Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2014
03/12/2014CN102484138B Wiring layer, semiconductor device, liquid crystal display device
03/12/2014CN102479758B Structure for reducing etching residue
03/12/2014CN102479749B Double-embedding structure and formation method thereof
03/12/2014CN102456668B Test structures for through silicon vias (TSVs) of three dimensional integrated circuit (3DIC)
03/12/2014CN102446775B Non-carrier semiconductor packaging component and manufacturing method thereof
03/12/2014CN102446733B Power device with high-voltage radio-frequency lateral diffusion structure and production method of power device
03/12/2014CN102403243B Method for reducing UBM undercut in metal bump structures
03/12/2014CN102382613B Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
03/12/2014CN102347269B Fuse structure and method for forming same
03/12/2014CN102315210B Semiconductor device including semiconductor packages stacked on one another
03/12/2014CN102290415B Semiconductor device and method of manufacturing same
03/12/2014CN102282671B Package assembly and method of tuning natural resonant frequency of package
03/12/2014CN102265514B Piezoelectric oscillation device, method for manufacturing piezoelectric oscillation device, and etching method of structural components forming piezoelectric oscillation device
03/12/2014CN102265323B Display device
03/12/2014CN102232244B Heat sink blockage detector
03/12/2014CN102163907B Voltage source inverter basic function unit based on total control device
03/12/2014CN102158789B MEMS (Micro Electro Mechanical System) microphone structure and forming method thereof
03/12/2014CN102132403B Molded ultra thin semiconductor die packages, systems using same, and methods of making same
03/12/2014CN102110684B Semiconductor capacitor device
03/12/2014CN101906236B Epoxy resin composition for semiconductor encapsulation and semiconductor device using same
03/12/2014CN101794779B Insulated gate type semiconductor device
03/12/2014CN101728371B Integrated circuit structure
03/12/2014CN101553922B Microelectronic package structure and method for manufacturing same
03/12/2014CN101493436B Ultrasonic measuring method
03/12/2014CN101443151B Eyespot exercitation method for thread welding and relevant semiconductor processing operation
03/12/2014CN101350334B Semiconductor assembly having housing
03/11/2014US8670815 Analyte monitoring device and methods of use
03/11/2014US8670638 Signal distribution and radiation in a wireless enabled integrated circuit (IC) using a leaky waveguide
03/11/2014US8669776 Core circuitry, input and output buffers, and four bypass switches
03/11/2014US8669666 Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element
03/11/2014US8669665 Flip-chip mounting substrate and flip-chip mounting method
03/11/2014US8669664 Stacked die package for MEMS resonator system
03/11/2014US8669663 Wiring over substrate, semiconductor device, and methods for manufacturing thereof
03/11/2014US8669662 Fastening device
03/11/2014US8669661 Metal line and via formation using hard masks
03/11/2014US8669660 Solder interconnect pads with current spreading layers
03/11/2014US8669659 Semiconductor device and a method of manufacturing the same
03/11/2014US8669658 Crosstalk-free WLCSP structure for high frequency application
03/11/2014US8669657 Stackable semiconductor assemblies and methods of manufacturing such assemblies
03/11/2014US8669656 Interconnect having ultra high speed signal transmission/reception
03/11/2014US8669655 Chip package and a method for manufacturing a chip package
03/11/2014US8669654 Integrated circuit packaging system with die paddle and method of manufacture thereof
03/11/2014US8669653 Semiconductor device having electronic component in through part, electronic device, and manufacturing method of semiconductor
03/11/2014US8669652 Lead component and method for manufacturing the same, and semiconductor package
03/11/2014US8669651 Package-on-package structures with reduced bump bridging
03/11/2014US8669650 Flip chip semiconductor device
03/11/2014US8669649 Integrated circuit packaging system with interlock and method of manufacture thereof
03/11/2014US8669648 Power semiconductor module
03/11/2014US8669646 Apparatus and method for grounding an IC package lid for EMI reduction
03/11/2014US8669645 Semiconductor structures including polymer material permeated with metal oxide
