H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2004
12/30/2004	US20040264009 Temperature controlled optoelectronic device
12/30/2004	US20040263668 Solid-state imaging method and apparatus
12/30/2004	US20040263667 Solid-state imaging apparatus and method for making the same
12/30/2004	US20040263310 On-chip inductor with magnetic core
12/30/2004	US20040263308 Inductor formed between two layout layers
12/30/2004	US20040263190 Wafer integrated plasma probe assembly array
12/30/2004	US20040263007 Thermal transfer container for semiconductor component
12/30/2004	US20040262812 Method for wafer scale molding of protective caps
12/30/2004	US20040262811 Method for making a direct chip attach device and structure
12/30/2004	US20040262785 Terminal structure of multi-layer substrate and method for forming the same
12/30/2004	US20040262783 Semiconductor device with alignment mark
12/30/2004	US20040262782 Polymer encapsulated electrical devices
12/30/2004	US20040262781 Method for forming an encapsulated device and structure
12/30/2004	US20040262780 Electronic component and method for its production
12/30/2004	US20040262778 Electromigration barrier layers for solder joints
12/30/2004	US20040262776 Mold compound cap in a flip chip multi-matrix array package and process of making same
12/30/2004	US20040262775 Semiconductor device and method of manufacturing same
12/30/2004	US20040262774 Multi-chip packages having a plurality of flip chips and methods of manufacturing the same
12/30/2004	US20040262773 Chip-stacked package
12/30/2004	US20040262772 Methods for bonding wafers using a metal interlayer
12/30/2004	US20040262771 Stacked capacitor-type semiconductor storage device and manufacturing method thereof
12/30/2004	US20040262770 Semiconductor capacitive element, method for manufacturing same and semiconductor device provided with same
12/30/2004	US20040262769 Semiconductor device and method of manufacturing the same
12/30/2004	US20040262768 Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the same
12/30/2004	US20040262767 Semiconductor device
12/30/2004	US20040262766 Liquid solder thermal interface material contained within a cold-formed barrier and methods of making same
12/30/2004	US20040262765 Addition of metal layers with signal reallocation to a microprocessor for increased frequency and lower power
12/30/2004	US20040262763 Guard ring of a combination wafer or singulated die
12/30/2004	US20040262762 Method of providing via in a multilayer semiconductor device
12/30/2004	US20040262761 Metal thin film of semiconductor device and method for forming same
12/30/2004	US20040262760 Under bump metallization structure of a semiconductor wafer
12/30/2004	US20040262759 comprising adhesive, barrier and wetting layers for enhancing the bonding strength of the connection of bonding pads to wafers and solders
12/30/2004	US20040262758 Electronic device and method of manufacturing the same, and electronic instrument
12/30/2004	US20040262757 Semiconductor device, ball grid array connection system, and method of making
12/30/2004	US20040262756 Ball grid array copper balancing
12/30/2004	US20040262755 Under bump metallization structure of a semiconductor wafer
12/30/2004	US20040262754 IC die support structures for ball grid array package fabrication
12/30/2004	US20040262753 Flip chip packaging structure and related packaging method
12/30/2004	US20040262752 Semiconductor device
12/30/2004	US20040262751 Electronic device manufacture
12/30/2004	US20040262750 Underfill and mold compounds including siloxane-based aromatic diamines
12/30/2004	US20040262749 Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold
12/30/2004	US20040262748 Fabrication of microelectronic devices
12/30/2004	US20040262746 High-density chip scale package and method of manufacturing the same
12/30/2004	US20040262745 Method and apparatus for thermal management of integrated circuits
12/30/2004	US20040262744 Diamondoid-containing thermally conductive materials
12/30/2004	US20040262743 Thermal interface structure with integrated liquid cooling and methods
12/30/2004	US20040262742 Semiconductor package with heat sink
12/30/2004	US20040262741 Resin molded semiconductor device and mold
12/30/2004	US20040262740 Polymer solder hybrid interface material with improved solder filler particle size and microelectronic package application
12/30/2004	US20040262738 Packaging device for semiconductor die, semiconductor device incorporating same and method of making same
