H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2004
12/28/2004	US6836008 Semiconductor packages with leadframe grid arrays and components
12/28/2004	US6836007 Semiconductor package including stacked semiconductor chips
12/28/2004	US6836005 Semiconductor device
12/28/2004	US6836004 Lead frame, and method for manufacturing semiconductor device and method for inspecting electrical properties of small device using the lead frame
12/28/2004	US6836003 Integrated circuit package alignment feature
12/28/2004	US6836002 Semiconductor device
12/28/2004	US6836000 Antifuse structure and method of use
12/28/2004	US6835999 Semiconductor device and method of manufacturing the same
12/28/2004	US6835998 Fuse area structure including protection film on sidewall of fuse opening in semiconductor device and method of forming the same
12/28/2004	US6835995 Low dielectric constant material for integrated circuit fabrication
12/28/2004	US6835994 Power semiconductor module
12/28/2004	US6835993 Bidirectional shallow trench superjunction device with resurf region
12/28/2004	US6835973 Antifuse for use with low κ dielectric foam insulators
12/28/2004	US6835972 Bowtie and T-shaped structures of L-shaped mesh implementation
12/28/2004	US6835971 Semiconductor integrated circuit device with a plurality of limiter circuits
12/28/2004	US6835898 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
12/28/2004	US6835897 Warpage preventing substrate
12/28/2004	US6835896 Packaging structure of a driving circuit for a liquid crystal display device and packaging method of a driving circuit for a liquid crystal display device
12/28/2004	US6835682 High thermal expansion glass and tape composition
12/28/2004	US6835660 Method of manufacturing semiconductor device having metal alloy interconnection that has excellent EM lifetime
12/28/2004	US6835657 Method for recrystallizing metal in features of a semiconductor chip
12/28/2004	US6835655 Method of implanting copper barrier material to improve electrical performance
12/28/2004	US6835648 Semiconductor PMD layer dielectric
12/28/2004	US6835647 Semiconductor device including a plurality of interconnection layers, manufacturing method thereof and method of designing semiconductor circuit used in the manufacturing method
12/28/2004	US6835645 Method for fabricating semiconductor device
12/28/2004	US6835643 Method of improving copper interconnects of semiconductor devices for bonding
12/28/2004	US6835642 Method of forming a metal fuse on semiconductor devices
12/28/2004	US6835631 Method to enhance inductor Q factor by forming air gaps below inductors
12/28/2004	US6835616 Method of forming a floating metal structure in an integrated circuit
12/28/2004	US6835605 Method for providing and utilizing rerouting resources
12/28/2004	US6835604 Methods for transverse hybrid LOC package
12/28/2004	US6835602 Coils integrated in IC-package
12/28/2004	US6835600 Lead frame and method for fabricating resin-encapsulated semiconductor device using the same
12/28/2004	US6835599 Method for fabricating semiconductor component with multi layered leadframe
12/28/2004	US6835598 Stacked semiconductor module and method of manufacturing the same
12/28/2004	US6835597 Semiconductor package
12/28/2004	US6835595 Semiconductor package, semiconductor device, electronic device, and method of manufacturing semiconductor package
12/28/2004	US6835594 Metal wiring method for an undercut
12/28/2004	US6835593 Method for manufacturing semiconductor device
12/28/2004	US6835592 Methods for molding a semiconductor die package with enhanced thermal conductivity
12/28/2004	US6835591 Methods of nanotube films and articles
12/28/2004	US6835580 Direct chip attach structure and method
12/28/2004	US6835579 Method of monitoring internal voltage and controlling a parameter of an integrated circuit
12/28/2004	US6835578 Test structure for differentiating the line and via contribution in stress migration
12/28/2004	US6835576 Magnetic thin film, a magnetic component that uses this magnetic thin film, manufacturing methods for the same, and a power conversion device
12/28/2004	US6835453 Clean release, phase change thermal interface
12/28/2004	US6835318 Method for forming a recognition mark on a substrate for a KGD
12/28/2004	US6834713 Thermosiphon for electronics cooling with nonuniform airflow
12/28/2004	US6834712 Stacked low profile cooling system and method for making same
12/28/2004	US6834711 Heat-radiating structure with low height
12/28/2004	US6834427 Method for depopulating of a ball grid array to allow via placement
12/23/2004	WO2004112453A1 Apparatus and method for a cooling solution fastening assembly
