrated circuit |
| 12/16/2004 | US20040251533 Hybrid integrated circuit device |
| 12/16/2004 | US20040251532 Chip package structure |
| 12/16/2004 | US20040251531 Stack type flip-chip package |
| 12/16/2004 | US20040251530 Three-dimensionally mounted semiconductor module and three-dimensionally mounted semiconductor system |
| 12/16/2004 | US20040251529 Multi-chip ball grid array package |
| 12/16/2004 | US20040251528 Electric power semiconductor device |
| 12/16/2004 | US20040251527 Intermediate support for electronic components and method for solder contacting such an intermediate support |
| 12/16/2004 | US20040251526 System for semiconductor package with stacked dies |
| 12/16/2004 | US20040251525 Methods and apparatus for packaging integrated circuit devices |