| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/11/2005 | US6841877 Semiconductor device, metal laminated plate for fabricating circuit on semiconductor, and method of fabricating circuit |
| 01/11/2005 | US6841875 Semiconductor device |
| 01/11/2005 | US6841874 Wafer-level chip-scale package |
| 01/11/2005 | US6841873 CSP Semiconductor device having signal and radiation bump groups |
| 01/11/2005 | US6841872 Semiconductor package and fabrication method thereof |
| 01/11/2005 | US6841871 Semiconductor device utilizing pads of different sizes connected to an antenna |
| 01/11/2005 | US6841870 Semiconductor device |
| 01/11/2005 | US6841869 Electronic package assembly |
| 01/11/2005 | US6841868 Memory modules including capacity for additional memory |
| 01/11/2005 | US6841867 Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials |
| 01/11/2005 | US6841866 Power semiconductor device |
| 01/11/2005 | US6841865 Semiconductor device having clips for connecting to external elements |
| 01/11/2005 | US6841864 Semiconductor integrated circuit device, mounting board, and device and board assembly |
| 01/11/2005 | US6841863 Ball grid array package with stacked center pad chips and method for manufacturing the same |
| 01/11/2005 | US6841862 Semiconductor package board using a metal base |
| 01/11/2005 | US6841859 Premolded cavity IC package |
| 01/11/2005 | US6841858 Leadframe for die stacking applications and related die stacking concepts |
| 01/11/2005 | US6841857 Electronic component having a semiconductor chip, system carrier, and methods for producing the electronic component and the semiconductor chip |
| 01/11/2005 | US6841855 Electronic package having a flexible substrate with ends connected to one another |
| 01/11/2005 | US6841854 Plurality of electrode terminals separated from die pad and connected to semiconductor; encapsulating resin |
| 01/11/2005 | US6841853 Semiconductor device having grooves to relieve stress between external electrodes and conductive patterns |
| 01/11/2005 | US6841852 Reduces the package electrical resistance, inductance and thermal resistance to enable the device be more efficient and dissipate more power. |
| 01/11/2005 | US6841850 Semiconductor device having silicon nitride film and silicon oxide film, and method of fabricating the same |
| 01/11/2005 | US6841849 Semiconductor device and method of manufacturing the same, circuit board and electronic instrument |
| 01/11/2005 | US6841846 Antifuse structure and a method of forming an antifuse structure |
| 01/11/2005 | US6841844 Air gaps copper interconnect structure |
| 01/11/2005 | US6841843 Semiconductor integrated circuit device |
| 01/11/2005 | US6841832 Array of gate dielectric structures to measure gate dielectric thickness and parasitic capacitance |
| 01/11/2005 | US6841815 Transimpedance amplifier assembly with separate ground leads and separate power leads for included circuits |
| 01/11/2005 | US6841796 Substrate mapping |
| 01/11/2005 | US6841740 Printed-wiring substrate and method for fabricating the same |
| 01/11/2005 | US6841736 Current-carrying electronic component and method of manufacturing same |
| 01/11/2005 | US6841733 Laser monitoring and control in a transmitter optical subassembly having a ceramic feedthrough header assembly |
| 01/11/2005 | US6841496 Containing calcium oxide; microwave frequency; dielectrics |
| 01/11/2005 | US6841495 Glass and conductive paste using the same |
| 01/11/2005 | US6841478 Method of forming a multi-layered copper bond pad for an integrated circuit |
| 01/11/2005 | US6841477 Metal interconnection, semiconductor device, method for forming metal interconnection and method for fabricating semiconductor device |
| 01/11/2005 | US6841473 Manufacturing an integrated circuit with low solubility metal-conductor interconnect cap |
| 01/11/2005 | US6841469 Semiconductor device and method of manufacturing the same |
| 01/11/2005 | US6841467 Method for producing semiconductor device |
| 01/11/2005 | US6841464 Multi-level shielded multi-conductor interconnect bus for MEMS |
| 01/11/2005 | US6841462 Method of manufacturing semiconductor chip having supporting member |
| 01/11/2005 | US6841455 Scribe street seals in semiconductor devices and method of fabrication |
| 01/11/2005 | US6841454 Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof |
| 01/11/2005 | US6841425 Wafer treatment method for protecting fuse box of semiconductor chip |
| 01/11/2005 | US6841424 Semiconductor assembly encapsulation mold and method for forming same |
| 01/11/2005 | US6841423 Methods for formation of recessed encapsulated microelectronic devices |
| 01/11/2005 | US6841422 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