12/23/2004	WO2004112451A1 Land grid array connector
12/23/2004	WO2004112241A1 High-frequency power amplifier module
12/23/2004	WO2004112138A1 Semiconductor device and method for manufacturing same
12/23/2004	WO2004112136A1 Electronic device
12/23/2004	WO2004112135A1 Substrate for semiconductor devices and semiconductor device
12/23/2004	WO2004112134A1 Package for a high-frequency electronic device
12/23/2004	WO2004112133A1 Metal base device and ic card module manufacturing method
12/23/2004	WO2004112132A1 Lead frame, semiconductor device comprising the lead frame and method of manufacturing a semiconductor device with the leadframe
12/23/2004	WO2004112131A1 Semiconductor device
12/23/2004	WO2004112130A1 Semiconductor device
12/23/2004	WO2004112129A1 Electronic device
12/23/2004	WO2004112128A2 Low profile stacking system and method
12/23/2004	WO2004112095A2 Thermoplastic fluxing underfill composition and method
12/23/2004	WO2004112094A2 Semiconductor package having optimized wire bond positioning
12/23/2004	WO2004111659A2 Methods and apparatus for packaging integrated circuit devices
12/23/2004	WO2004110931A2 Method for producing particulate alumina and composition containing particulate alumina
12/23/2004	WO2004084303A3 Flip-chip arrangment on a substrate carrier
12/23/2004	WO2004073023A3 Low voltage nmos-based electrostatic discharge clamp
12/23/2004	WO2004025727A8 Method for sealing a microcavity and package comprising at least one microcavity
12/23/2004	WO2003025975A9 Integrated circuit having a reduced spacing between a bus and adjacent circuitry
12/23/2004	US20040260039 Alkoxy-substituted triarylphosphines are used as initiators to produce oxyalkylene derivatives, particularly from epoxy compounds and acids, anhydrides, esters, sulfonates and carbonates; and as epoxy resins curing accelerators for producing encapsulated semiconductor integrated circuits
12/23/2004	US20040259455 Manufacturing method of electroluminescence display apparatus
12/23/2004	US20040259386 Semiconductor device and method of manufacturing the same
12/23/2004	US20040259385 Method of forming insulating film improved in electric insulating property
12/23/2004	US20040259376 Method of reducing stress migration in integrated circuits
12/23/2004	US20040259374 Semiconductor device and method for manufacturing same
12/23/2004	US20040259354 Deposition stop time detection apparatus and methods for fabricating copper wiring using the same
12/23/2004	US20040259351 Method for manufacturing semiconductor package
12/23/2004	US20040259347 Method and an apparatus for a hard-coded bit value changeable in any layer of metal
12/23/2004	US20040259346 Semiconductor device having a ball grid array and a fabrication process thereof
12/23/2004	US20040259345 Formation method of conductive bump
12/23/2004	US20040259325 Wafer level chip scale hermetic package
12/23/2004	US20040259320 Use of a dual-tone resist to form photomasks including alignment mark protection, intermediate semiconductor device structures and bulk semiconductor device substrates
12/23/2004	US20040259304 Semiconductor device manufacturing method
12/23/2004	US20040259292 Method for producing electrical through hole interconnects and devices made thereof
12/23/2004	US20040259291 Method for efficiently producing removable peripheral cards
12/23/2004	US20040259290 Method for improving the mechanical properties of BOC module arrangements
12/23/2004	US20040259289 Method for forming a high-voltage/high-power die package
12/23/2004	US20040259288 Multichip packages with exposed dice
12/23/2004	US20040259282 Transferring semiconductor crystal from a substrate to a resin
12/23/2004	US20040259277 Semiconductor wafer having an edge based identification feature
12/23/2004	US20040259035 Wet etching ; applying photoresists; exposure to laser light; development
12/23/2004	US20040258948 A lead-free alloy layer comprising a Sn, Sb for a package for an electronic device; joining at a low temperature, reducing vaporization of solder
12/23/2004	US20040258841 Depositing a first layer of thickfilm dielectric on the substrate, air drying the first layer to allow solvents to escape, increasing the porosity of the first layer, oven drying the layer
12/23/2004	US20040257859 High voltage switch circuitry
12/23/2004	US20040257840 Power converter cooling
12/23/2004	US20040257786 Electronic device, information processor, and electromagnetic radiation suppressing member
12/23/2004	US20040257780 Capacitor-related systems for addressing package/motherboard resonance

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