H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2004
12/30/2004	DE10324551A1 Determining thickness of layer grown on semiconductor substrate comprises forming periodic structure on surface of substrate, carrying out selective epitaxial growth, and carrying out scatterometric process
12/30/2004	DE10323007A1 Halbleiteranordnung Semiconductor device
12/30/2004	DE10321214A1 Process for forming electrical contacts on a chip of a chip wafer for low cost radiofrequency identification chips brings contacts to the side faces of the chip
12/30/2004	DE102004026210A1 Physical quantity detector e.g. for pressure of motor vehicle, has positioning unit formed near roll off which is provided at location where corner of sensor provided between inner walls of resin case opposes concave portion of case
12/30/2004	DE102004017984A1 Electrical board manufacture used in power electronics, involves setting conductive strips and heat sinks on conductive layers on both sides of non-conducting base material and fixing heat-dissipating components on conductive strips
12/30/2004	DE102004002015A1 Halbleitervorrichtung mit Scheinelektrode A semiconductor device having dummy electrode
12/30/2004	DE10123362B4 Wafer sowie Verfahren zum Herstellen eines Wafers Wafer and method for manufacturing a wafer
12/29/2004	WO2004114407A1 Optimized multi-application assembly
12/29/2004	WO2004114406A2 Structured semiconductor element for reducing charging effects
12/29/2004	WO2004114405A1 Micro lead frame package and method to manufacture the micro lead frame package
12/29/2004	WO2004114404A1 Device comprising at least one heat source formed by a functional element that is to be cooled, at least one heat sink, and at least one intermediate layer located between the heat source and the heat sink and made of a thermally conducting material, and thermally conducting material, especially for use in such a device
12/29/2004	WO2004114402A1 Wiring board and its production method, and structure for mounting semiconductor chip on wiring board
12/29/2004	WO2004114397A1 Electronic device, assembly and methods of manufacturing an electronic device
12/29/2004	WO2004114365A2 Lost cost chip carrier manufactured from conductive loaded resin-based material
12/29/2004	WO2004114336A2 Method for forming a high-voltage / high-power die package
12/29/2004	WO2004114122A2 Secure number generator and content distribution network employing the same
12/29/2004	WO2004113313A1 Curable polycyclic compounds and process for the production thereof
12/29/2004	WO2004113041A2 Method for producing a ceramic/metal substrate
12/29/2004	WO2004095574B1 Thermal interface apparatus, systems, and methods
12/29/2004	WO2004088727A8 Multi-chip ball grid array package and method of manufacture
12/29/2004	WO2004084301B1 Split fin heat sink
12/29/2004	WO2004079823A3 Thermally enhanced electronic flip-chip packaging with external-connector-side die and method
12/29/2004	WO2004074366A3 Molding compositions containing quaternary organophosphonium salts
12/29/2004	WO2004068543A3 Electrostatic discharge circuit and method therefor
12/29/2004	EP1492396A2 A thermal management device and method of making such a device
12/29/2004	EP1492388A2 Active matrix electroluminescence device and method for fabricating the same
12/29/2004	EP1492220A2 IGBT-module
12/29/2004	EP1492166A1 Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device
12/29/2004	EP1492165A2 Electronic component module
12/29/2004	EP1492164A1 Method of manufacturing heat conductive substrate
12/29/2004	EP1492162A2 A method of forming a nickel silicide layer
12/29/2004	EP1491868A1 Cooled opto-electric detector
12/29/2004	EP1490909A1 Active matrix electroluminescent display devices, and their manufacture
12/29/2004	EP1490908A2 Power module comprising at least two substrates and method for producing the same
12/29/2004	EP1490907A1 Power amplifier device
12/29/2004	EP1490906A1 Beol process for cu metallizations free from al-wirebond pads
12/29/2004	EP1490904A1 Thermosetting adhesive sheet with electroconductive and thermoconductive properties
12/29/2004	EP1490903A2 Semiconductor device with components embedded in backside diamond layer
12/29/2004	EP1490902A1 Semiconductor device with a protective security coating and method of manufacturing the same
12/29/2004	EP1490454A2 Poly(organosiloxane) materials and methods for hybrid organic-inorganic dielectrics for integrated circuit applications
12/29/2004	CN2667666Y Undirectional IC inert proof protector
12/29/2004	CN2667665Y Bridge frame limited semiconductor product
12/29/2004	CN2667664Y Radiator
12/29/2004	CN2667663Y Runner type radiator
12/29/2004	CN2667662Y Integrated circuit heat pipe radiator
12/29/2004	CN2667661Y Integrated radiating device
12/29/2004	CN2667660Y Mounting assembly for radiating apparatus
12/29/2004	CN2667659Y Air duct type radiator
