| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/06/2005 | US20050004298 Crosslinkable elastomer composition and molded article produced from same |
| 01/06/2005 | US20050003681 Siloxane-based resin and a semiconductor interlayer insulating film using the same |
| 01/06/2005 | US20050003678 Production method for semiconductor device |
| 01/06/2005 | US20050003660 Semiconductor device and production method therefor |
| 01/06/2005 | US20050003657 Semiconductor device having multilevel interconnections and method of manufacturing the same |
| 01/06/2005 | US20050003654 Method of producing semiconductor device |
| 01/06/2005 | US20050003651 Process of forming bonding columns |
| 01/06/2005 | US20050003649 Semiconductor device and manufacturing method thereof |
| 01/06/2005 | US20050003647 Method for producing an antifuse in a substrate and an antifuse structure for integration in a substrate |
| 01/06/2005 | US20050003607 Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages |
| 01/06/2005 | US20050003586 Manufacturing method of a semiconductor device |
| 01/06/2005 | US20050003585 Method of manufacturing an enhanced thermal dissipation integrated circuit package |
| 01/06/2005 | US20050003584 System and method for increasing the strength of a bond made by a small diameter wire in ball bonding |
| 01/06/2005 | US20050003583 Micro lead frame package and method to manufacture the micro lead frame package |
| 01/06/2005 | US20050003582 Semiconductor device and method of manufacturing the device |
| 01/06/2005 | US20050003581 Thin stacked package and manufacturing method thereof |
| 01/06/2005 | US20050003580 Stacked chip semiconductor device and method for manufacturing the same |
| 01/06/2005 | US20050003579 Imaging system |
| 01/06/2005 | US20050003577 Semiconductor package production method and semiconductor package |
| 01/06/2005 | US20050003575 Apparatus, systems and methods relating to the reconstruction of semiconductor wafers for wafer-level processing and reconstructed semiconductor wafers |
| 01/06/2005 | US20050003564 Method for determining an ESD/latch-up strength of an integrated circuit |
| 01/06/2005 | US20050003562 Integrated circuit with inductor having horizontal magnetic flux lines |
| 01/06/2005 | US20050003213 Irradiating with ultraviolet radiation; depressurization |
| 01/06/2005 | US20050003200 Impregnated composite; electronic thermal mainagement device, capacitor, batteries |
| 01/06/2005 | US20050003199 Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards |
| 01/06/2005 | US20050002846 Method and apparatus for preparing aluminum nitride |
| 01/06/2005 | US20050002608 Mount assembly, optical transmission line and photoelectric circuit board |
| 01/06/2005 | US20050002448 Method and apparatus for non-conductively interconnecting integrated circuits |
| 01/06/2005 | US20050002221 Test key and method for validating the position of a word line overlaying a trench capacitor in DRAMs |
| 01/06/2005 | US20050002167 Microelectronic package |
| 01/06/2005 | US20050002163 Apparatus for cooling of electronic components |
| 01/06/2005 | US20050002153 Semiconductor integrated circuit device, mounting board, and device and board assembly |
| 01/06/2005 | US20050002139 Electrostatic discharge clamp circuit |
| 01/06/2005 | US20050001905 Solid state image sensing device |
| 01/06/2005 | US20050001708 Dummy metal filling |
| 01/06/2005 | US20050001632 Intergrated semiconductor component for high-frequency measurement and use thereof |
| 01/06/2005 | US20050001487 Concept for compensating the influences of external disturbing quantities on physical functional parameters of integrated circuits |
| 01/06/2005 | US20050001331 Module with a built-in semiconductor and method for producing the same |
| 01/06/2005 | US20050001329 Semiconductor device and method for manufacturing the same |
| 01/06/2005 | US20050001328 Dual chips stacked packaging structure |
| 01/06/2005 | US20050001327 Semiconductor device, method for manufacturing the same, circuit substrate and electronic device |
| 01/06/2005 | US20050001326 Semiconductor device, stacked semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
| 01/06/2005 | US20050001324 Corrosion-resistant copper bond pad and integrated device |
| 01/06/2005 | US20050001323 Semiconductor device with dual damascene wiring |
| 01/06/2005 | US20050001322 Fill pattern generation for spin-on glass and related self-planarization deposition |
| 01/06/2005 | US20050001320 Semiconductor device, stacked semiconductor device, methods of manufacturing them, circuit board, and electronic instrument |
| 01/06/2005 | US20050001318 Electrical interconnection, method of forming the electrical interconnection, image sensor having the electrical interconnection and method of manufacturing the image sensor |
