H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2004
12/23/2004	US20040257779 Packages for communication devices and a process for manufacturing the same
12/23/2004	US20040257773 Stack up assembly
12/23/2004	US20040257772 Stack up assembly
12/23/2004	US20040257771 Attaching device for mounting and fixing a semiconductor device and a heat sink provided on the semiconductor device on a board, a mount board having the board, the semiconductor device, and the heat sink, and an attaching method of the semiconductor device and the heat sink provided on the semiconductor device on the board
12/23/2004	US20040257770 Clamping structure and heat dissipating module using same
12/23/2004	US20040257769 Processor module mounting assembly and a method of use
12/23/2004	US20040257768 Cooling device, electronic apparatus, display unit, and method of producing cooling device
12/23/2004	US20040257766 Rack enclosure
12/23/2004	US20040257749 Capacitor, capacitor equipped semiconductor device assembly, capacitor equipped circuit substrate assembly and electronic unit including semiconductor device, capacitor and circuit substrate
12/23/2004	US20040257500 Liquid crystal display
12/23/2004	US20040257230 Integrated circuit packages with marked product tracking information
12/23/2004	US20040257179 Apparatus and method to form ground connections
12/23/2004	US20040257141 Semiconductor integrated circuit apparatus
12/23/2004	US20040257105 Testing vias and contacts in integrated circuit
12/23/2004	US20040257104 Evaluation device for evaluating semiconductor device
12/23/2004	US20040256985 Active matrix electroluminescence device and method for fabricating the same
12/23/2004	US20040256924 AC generator for vehicles
12/23/2004	US20040256742 Semiconductor module and method of manufacturing the same
12/23/2004	US20040256741 Apparatus and method for signal bus line layout in semiconductor device
12/23/2004	US20040256740 Semiconductor device packages including a plurality of layers substantially encapsulating leads thereof
12/23/2004	US20040256739 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
12/23/2004	US20040256738 Battery protection circuit with integrated passive components
12/23/2004	US20040256737 [flip-chip package substrate and flip-chip bonding process thereof]
12/23/2004	US20040256735 Laminated chip electronic device and method of manufacturing the same
12/23/2004	US20040256734 Multi-dice chip scale semiconductor components and wafer level methods of fabrication
12/23/2004	US20040256733 Method for manufacturing a semiconductor device and a semiconductor device
12/23/2004	US20040256732 Shared contact for high-density memory cell design
12/23/2004	US20040256731 Dielectric composite material
12/23/2004	US20040256730 Mold type semiconductor device and method for manufacturing the same
12/23/2004	US20040256729 Metallization line formed within a low-k dielectric material; hard mask layer; embedded dielectric cap; semiconductors
12/23/2004	US20040256728 Semiconductor device and its manufacturing method
12/23/2004	US20040256727 Multi-layer fine wiring interposer and manufacturing method thereof
12/23/2004	US20040256726 Semiconductor device and manufacturing method thereof
12/23/2004	US20040256725 Semiconductor device and method of fabricating the same
12/23/2004	US20040256723 Semiconductor device and fabrication process thereof
12/23/2004	US20040256722 Methods of operating microelectronic devices, and methods of providing microelectronic devices
12/23/2004	US20040256721 Package for semiconductor devices
12/23/2004	US20040256720 Thermal interface apparatus, systems, and methods
12/23/2004	US20040256719 MEMS micro-cap wafer level chip scale package
12/23/2004	US20040256717 LSI package
12/23/2004	US20040256715 Wiring board, semiconductor device and process of fabricating wiring board
12/23/2004	US20040256714 Laminated electronic component
12/23/2004	US20040256713 Rectification chip terminal structure
12/23/2004	US20040256712 Semiconductor integrated circuit with dummy patterns
12/23/2004	US20040256711 Semiconductor device, semiconductor module and hard disk
12/23/2004	US20040256710 Device with power semiconductor components for controlling the power of high currents and use of said device
12/23/2004	US20040256709 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument
12/23/2004	US20040256708 Multi-chip module with extension
12/23/2004	US20040256707 Semiconductor device and method of manufacturing the same
12/23/2004	US20040256706 Molded package and semiconductor device using molded package
12/23/2004	US20040256705 Substrate-based IC package
12/23/2004	US20040256704 Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon
12/23/2004	US20040256703 Wireless bonded semiconductor device and method for packaging the same
12/23/2004	US20040256702 Tape carrier type semiconductor device and method of producing the same
12/23/2004	US20040256701 Film carrier tape for mounting electronic devices thereon and final defect marking method using the same