12/30/2004	US20040262737 Semiconductor module
12/30/2004	US20040262736 Tape carrier package
12/30/2004	US20040262735 Semiconductor device and production method thereof
12/30/2004	US20040262734 Stack type ball grid array package and method for manufacturing the same
12/30/2004	US20040262733 Scalable microelectronic package using conductive risers
12/30/2004	US20040262732 Semiconductor device and manufacturing method thereof
12/30/2004	US20040262730 Semiconductor carrier film, and semiconductor device and liquid crystal module using the same
12/30/2004	US20040262729 Microelectronic package array
12/30/2004	US20040262728 Modular device assemblies
12/30/2004	US20040262727 Computer system implemented on flex tape
12/30/2004	US20040262726 Electromigration barrier layers for solder joints
12/30/2004	US20040262725 Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication, assembly, and operation therefor
12/30/2004	US20040262724 [quad flat no-lead chip carrier]
12/30/2004	US20040262723 Semiconductor device
12/30/2004	US20040262722 Chip mounting method and mounted substrate manufacturing apparatus
12/30/2004	US20040262721 Manufacturing method for power semiconductor electronic devices
12/30/2004	US20040262720 Semiconductor device
12/30/2004	US20040262719 Lead frame for semiconductor packages
12/30/2004	US20040262718 Semiconductor package for a large die
12/30/2004	US20040262716 Semiconductor package having built-in micro electric mechanical system and manufacturing method thereof
12/30/2004	US20040262710 Semiconductor device
12/30/2004	US20040262709 Semiconductor apparatus including a thin-metal-film resistor element and a method of manufacturing the same
12/30/2004	US20040262702 Low-density, high-resistivity titanium nitride layer for use as a contact for low-leakage dielectric layers
12/30/2004	US20040262689 Electrostatic discharge protection circuit
12/30/2004	US20040262644 Hybrid integrated circuit device
12/30/2004	US20040262640 Semiconductor integrated circuit device having diagonal direction wiring and layout method therefor
12/30/2004	US20040262604 Test structure for detecting defect size in a semiconductor device and test method using same
12/30/2004	US20040262496 Image sensor package and system
12/30/2004	US20040262373 Solder ball mounting method and apparatus therefor
12/30/2004	US20040262372 Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
12/30/2004	US20040262367 Forming a desired fillet on the peripheral portion of a metal circuit; brazing
12/30/2004	US20040262039 Bond finger on via substrate, process of making same, package made thereby, and method of assembling same
12/30/2004	US20040262038 Perimeter matrix ball grid array circuit package with a populated center
12/30/2004	US20040262032 Multilayer composite and method for preparing the same
12/30/2004	US20040262031 Enhancement of performance of a conductive wire in a multilayered substrate
12/30/2004	US20040261988 Application and removal of thermal interface material
12/30/2004	US20040261987 Thermal interface apparatus, systems, and methods
12/30/2004	US20040261981 For dissipation of heat generated in electronic devices
12/30/2004	US20040261980 Heat dissipating device with preselected designed interface for thermal interface materials
12/30/2004	US20040261979 [heat sink structure]
12/30/2004	US20040261977 Mask and substrate alignment for solder bump process
12/30/2004	US20040261976 Axial-flow fan unit and heat-emitting element cooling apparatus
12/30/2004	US20040261975 Radial heat sink with helical shaped fins
12/30/2004	US20040261904 underlays comprising anhydride adducts of rosins and derivatives, for use in microelectronic packages
12/30/2004	US20040261700 Industrial microdeposition system for polymer light emitting diode displays , printed circuit boards and the like
12/30/2004	US20040261282 Alignment mark for aligning wafer of semiconductor device
12/30/2004	DE10345470A1 Semiconductor chip wafer contact structure has cup shaped test contact surfaces and active connection multiplexer circuit in sawing grid areas
12/30/2004	DE10326787A1 Semiconductor component for semiconductor devices comprises conducting layer containing strip conductor and/or resistor which are electrically insulating from remaining regions of conducting layer by oxidic regions
12/30/2004	DE10325769A1 Calibrated current source uses laser programmable I-DAC connected to current bank input

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