H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2004
12/22/2004	EP1487759A1 Method for the production of a metal-ceramic substrate, preferably a copper-ceramic substrate
12/22/2004	EP1433368B1 Electronic circuit comprising conductive bridges and method for making such bridges
12/22/2004	EP1423877A4 Structure and method for fabrication of a leadless chip carrier with embedded inductor
12/22/2004	EP1368401B1 Liquid epoxy resin emulsions, method for the production and use thereof
12/22/2004	EP1135978B1 Heatsink for electronic component, and apparatus and method for manufacturing the same
12/22/2004	EP0823729B1 Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for tab, adhesive-backed tape for wire-bonding connection, semiconductor connecting substrate, and semiconductor device
12/22/2004	CN2666095Y Radiator
12/22/2004	CN2665970Y Automatic connecting needle
12/22/2004	CN2665933Y Easily assembled forced air cooling heat radiation device
12/22/2004	CN2665932Y 散热器 Heat sink
12/22/2004	CN2665931Y 散热器 Heat sink
12/22/2004	CN2665930Y Air outlet flow guiding structure of heat radiation fan
12/22/2004	CN2665929Y Air outlet flow guiding structure of heat radiation fan
12/22/2004	CN2665928Y Heat pipe and heat radiation device equipped with the same
12/22/2004	CN2665927Y Phase-change heat radiation device
12/22/2004	CN2665926Y Phase-change heat radiation pipe
12/22/2004	CN2665925Y Radiator fin integrated fastening and clamping mechanism
12/22/2004	CN2665924Y CPU radiator wind-guiding cover having fastening function
12/22/2004	CN2665923Y Improved CPU radiator
12/22/2004	CN2665922Y Radiator
12/22/2004	CN2665921Y Improved radiator
12/22/2004	CN2665920Y Heat radiation type PCB heat board
12/22/2004	CN2665919Y Expansive heat radiation device
12/22/2004	CN2665918Y Dustproof and moistureproof device for electronic and electric appliance products
12/22/2004	CN2665917Y Ball-type grid array movable testing seat
12/22/2004	CN2665800Y Heat radiation pipe
12/22/2004	CN2665797Y Radiator fastener
12/22/2004	CN2665649Y 热管 Heat pipe
12/22/2004	CN1557019A Heat sink for semiconductor components or similar devices, method for producing the same and tool for carrying out said method
12/22/2004	CN1556996A Nanotube films and articles
12/22/2004	CN1556911A Modular capillary pumped loop cooling system
12/22/2004	CN1556841A Thermoconductive composition
12/22/2004	CN1556667A Electric conductor embedding method and circuit board and chip using said method
12/22/2004	CN1556545A Flat curved type heat pipe integrated heat radiator for electron element
12/22/2004	CN1556544A Preparation method of gastight packaged cover plate for integrated curcuit
12/22/2004	CN1181716C Multilayer ceramic supporting base with anchored welding pad and its mfg. method
12/22/2004	CN1181549C Semiconductor device and mfg. method thereof
12/22/2004	CN1181546C Integrated circuit with programmable memory element
12/22/2004	CN1181543C Parallel semi-conductor piling-up device
12/22/2004	CN1181542C Semiconductor device, installation structure for semiconductor device, liquid crystal device and electronic device
12/22/2004	CN1181541C Layout structure for multi-layer metallic power/ground bus
12/22/2004	CN1181539C Radiator and its producing method
12/22/2004	CN1181538C LGA clamping mechanism
12/22/2004	CN1181533C Packed metal structure of semi-conductor device and capacitor including the same structure
12/22/2004	CN1181532C Method for producing semiconductor apparatus
12/22/2004	CN1181531C Button electrode forming method, and semiconductor element and device fabricating method
12/22/2004	CN1181530C Electroplated interconnection structures on integrated circuit chips
12/22/2004	CN1181524C Method for forming integrated circuit package at wafer level
12/22/2004	CN1181140C Polyporous material
12/22/2004	CN1180908C Method for preparing Kovar alloy electronic package box
12/21/2004	US6834375 System and method for product yield prediction using a logic characterization vehicle
12/21/2004	US6834154 Tooling fixture for packaged optical micro-mechanical devices
12/21/2004	US6833992 Electronic apparatus having a plurality of radiators in which liquid coolant flows
