| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/05/2005 | EP1494278A1 Electronic power module with rubber seal, and corresponding manufacturing method |
| 01/05/2005 | EP1494277A2 Module with a built-in semiconductor and method for producing the same |
| 01/05/2005 | EP1494247A1 Polymide resin for electrical insulating material |
| 01/05/2005 | EP1494167A1 Flexible semiconductor device and identification label |
| 01/05/2005 | EP1494109A2 Heat dissipating structure for mobile device |
| 01/05/2005 | EP1493773A1 Siloxane-based resin and semiconductor interlayer insulating film made thereof |
| 01/05/2005 | EP1493314A1 Board-level emi shield with enhanced thermal dissipation |
| 01/05/2005 | EP1493188A2 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for the production thereof |
| 01/05/2005 | EP1493186A1 Heat spreader with down set leg attachment feature |
| 01/05/2005 | EP1493183A2 Process for making air gap containing semiconducting devices and resulting semiconducting device |
| 01/05/2005 | EP0835600B1 Perimeter matrix ball grid array circuit package with a populated center |
| 01/05/2005 | DE202004012290U1 Annular cooler for electronic components, has conical metal frame on which streamlined metal cooling ribs are arranged |
| 01/05/2005 | DE10359277A1 Verbindungsstruktur einer Halbleitervorrichtung Interconnect structure of a semiconductor device |
| 01/05/2005 | DE10343509A1 Halbleiteranordnung Semiconductor device |
| 01/05/2005 | DE10327360A1 Verfahren zum Herstellen eines Keramik-Metall-Substrates A method of manufacturing a ceramic-metal substrate |
| 01/05/2005 | DE10326273A1 Verfahren zur Reduzierung der Scheibenkontaminierung durch Entfernen von Metallisierungsunterlagenschichten am Scheibenrand Method for reducing the Scheibenkontaminierung by removing Metallisierungsunterlagenschichten at the wafer edge |
| 01/05/2005 | DE10325863A1 Verfahren zum Herstellen eines integrierten Fingerabdrucksensors sowie Sensorschaltungsanordnung und Einspritzanordnung A method of manufacturing an integrated fingerprint sensor and sensor circuitry and injection assembly |
| 01/05/2005 | DE10325603A1 Production of an electrically conducting bond pad for contacting a substrate, especially a gallium nitride substrate, comprises applying a layer sequence consisting three layers formed on a substrate and tempering |
| 01/05/2005 | DE10324751A1 Semiconductor structure has stabilizing coating of metal and/or passivation material applied to applied/stamped metal/semiconducting/insulation layer structure on upper side of substrate |
| 01/05/2005 | DE10324377A1 Heat extraction device has nanotube arrangement with nanotubes as material for heat extraction and embedded in embedding material, especially adhesive material |
| 01/05/2005 | DE10324190A1 Metal foam heat exchanger, especially for electronic components, has a metal film on at least one of its outer surfaces with which a contact or connection is formed or made with the component that is to be cooled |
| 01/05/2005 | DE10323296A1 Arrangement for stress reduction for substrate-based chip packages has uniform trench-shaped structures on chip side of substrate to interrupt or displace thermally induced mechanical stress |
| 01/05/2005 | DE10322719A1 Circuit arrangement with several chips in housing has at least one top chip mounted on base chip or chips so that base chip does or does not fully support top chip |
| 01/05/2005 | DE102004004539A1 Waferverbindung unter Verwendung von Reaktivfolien zum massiv parallelen Häusen mikro-elektromechanischer Systeme Wafer bonding using reactive foils for massively parallel housings micro-electro-mechanical systems |
| 01/05/2005 | DE102004001243A1 Halbleitervorrichtung Semiconductor device |
| 01/05/2005 | CN2669375Y Assembling structure of integrated circuit |
| 01/05/2005 | CN2669374Y Radiating device |
| 01/05/2005 | CN2669373Y Improved jointing type radiator structure |
| 01/05/2005 | CN2669372Y Inlaid radiating fins |
| 01/05/2005 | CN2669371Y Radiator protection hood |
| 01/05/2005 | CN2669370Y Radiating fins |
| 01/05/2005 | CN2669369Y Chip-testing protection seat |
| 01/05/2005 | CN1561657A Electronic circuit comprising conductive bridges and method for making such bridges |
| 01/05/2005 | CN1561656A Method for mounting an electronic component |
| 01/05/2005 | CN1561551A Improved sealing for OLED devices |
| 01/05/2005 | CN1561545A Semiconductor with multiple rows of bond pads |
| 01/05/2005 | CN1561544A Semiconductor device and method of formation |
| 01/05/2005 | CN1561543A Pressure-contactable power semiconductor module |
| 01/05/2005 | CN1561542A Package for electronic parts, lid thereof, material for the lid and method for producing the lid material |
| 01/05/2005 | CN1561524A Compliant and crosslinkable thermal interface materials |
| 01/05/2005 | CN1561453A Test structures for estimating dishing and erosion effects in copper damascene technology |