| 01/11/2005 | US6841421 Method of manufacturing wiring structure of a power semiconductor device |
| 01/11/2005 | US6841418 Multi-substrate microelectronic packages and methods for manufacture |
| 01/11/2005 | US6841417 Semiconductor device and semiconductor assembly apparatus for semiconductor device |
| 01/11/2005 | US6841416 Chip scale package and method of fabricating the same |
| 01/11/2005 | US6841415 Flip chip mounting method which avoids void formation between a semiconductor chip and a substrate |
| 01/11/2005 | US6841414 Saw and etch singulation method for a chip package |
| 01/11/2005 | US6841413 Thinned die integrated circuit package |
| 01/11/2005 | US6841412 Encapsulation for particle entrapment |
| 01/11/2005 | US6841408 Method of alignment for buried structures formed by surface transformation of empty spaces in solid state materials |
| 01/11/2005 | US6841401 Integrated circuit device and correction method for integrated circuit device |
| 01/11/2005 | US6841250 Thermal management system |
| 01/11/2005 | US6840794 Apparatus and methods for cooling a processor socket |
| 01/11/2005 | US6840777 Solderless electronics packaging |
| 01/11/2005 | US6840311 Compact thermosiphon for dissipating heat generated by electronic components |
| 01/11/2005 | US6840310 Cooling device, electronic apparatus and acoustic apparatus, and method for producing the cooling device |
| 01/11/2005 | US6840308 Heat sink assembly |
| 01/11/2005 | US6840307 High performance heat exchange assembly |
| 01/11/2005 | CA2249062C Electronic device and method for fabricating the same |
| 01/06/2005 | WO2005002307A1 Cooler for electronic equipment |
| 01/06/2005 | WO2005002295A2 Circuit and method for suppression of electromagnetic coupling and switching noise in multilayer printed circuits boards |
| 01/06/2005 | WO2005002294A2 Gas-collecting unit, test head, and ic device testing apparatus |
| 01/06/2005 | WO2005002032A2 Integrated circuit devices having on-chip adaptive bandwidth buses and related methods |
| 01/06/2005 | WO2005002011A1 Communication module |
| 01/06/2005 | WO2005001946A1 Peltier element and production method therefor |
| 01/06/2005 | WO2005001943A1 Light-emitting diode thermal management system |
| 01/06/2005 | WO2005001942A1 Sensor component, and panel used for the production thereof |
| 01/06/2005 | WO2005001935A2 Integrated circuit package having stacked integrated circuits and method therefor |
| 01/06/2005 | WO2005001934A2 High-frequency package |
| 01/06/2005 | WO2005001932A1 Dielectric composite material comprising benzocyclobutene which contains a filler in order to decrease the coefficient of thermal expansion |
| 01/06/2005 | WO2005001931A1 Connection between a semiconductor housing and a base plate comprising a passage opening for fastening to a heat sink |
| 01/06/2005 | WO2005001930A1 Integrated circuit with an integrated heat sink |
| 01/06/2005 | WO2005001929A1 Structural unit comprising a tub-type housing part and casting material arranged therein |
| 01/06/2005 | WO2005001928A2 Capacitor-related systems for addressing package/motherboard resonance |
| 01/06/2005 | WO2005001927A2 Stackable integrated circuit package and method therefor |
| 01/06/2005 | WO2005001926A1 Integrated circuit and design method thereof |
| 01/06/2005 | WO2005001924A1 Semiconductor wafer having an edge based identification feature |
| 01/06/2005 | WO2005001909A2 Method for efficiently producing removable peripheral cards |
| 01/06/2005 | WO2005000568A2 Lead frame device with vented die flag |
| 01/06/2005 | WO2004105125A3 Semiconductor device, method of authentifying and system |
| 01/06/2005 | WO2004100473A9 Signal isolators using micro-transformers |
| 01/06/2005 | WO2004097935A3 Heatsink assembly |
| 01/06/2005 | WO2004097904A3 System and method of reducing die attach stress and strain |
| 01/06/2005 | WO2004096513A8 Metal-plastic composite component and methods for the production thereof |
| 01/06/2005 | WO2004095570A3 Test structure for electrically verifying the depths of trench-etchings in an soi wafer, and associated working methods |
| 01/06/2005 | WO2004095543A3 Laser trimming with phase shifters |
| 01/06/2005 | WO2004073016A3 On-carrier impedance transform network |
| 01/06/2005 | WO2004051806A3 Flip-chip device having conductive connectors |
| 01/06/2005 | WO2004041306A3 Emi shielding including a lossy medium |
| 01/06/2005 | WO2003100854A3 Electronic component module and method for the production thereof |
| 01/06/2005 | US20050005046 Integrated circuit devices having on-chip adaptive bandwidth buses and related methods |
| 01/06/2005 | US20050004323 Polyetherimide copolymer containing bisphenol a |
| 01/06/2005 | US20050004303 Electroconductive resin composition |