12/21/2004	US6833986 Integrated passive components and package with posts
12/21/2004	US6833984 Semiconductor module with serial bus connection to multiple dies
12/21/2004	US6833781 High Q inductor in multi-level interconnect
12/21/2004	US6833775 Microwave circuit
12/21/2004	US6833720 Electrical detection of dicing damage
12/21/2004	US6833629 Dual cure B-stageable underfill for wafer level
12/21/2004	US6833628 Mutli-chip module
12/21/2004	US6833627 To form, in situ, at least semisolid dam structures of photopolymeric material about the devices to entrap liquid, unpolymerized resin between the devices and the substrate
12/21/2004	US6833623 Enhanced barrier liner formation for via
12/21/2004	US6833620 Apparatus having reduced input output area and method thereof
12/21/2004	US6833619 Thin profile semiconductor package which reduces warpage and damage during laser markings
12/21/2004	US6833617 Composite material including copper and cuprous oxide and application thereof
12/21/2004	US6833616 Multilayer wiring board with mounting pad
12/21/2004	US6833615 Via-in-pad with off-center geometry
12/21/2004	US6833614 Semiconductor device that can suppress the disturbance in the signal waveform even when a higher speed signal is applied
12/21/2004	US6833613 Stacked semiconductor package having laser machined contacts
12/21/2004	US6833612 Flip-chip image sensor packages
12/21/2004	US6833611 Semiconductor device
12/21/2004	US6833610 Bridge connection type of chip package and fabricating method thereof
12/21/2004	US6833609 Integrated circuit device packages and substrates for making the packages
12/21/2004	US6833608 Semiconductor device and packaging system therefore
12/21/2004	US6833607 Resin-molded semiconductor device that includes at least one additional electronic part
12/21/2004	US6833604 High density metal capacitor using dual-damascene copper interconnect
12/21/2004	US6833603 Dynamically patterned shielded high-Q inductor
12/21/2004	US6833593 Electrode means, a method for its manufacture, an apparatus comprising the electrode means as well as use of the latter
12/21/2004	US6833591 Semiconductor device and method for fabricating the same
12/21/2004	US6833586 LDMOS transistor with high voltage source and drain terminals
12/21/2004	US6833581 Structure and method for preventing process-induced UV radiation damage in a memory cell
12/21/2004	US6833568 Geometry-controllable design blocks of MOS transistors for improved ESD protection
12/21/2004	US6833557 Integrated circuit and a method of manufacturing an integrated circuit
12/21/2004	US6833321 Method of making a semiconductor device that has copper damascene interconnects with enhanced electromigration reliability
12/21/2004	US6833317 High permeability composite films to reduce noise in high speed interconnects
12/21/2004	US6833316 Semiconductor device including a pad and a method of manufacturing the same
12/21/2004	US6833309 Method of manufacturing a semiconductor device
12/21/2004	US6833291 Semiconductor processing methods
12/21/2004	US6833290 Structure and method of forming a multiple leadframe semiconductor device
12/21/2004	US6833289 Fluxless die-to-heat spreader bonding using thermal interface material
12/21/2004	US6833287 System for semiconductor package with stacked dies
12/21/2004	US6833285 Method of making a chip packaging device having an interposer
12/21/2004	US6833282 Method of forming an optical sensor device having a composite sandwich structure of alternating titanium and titanium nitride layers
12/21/2004	US6833233 Plugging via hole of semiconductor wafer with non- deep ultraviolet (UV) light-sensitive photoresist which remains after development and selective removal of deep photoresist
12/21/2004	US6833232 Micro-pattern forming method for semiconductor device
12/21/2004	US6832646 Cooler for electronic device
12/21/2004	US6832436 Method for forming a substructure of a multilayered laminate
12/21/2004	US6832410 High performance cooling device with side mount fan
12/16/2004	WO2004110119A1 A method for forming a joint
12/16/2004	WO2004109913A1 Electroacoustic component and method for the production thereof

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