12/29/2004	CN2667658Y Connector for integrated circuit
12/29/2004	CN2667552Y Fixing support for radiating device
12/29/2004	CN1559164A Thermal management of power delivery systems for integrated circuits
12/29/2004	CN1559163A Power delivery system for integrated circuits utilizing discrete capacitors
12/29/2004	CN1559162A Multi-layer wiring board, IC package, and method of manufacturing multi-layer wiring board
12/29/2004	CN1559088A Semiconductor device and method of manufacturing semiconductor device
12/29/2004	CN1559087A Device with power semiconductor components for controlling the power of high currents and use of said device
12/29/2004	CN1559086A Method of manufacturing an integrated circuit, integrated circuit obtained in accordance with said method, wafer provided with an integrated circuit obtained in accordance with the method, and system
12/29/2004	CN1559085A Semiconductor device and method of manufacturing the device
12/29/2004	CN1559084A Power delivery and other systems for integrated circuits
12/29/2004	CN1559083A Production method for semiconductor device
12/29/2004	CN1559081A Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
12/29/2004	CN1558922A Phenolic resin, epoxy resin, processes for production thereof and epoxy resin composition
12/29/2004	CN1558920A Epoxy resin compositions and semiconductor devices
12/29/2004	CN1558714A Radio frequency device
12/29/2004	CN1558455A Light-emitting semiconductor body
12/29/2004	CN1558454A Wavelength-converting casting composition and white light-emitting semiconductor component
12/29/2004	CN1558452A Multiple pin type light-emitting diode assembly
12/29/2004	CN1558451A Light emitting diode element capable of preventing electrostatic damage
12/29/2004	CN1558448A Silicon based micro passage heat exchanger
12/29/2004	CN1557585A Method for preparing Si-Al alloy using spray deposition forming process
12/29/2004	CN1182764C Method for producing ceramic substrate
12/29/2004	CN1182594C Semiconductor device and mfg. method
12/29/2004	CN1182584C Optical device and its producing method and electronic device
12/29/2004	CN1182580C High performance chip packaging and method
12/29/2004	CN1182579C Substrate, displaying device, mounting of substrate and IC chip and mounting bonding method
12/29/2004	CN1182574C Semiconductor device, film carrier tape, and method for manufacturing them
12/29/2004	CN1182573C Process for preparing binding arrangement
12/29/2004	CN1182454C Micro cooling device
12/29/2004	CN1182397C Micro-array chip
12/29/2004	CA2529272A1 Method for forming a high-voltage / high-power die package
12/28/2004	USRE38677 Cam-type retainer clip for heat sinks for electronic integrated circuits
12/28/2004	US6836408 Method and apparatus for force transfer via bare die package
12/28/2004	US6836399 Integrated circuit metal-insulator-metal capacitors formed of pairs of capacitors connected in antiparallel
12/28/2004	US6836394 Electrostatic discharge protection for eletrostatically actuated microrelays
12/28/2004	US6836299 TFT LCD device having multi-layered pixel electrodes
12/28/2004	US6836133 Test circuit, semiconductor product wafer having the test circuit, and method of monitoring manufacturing process using the test circuit
12/28/2004	US6836026 Integrated circuit design for both input output limited and core limited integrated circuits
12/28/2004	US6836025 Semiconductor device configured to be surface mountable
12/28/2004	US6836024 Apparatus for connecting between substrates
12/28/2004	US6836023 Structure of integrated trace of chip package
12/28/2004	US6836022 High voltage flip-chip component package and method for forming the same
12/28/2004	US6836021 Semiconductor device
12/28/2004	US6836019 Semiconductor device having multilayer interconnection structure and manufacturing method thereof
12/28/2004	US6836018 Thermal-stress-absorbing interface structure between a semiconductor integrated circuit chip and a surface-mount structure; includes polymer layers, each having a different modulus of elasticity
12/28/2004	US6836017 Semiconductor that has been protected by depositing a thin, conformal silicon carbide liner with a silicon-rich surface before barrier metal layer deposition; Inter-layer dielectric (ILD)
12/28/2004	US6836015 Optical assemblies for transmitting and manipulating optical beams
12/28/2004	US6836013 Method for sealing a semiconductor device and apparatus embodying the method
12/28/2004	US6836012 Semiconductor package and method of manufacturing the same
12/28/2004	US6836011 Semiconductor chip mounting structure with movable connection electrodes
12/28/2004	US6836010 Semiconductor device include relay chip connecting semiconductor chip pads to external pads
12/28/2004	US6836009 Packaged microelectronic components

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