| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/04/2005 | US6838750 Interconnect circuitry, multichip module, and methods of manufacturing thereof |
| 01/04/2005 | US6838748 Semiconductor element with electromagnetic shielding layer on back/side face(s) thereof |
| 01/04/2005 | US6838746 Semiconductor configuration and method for fabricating the configuration |
| 01/04/2005 | US6838744 Semiconductor device and manufacturing method thereof |
| 01/04/2005 | US6838739 Component with a label |
| 01/04/2005 | US6838737 Multilayer; preferential etching of dielectric; filling with electroconductive materials; connecting groove exposure contact plug |
| 01/04/2005 | US6838732 Semiconductor device and method for manufacturing the same |
| 01/04/2005 | US6838721 Integrated circuit with a transitor over an interconnect layer |
| 01/04/2005 | US6838717 Stacked structure for parallel capacitors and method of fabrication |
| 01/04/2005 | US6838707 Bi-directional silicon controlled rectifier for electrostatic discharge protection |
| 01/04/2005 | US6838689 Backside alignment and packaging of opto-electronic devices |
| 01/04/2005 | US6838378 Method for manufacturing semiconductor device |
| 01/04/2005 | US6838377 High frequency circuit chip and method of producing the same |
| 01/04/2005 | US6838376 Method of forming semiconductor wiring structures |
| 01/04/2005 | US6838375 Buried digit line stack and process for making same |
| 01/04/2005 | US6838368 Method for making semiconductor device using a nickel film for stopping etching |
| 01/04/2005 | US6838367 Method for simultaneous formation of fuse and capacitor plate and resulting structure |
| 01/04/2005 | US6838362 Process for manufacturing a through insulated interconnection in a body of semiconductor material |
| 01/04/2005 | US6838355 Damascene interconnect structures including etchback for low-k dielectric materials |
| 01/04/2005 | US6838340 Method of manufacturing semiconductor device having MIM capacitor element |
| 01/04/2005 | US6838332 Method for forming a semiconductor device having electrical contact from opposite sides |
| 01/04/2005 | US6838318 Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them |
| 01/04/2005 | US6838317 Techniques for joining an opto-electronic module to a semiconductor package |
| 01/04/2005 | US6838316 Semiconductor device manufacturing method using ultrasonic flip chip bonding technique |
| 01/04/2005 | US6838315 Semiconductor device manufacturing method wherein electrode members are exposed from a mounting surface of a resin encapsulator |
| 01/04/2005 | US6838314 Substrate with stacked vias and fine circuits thereon, and method for fabricating the same |
| 01/04/2005 | US6838313 Molded flip chip package |
| 01/04/2005 | US6838312 Semiconductor device having a primary chip with bumps in joined registration with bumps of a plurality of secondary chips |
| 01/04/2005 | US6838311 Flip chip package and method for forming the same |
| 01/04/2005 | US6838310 Integrated circuit with improved interconnect structure and process for making same |
| 01/04/2005 | US6838300 Chemical treatment of low-k dielectric films |
| 01/04/2005 | US6838299 Forming defect prevention trenches in dicing streets |
| 01/04/2005 | US6838296 Device and method for detecting alignment of deep trench capacitors and active areas in DRAM devices |
| 01/04/2005 | US6838170 Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 01/04/2005 | US6837980 Bond enhancement antitarnish coatings |
| 01/04/2005 | US6837979 Plating conductive layer by applying a plating solution using an anode having a pad attached, when anode and substrate are energized with electric power; altering texture of top portion of conductive layer when pad makes contact with top portion |
| 01/04/2005 | US6837418 Bondhead lead clamp apparatus and method |
| 01/04/2005 | US6837306 Carbon-carbon and/or metal-carbon fiber composite heat spreaders |
| 01/04/2005 | US6837252 Apparatus for treating a workpiece with steam and ozone |
| 01/04/2005 | US6837063 Power management of a computer with vapor-cooled processor |
| 01/04/2005 | US6836961 Ceramic packaging method employing flip-chip bonding |
| 01/04/2005 | US6836953 Method of producing a biometric sensor |
| 01/04/2005 | CA2258731C Insulating film for semiconductor device and semiconductor device |
| 12/30/2004 | US20040268286 Integrated circuit with interface tile for coupling to a stacked-die second integrated circuit |
| 12/30/2004 | US20040268275 Analysis of the quality of contacts and vias in multi-metal fabrication processes of semiconductor devices, method and test chip architecture |
| 12/30/2004 | US20040268271 High data rate differential signal line design for uniform characteristic impedance for high performance integrated circuit packages |
| 12/30/2004 | US20040267990 Portable computer and system controlling method thereof |
| 12/30/2004 | US20040266221 Method of manufacturing semiconductor device |
| 12/30/2004 | US20040266220 Films deposited at glancing incidence for multilevel metallization |
| 12/30/2004 | US20040266194 Method for manufacturing a semiconductor device |