12/23/2004	US20040256675 Electro-static discharge protection circuit and method for making the same
12/23/2004	US20040256669 Distributed power MOSFET
12/23/2004	US20040256645 Semiconductor device and method of manufacturing the same
12/23/2004	US20040256643 Pakage structure with a heat spreader and manufacturing method thereof
12/23/2004	US20040256642 Charging sensor method and apparatus
12/23/2004	US20040256641 Pad arrangement in semiconductor memory device and method of driving semiconductor device
12/23/2004	US20040256631 GaN LED for flip-chip bonding and method of fabricating the same
12/23/2004	US20040256624 Semiconductor-on-diamond devices and methods of forming
12/23/2004	US20040256619 Display device and manufacturing method of the same
12/23/2004	US20040256592 Water-capturing agent and organic EL device
12/23/2004	US20040256466 Thin electronic label and method for making same
12/23/2004	US20040256463 Semiconductor device and an information management system therefor
12/23/2004	US20040256443 Ball grid array package with stacked center pad chips and method for manufacturing the same
12/23/2004	US20040256368 Chip scale marker and method of calibrating marking position
12/23/2004	US20040256352 Embossed mask lithography
12/23/2004	US20040256239 Tin plating method
12/23/2004	US20040256150 Nonconducting substrate, forming a strip or a panel, on which a multiplicity of carrier elements are formed
12/23/2004	US20040256133 Constructing of an electronic assembly having a decoupling capacitor
12/23/2004	US20040256085 Finned device for removing heat from an electronic component
12/23/2004	US20040255862 Reactor for producing reactive intermediates for low dielectric constant polymer thin films
12/23/2004	US20040255670 Packaged accelerometer
12/23/2004	US20040255458 Programmed material consolidation methods for fabricating semiconductor device components and conductive features thereof
12/23/2004	US20040255457 Tile-based routing method of a multi-layer circuit board and related structure
12/23/2004	US20040255456 Method for manufacturing a chip carrier
12/23/2004	US20040255454 Method of fabricating an integrated circuit package
12/23/2004	US20040255451 Broken die detect sensor
12/23/2004	DE202004015170U1 Kühlvorrichtung Cooler
12/23/2004	DE202004011399U1 Chip module especially TO-252(DPAK) or TO-263(D2PAK) types can be firmly mounted on a platform and has exposed heat dissipating surface
12/23/2004	DE19701938B4 Lüfterunterstütztes Wärmesenkenelement Fan assisted heat sink element
12/23/2004	DE10358917A1 Housing of axial flow fan for computer, has stator blades arranged in outer frame, corresponding to air guides formed at one side of outer frame
12/23/2004	DE10325503A1 Electronic circuit board module e.g. for automobile onboard computer, has pins securing circuit board and parallel metal plate at fixed relative spacing against force of spring device acting between them
12/23/2004	DE10325281A1 Elektroakustisches Bauelement und Verfahren zur Herstellung Electro-acoustic component and methods for making
12/23/2004	DE10324069A1 Circuit to conductively bond contact spots on a semiconductor chip to mounting connections has a straight and a bent bond wire connection
12/23/2004	DE10323394A1 Connecting semiconductor chip or wafer sections, provides contact pin in recess between opposite faces which are pressed together to make local contact
12/23/2004	DE10320414A1 Semiconductor arrangement has integrated structure surrounded by protective structure to prevent diffusion of minority carriers and a contact to the substrate
12/23/2004	DE102004017412A1 Elektrische Quantifizierung einer Verkürzung eines Leitbahnendes Electrical quantification of shortening a Leitbahnendes
12/22/2004	EP1489895A1 Simple constant temperature device for electronic device and method for controlling the constant temperature device
12/22/2004	EP1489839A2 Semiconductor integrated circuit apparatus
12/22/2004	EP1489659A1 Contact metallisation for semiconductor devices
12/22/2004	EP1489658A2 Method for manufacturing semiconductor package
12/22/2004	EP1489657A1 Semiconductor chip mounting board, its manufacturing method, and semiconductor module
12/22/2004	EP1489656A2 Method of fabrication of an unbreakable disc-shaped object and corresponding semiconductor circuit
12/22/2004	EP1488458A2 Automatically adjusting serial connections of thick and thin layers and method for the production thereof
12/22/2004	EP1488451A1 Methods for manufacturing compound semiconductor and compound insulator using chemical reaction and diffusion by heating, compound semiconductor and compound insulator manufactured using the method, and photocell, electronic circuit, transistor, and memory using the same
12/22/2004	EP1488284A2 Photomask and method for photolithographic patterning of a substrate by use of phase shifted assist features

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