03/11/2014US8669644 Hydrogen passivation of integrated circuits
03/11/2014US8669600 Liquid crystal display device
03/11/2014US8669596 Semiconductor device
03/11/2014US8669555 Semiconductor device
03/11/2014US8669182 Metal cap with ultra-low κ dielectric material for circuit interconnect applications
03/11/2014US8667811 Method and arrangement for cooling a substrate, especially a semiconductor
03/11/2014CA2621131C Resin composition and hybrid integrated circuit board making use of the same
03/06/2014WO2014036456A2 Method and apparatus for routing die signals using external interconnects
03/06/2014WO2014036291A1 Latch-up suppression and substrate noise coupling reduction through a substrate back-tie for 3d integrated circuits
03/06/2014WO2014036241A2 Corrosive resistant electronic components
03/06/2014WO2014035951A1 Co-support circuit panel and microelectronic packages
03/06/2014WO2014035950A1 Co-support system and microelectronic assembly
03/06/2014WO2014035143A1 Non-shrink varistor substrate and production method for same
03/06/2014WO2014034566A1 Semiconductor device, display panel, and method for manufacturing semiconductor devices
03/06/2014WO2014034512A1 Thin film transistor substrate and display device
03/06/2014WO2014034474A1 Resin composition for sealing electrical and electronic components, method for manufacturing sealant for electrical and electronic components, and sealant for electrical and electronic components
03/06/2014WO2014034443A1 Wiring substrate and wiring substrate fabrication method
03/06/2014WO2014034411A1 Electric power semiconductor device
03/06/2014WO2014034332A1 Power semiconductor module and power semiconductor module producing method
03/06/2014WO2014034306A1 Electronic control device
03/06/2014WO2014034245A1 Power module substrate and power module
03/06/2014WO2014033937A1 Epoxy silicone resin and curable resin composition employing same
03/06/2014WO2014033768A1 Semiconductor device and semiconductor device producing method
03/06/2014WO2014033382A1 Body for pressing a part against a surface
03/06/2014WO2014033174A1 Modular cooling system
03/06/2014WO2014033150A1 Housing for an electronic component, electronic assembly, method for producing a housing for an electronic component and method for producing an electronic assembly
03/06/2014WO2014032940A1 Carrier plate, device having the carrier plate and method for producing a carrier plate
03/06/2014WO2014032416A1 Structure and method for testing gate oxide layer interface trap density
03/06/2014WO2014032365A1 Igbt water cooling radiator
03/06/2014WO2014032228A1 Bridge ball wire bonding
03/06/2014US20140065832 Enhanced finfet process overlay mark
03/06/2014US20140065813 Size-filtered multimetal structures
03/06/2014US20140065769 Chip package and fabrication method thereof
03/06/2014US20140065736 Device correlated metrology (dcm) for ovl with embedded sem structure overlay targets
03/06/2014US20140065296 Method and apparatus for manufacturing lead frames
03/06/2014US20140063890 Semiconductor device
03/06/2014US20140063766 Lateral element isolation device
03/06/2014US20140063723 Package substrates, semiconductor packages having the package substrates, and methods for fabricating the semiconductor packages
03/06/2014US20140063667 Active clamp for a semiconductor switch
03/06/2014US20140062523 Semiconductor apparatus and test method thereof
03/06/2014US20140061955 Thermosetting resin sheet for sealing electronic component, resin-sealed type semiconductor device, and method for producing resin-sealed type semiconductor device
03/06/2014US20140061954 Semiconductor device with pre-molding chip bonding
03/06/2014US20140061953 Semiconductor device and manufacturing method of the same
03/06/2014US20140061952 Identification mechanism for semiconductor device die
03/06/2014US20140061951 Package on package structure and method for manufacturing same
03/06/2014US20140061950 Stackable flip chip for memory packages
03/06/2014US20140061948 Sensor packaging method and sensor packages
03/06/2014US20140061947 Chip stack structure and manufacturing method thereof
03/06/2014US20140061946 Semiconductor Package Including Interposer with Through-Semiconductor Vias
03/06/2014US20140061945 Semiconductor Package Including a Substrate and an Interposer
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