| 12/30/2004 | US20040266188 Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device |
| 12/30/2004 | US20040266183 Surfactant slurry additives to improve erosion, dishing, and defects during chemical mechanical polishing of copper damascene with low K dielectrics |
| 12/30/2004 | US20040266182 Nickel alloy salicide transistor structure and method for manufacturing same |
| 12/30/2004 | US20040266177 Semiconductor device and method of manufacturing the same |
| 12/30/2004 | US20040266176 Semiconductor device and method of manufacturing the same |
| 12/30/2004 | US20040266171 Manufacturing method of semiconductor device |
| 12/30/2004 | US20040266167 Method and apparatus for an improved air gap interconnect structure |
| 12/30/2004 | US20040266163 Bumping process |
| 12/30/2004 | US20040266162 Semiconductor wafer package and manufacturing method thereof |
| 12/30/2004 | US20040266160 Parasitic capacitance-preventing dummy solder bump structure and method of making the same |
| 12/30/2004 | US20040266139 Semiconductor device and manufacturing method thereof |
| 12/30/2004 | US20040266130 Integrating metal with ultra low-k dielectrics |
| 12/30/2004 | US20040266127 Method for manufacturing alignment mark of semiconductor device using STI process |
| 12/30/2004 | US20040266101 Storage node contact forming method and structure for use in semiconductor memory |
| 12/30/2004 | US20040266072 Focused ion beam treatment method and semiconductor device suitable for its implementation |
| 12/30/2004 | US20040266069 Overmolding encapsulation process and encapsulated article made therefrom |
| 12/30/2004 | US20040266068 Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold |
| 12/30/2004 | US20040266067 Semiconductor device and method for fabricating the same |
| 12/30/2004 | US20040266066 Bump structure of a semiconductor wafer and manufacturing method thereof |
| 12/30/2004 | US20040266065 Method of fabricating a composite carbon nanotube thermal interface device |
| 12/30/2004 | US20040266063 Apparatus and method for manufacturing thermal interface device having aligned carbon nanotubes |
| 12/30/2004 | US20040266059 Integrated circuit incorporating wire bond inductance |
| 12/30/2004 | US20040266058 Method for fabricating a packaging device for semiconductor die and semiconductor device incorporating same |
| 12/30/2004 | US20040266056 Diamond-silicon hybrid integrated heat spreader |
| 12/30/2004 | US20040266055 Methods for the control of flatness and electron mobility of diamond coated silicon and structures formed thereby |
| 12/30/2004 | US20040266052 Method for making a color image sensor with pad-to pad soldered supporting substrate |
| 12/30/2004 | US20040266047 Thin film array panel and manufacturing method thereof |
| 12/30/2004 | US20040266038 Semiconductor structures having through-holes sealed with feed-through metalization |
| 12/30/2004 | US20040266037 Direct chip attach structure and method |
| 12/30/2004 | US20040265615 Fineness particle sizes; spraying pyrolysis |
| 12/30/2004 | US20040265599 thin films comprising polysiloxanes laminated between protective films, used for joining semiconductor chips to supports; bonding strength |
| 12/30/2004 | US20040265596 Epoxy resin composition for semiconductor sealing and semiconductor device |
| 12/30/2004 | US20040265551 Laminate of a resin or a composite obtained by mixing a resin and a powdery functional material that is reduced in thickness and size, improved in packaging density and having an improved accuracy of patterning, use for an inductive element |
| 12/30/2004 | US20040265538 Thermal interface apparatus, systems, and methods |
| 12/30/2004 | US20040265508 Method for edge sealing barrier films |
| 12/30/2004 | US20040265495 Blend of paraffin and petrolatum having quantities of thermally-conductive particles, namely, graphite, applied to thermal interfaces |
| 12/30/2004 | US20040265489 Methods of fabricating a composite carbon nanotube thermal interface device |
| 12/30/2004 | US20040265121 Combination of fan and heat sink |
| 12/30/2004 | US20040264759 Pattern inspection method and apparatus, and pattern alignment method |
| 12/30/2004 | US20040264192 Light source apparatus, method of manufacture therefor, and projection-type display apparatus |
| 12/30/2004 | US20040264156 Electronic component module |
| 12/30/2004 | US20040264142 Thermal standoff for close proximity thermal management |
| 12/30/2004 | US20040264140 Power electronics component |
| 12/30/2004 | US20040264138 Thermal Interface Apparatus, Systems, and Fabrication methods |
| 12/30/2004 | US20040264137 Low noise heatsink |
| 12/30/2004 | US20040264136 Composite thermal interface devices and methods for integrated circuit heat transfer |
| 12/30/2004 | US20040264135 Heat sink assembly and method of attaching a heat sink to an electronic device on a motherboard |
| 12/30/2004 | US20040264134 Heatsink device and method |
| 12/30/2004 | US20040264129 Vibration isolation of computing device heat sink fans from attached fan shrouds and heat sinks |
| 12/30/2004 | US20040264103 Capacitor, and capacitor manufacturing process |