| 01/06/2005 | US20050001317 Polyelectrolyte nanolayers as diffusion barriers in semiconductor devices |
| 01/06/2005 | US20050001316 Corrosion-resistant bond pad and integrated device |
| 01/06/2005 | US20050001314 Semiconductor device |
| 01/06/2005 | US20050001313 Semiconductor device with under bump metallurgy and method for fabricating the same |
| 01/06/2005 | US20050001312 Chip package with grease heat sink |
| 01/06/2005 | US20050001311 [chip package structure] |
| 01/06/2005 | US20050001310 Supporting a circuit package including a substrate having a solder column array |
| 01/06/2005 | US20050001309 Printed wiring board for mounting semiconductor |
| 01/06/2005 | US20050001308 Integrated circuit carrier |
| 01/06/2005 | US20050001307 [wafer level passive component] |
| 01/06/2005 | US20050001306 Stacked type semiconductor device |
| 01/06/2005 | US20050001305 Stack package of semiconductor device |
| 01/06/2005 | US20050001304 Chip scale package and method of fabricating the same |
| 01/06/2005 | US20050001301 Semiconductor device, electronic device, electronic equipment, and method of manufacturing semiconductor device |
| 01/06/2005 | US20050001300 Semiconductor package having multiple embedded chips |
| 01/06/2005 | US20050001299 Substrate for semiconductor package wire bonding method using thereof |
| 01/06/2005 | US20050001298 Multiple chip semiconductor arrangement having electrical components in separating regions |
| 01/06/2005 | US20050001296 Ultra wideband BGA |
| 01/06/2005 | US20050001295 Adhesion enhanced semiconductor die for mold compound packaging |
| 01/06/2005 | US20050001294 Leadless leadframe package substitute and stack package |
| 01/06/2005 | US20050001293 Method for forming semiconductor device including stacked dies |
| 01/06/2005 | US20050001292 Semiconductor device and lead frame |
| 01/06/2005 | US20050001291 Semiconductor integrated circuit, D-A converter device, and A-D converter device |
| 01/06/2005 | US20050001285 Edge intensive antifuse and method for making the same |
| 01/06/2005 | US20050001278 Chip package substrate having soft circuit board and method for fabricating the same |
| 01/06/2005 | US20050001267 Semiconductor device having a damascene-type gate or a replacing-type gate and method of manufacturing the same |
| 01/06/2005 | US20050001242 Semiconductor differential interconnect |
| 01/06/2005 | US20050001241 Semi-fusible link system for a multi-layer integrated circuit and method of making same |
| 01/06/2005 | US20050001230 Light emitting diode |
| 01/06/2005 | US20050001221 Metal carrier (leadframe) for receiving and contact-connecting electrical and/or optoelectronic components |
| 01/06/2005 | US20050001219 Solid-state imaging device and method for manufacturing the same |
| 01/06/2005 | US20050001214 Micro- or nano-electronic component comprising a power source and means for protecting the power source |
| 01/06/2005 | US20050001145 Solid-state imaging device and method for manufacturing the same |
| 01/06/2005 | US20050001018 Stud bumping apparatus |
| 01/06/2005 | US20050000932 Multi-metal layer MEMS structure and process for making the same |
| 01/06/2005 | US20050000729 Multilayer wiring board for an electronic device |
| 01/06/2005 | US20050000725 Manufacturing method for a printed circuit board |
| 01/06/2005 | US20050000682 Heat dissipating fins of heat sink and manufacturing method thereof |
| 01/06/2005 | US20050000635 Method and arrangement for attaching labels to semiconductor modules |
| 01/06/2005 | US20050000634 Transfer assembly for manufacturing electronic devices |
| 01/06/2005 | US20050000559 Thermoelectric generator |
| 01/06/2005 | US20050000435 Reactor for producing reactive intermediates for low dielectric constant polymer thin films |
| 01/06/2005 | US20050000434 Reactor for producing reactive intermediates for low dielectric constant polymer thin films |
| 01/06/2005 | CA2528505A1 Dielectric composite material comprising benzocyclobutene which contains a filler in order to decrease the coefficient of thermal expansion |
| 01/05/2005 | EP1494296A1 Electroluminescent device |
| 01/05/2005 | EP1494292A2 Solid-state imaging device and method for manufacturing the same |
| 01/05/2005 | EP1494291A2 Solid-state imaging device and method for manufacturing the same |
| 01/05/2005 | EP1494285A1 Circuit module and method for manufacturing the same |
| 01/05/2005 | EP1494284A1 Overvoltage protection device |
| 01/05/2005 | EP1494283A1 A modifiable circuit, methods of use and making thereof |
| 01/05/2005 | EP1494281A2 Ultra wideband ball grid array assembly |
| 01/05/2005 | EP1494280A1 System and method for increasing the strength of a bond made by a small diameter wire in a ball bonding |
| 01/05/2005 | EP1494279A1 Cooling resilient contact device for a semiconductor chip |