| 01/05/2005 | CN1561148A Heat sink to be mounted on printed circuit board |
| 01/05/2005 | CN1560931A Luminous optical element with semiconductor main body |
| 01/05/2005 | CN1560923A Electrostatic discharge protective circuit of duplication structure |
| 01/05/2005 | CN1560922A Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
| 01/05/2005 | CN1560921A Thin film transistor substrate and manufacturing method |
| 01/05/2005 | CN1560920A Carrier |
| 01/05/2005 | CN1560911A Manufacturing method of circuit board |
| 01/05/2005 | CN1560692A Interconnector structure and its manufacturing method |
| 01/05/2005 | CN1183815C Method for mfg. glass ceramic multi-substrate |
| 01/05/2005 | CN1183810C Terminal structure |
| 01/05/2005 | CN1183603C Bipolar transistor with insulated gate |
| 01/05/2005 | CN1183594C Semiconductor device with protection circuit |
| 01/05/2005 | CN1183593C Semiconductor device |
| 01/05/2005 | CN1183592C Silicon controlled rectifier and methodfor realising static discharging protection and locking resisting |
| 01/05/2005 | CN1183591C High laser absorbing copper fuse and its manufacturing method |
| 01/05/2005 | CN1183590C Heat sink with improved heat exchanger |
| 01/05/2005 | CN1183589C Integrated circuit device with displaying integrated circuit chip window and its relative method |
| 01/05/2005 | CN1183588C Ball pin array package substrate and making method |
| 01/05/2005 | CN1183585C Method for manufacture of semiconductor device |
| 01/05/2005 | CN1183486C Electronic module for chip card |
| 01/05/2005 | CN1183483C Secure microcontroller against attacks based on current consumption values |
| 01/05/2005 | CN1183430C Quick heat conducting heat radiator module |
| 01/05/2005 | CN1182939C Method and apparatus for deposition on and polishing of semiconductor surface |
| 01/04/2005 | US6839265 Bi-level digit line architecture for high density DRAMS |
| 01/04/2005 | US6839264 Semiconductor device without adverse effects caused by inclinations of word line and bit line |
| 01/04/2005 | US6839243 Electronic component and method of producing the same |
| 01/04/2005 | US6839236 Voltage control device for vehicular alternator |
| 01/04/2005 | US6839235 Embedded heat pipe for a conduction cooled circuit card assembly |
| 01/04/2005 | US6838970 Inductor for integrated circuit |
| 01/04/2005 | US6838953 High-frequency interconnection for circuits |
| 01/04/2005 | US6838896 Method and system for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus |
| 01/04/2005 | US6838893 Probe card assembly |
| 01/04/2005 | US6838891 Semiconductor device |
| 01/04/2005 | US6838869 Clocked based method and devices for measuring voltage-variable capacitances and other on-chip parameters |
| 01/04/2005 | US6838866 Process for measuring depth of source and drain |
| 01/04/2005 | US6838776 Circuit device with at least partial packaging and method for forming |
| 01/04/2005 | US6838775 Semiconductor device comprising ESD protection circuit for protecting circuit from being destructed by electrostatic discharge |
| 01/04/2005 | US6838774 Interlocking conductor method for bonding wafers to produce stacked integrated circuits |
| 01/04/2005 | US6838773 Semiconductor chip and semiconductor device using the semiconductor chip |
| 01/04/2005 | US6838772 Semiconductor device |
| 01/04/2005 | US6838771 Semiconductor device having conductor layers stacked on a substrate |
| 01/04/2005 | US6838770 Semiconductor device, designing method and designing device thereof |
| 01/04/2005 | US6838769 Integrated circuits; multilayer; noncracking, prevent leakage |
| 01/04/2005 | US6838768 Module assembly for stacked BGA packages |
| 01/04/2005 | US6838767 Semiconductor device |
| 01/04/2005 | US6838766 Semiconductor device |
| 01/04/2005 | US6838765 Semiconductor device and manufacturing method thereof |
| 01/04/2005 | US6838764 Insulators for high density circuits |
| 01/04/2005 | US6838763 Wireless communications system employing a chip carrier |
| 01/04/2005 | US6838762 Water-level package with bump ring |
| 01/04/2005 | US6838761 Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield |
| 01/04/2005 | US6838758 Package and method for making an underfilled integrated circuit |
| 01/04/2005 | US6838757 Preplating of semiconductor small outline no-lead leadframes |
| 01/04/2005 | US6838756 Chip-packaging substrate |
| 01/04/2005 | US6838755 Leadframe for integrated circuit chips having low resistance connections |
| 01/04/2005 | US6838754 Bonding chip to lead frame frames; reducing damage; sealed package |
| 01/04/2005 | US6838753 Lead-frame strip and method of manufacturing semiconductor packages using the same |
| 01/04/2005 | US6838752 Flat platform overcoated with electrical connectors; wires connecting chips; encapsulated with thermosetting resin |
| 01/04/2005 | US6838751 Multi-row leadframe |