| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/13/2005 | DE10334634B3 Lateral contacting method for semiconductor chip, by applying adhesive layer, pressing on particle of thermally fusible material, applying semiconductor chip and heating |
| 01/13/2005 | DE10328007A1 Strukturiertes Halbleiterelement zur Reduzierung von Chargingeffekten Structured semiconductor element to reduce Chargingeffekten |
| 01/13/2005 | DE10327126A1 Chip modules manufacturing procedure for construction of electronic equipment involves adhering cover foil, with cutouts for chip modules, onto substrate strip, and pouring in cast material |
| 01/13/2005 | DE10326507A1 Verfahren zur Herstellung eines bruchfesten scheibenförmigen Gegenstands sowie zugehörige Halbleiterschaltungsanordung A process for producing a shatter-resistant disc-shaped object and associated Halbleiterschaltungsanordung |
| 01/13/2005 | DE10325566A1 Chipkartenmodul Chip card module |
| 01/13/2005 | DE10325541A1 Elektronisches Bauteil, sowie Halbleiterwafer und Bauteilträger zur Herstellung des Bauteils Electronic component, and semiconductor wafer, and the component carrier for producing the component |
| 01/13/2005 | DE10325029A1 Substratbasiertes Chip-Package Substrate based chip package |
| 01/13/2005 | DE10297611T5 Teilchemförmiges Aluminiumoxid, Verfahren zur Herstellung von teilchenförmigem Aluminiumoxid und Zusammensetzung, die teilchenförmiges Aluminiumoxid enthält Teilchemförmiges contains alumina, process for the preparation of particulate alumina and the composition comprising particulate alumina |
| 01/13/2005 | DE10257707A1 Verfahren zum Herstellen eines gestapelten Chip-Paketes A method of manufacturing a stacked chip package |
| 01/13/2005 | DE102004029843A1 Semiconductor device, i.e. memory circuit for board on chip configuration, comprises power supply line formed over second portion of landing pads |
| 01/13/2005 | DE102004028067A1 Verfahren zum Anbringen einer Steckverbindung auf einem Substrat und Steckverbindung aufgebracht nach dem Verfahren A method of mounting a connector on a substrate and connector is applied according to the method |
| 01/13/2005 | DE102004027960A1 Elektrische Leistungs-Halbleitervorrichtung Electrical power semiconductor device |
| 01/13/2005 | DE102004027176A1 Semiconductor device manufacturing method e.g. for diode, involves performing electro-less plating of nickel on aluminum electrode, after forming insulation film on open electrode |
| 01/13/2005 | DE102004025616A1 Halbleiterbauteil mit Kühlsystem A semiconductor device comprising the cooling system |
| 01/13/2005 | DE102004017533A1 Verfahren zum Ätzen von porösem Dielektrikum A method of etching of porous dielectric |
| 01/13/2005 | DE102004012845A1 Verfahren zur Herstellung einer Halbleitervorrichtung, Halbleitervorrichtung, Schaltungssubstrat und elektronischer Apparat A process for producing a semiconductor device, semiconductor device, electronic circuit substrate and apparatus |
| 01/13/2005 | DE10157848B4 Verfahren zur Herstellung eines mikromechanischen Bauelements mit abgeschlossenem Innenraum und mikromechanisches Bauelement mit abgeschlossenem Innenraum A process for producing a micromechanical device with completed interior and micromechanical device with completed interior |
| 01/13/2005 | CA2530976A1 Method for producing nanocarbon material and method for manufacturing wiring structure |
| 01/13/2005 | CA2530351A1 Heat exchanger |
| 01/12/2005 | EP1496547A2 Multilayer sheet for backside grinding of a semiconductor wafer |
| 01/12/2005 | EP1496546A2 Heat conductive substrate press-mounted in printed circuit board hole for transferring heat from integrated circuit to heat sink |
| 01/12/2005 | EP1496542A2 Method and apparatus for forming capping film |
| 01/12/2005 | EP1496528A2 Differential capacitor, differential antenna element, and differential resonator |
| 01/12/2005 | EP1496381A2 Mount assembly, optical transmission line and photoelectric circuit board |
| 01/12/2005 | EP1496094A2 An adhesive sheet based on a siloxane-modified polyamideimide resin composition, and a CSP board and a semiconductor device produced by using the sheet |
| 01/12/2005 | EP1495501A2 Hermetic encapsulation of organic electro-optical elements |
| 01/12/2005 | EP1495493A2 Method for producing a copy protection for an electronic circuit |
| 01/12/2005 | EP1495491A2 Method for connecting substrates and composite element |
| 01/12/2005 | EP1495487A2 Support clip |
| 01/12/2005 | EP1495442A1 Method for encapsulation of a chipcard and module obtained thus |
| 01/12/2005 | EP1495366A1 Method of treatment of porous dielectric films to reduce damage during cleaning |
| 01/12/2005 | EP1495359A2 Electrochromic rearview mirror assembly incorporating a display/signal light |
| 01/12/2005 | EP1495154A1 Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby |
| 01/12/2005 | EP1495153A1 Method for coating metal surfaces and substrate having a coated metal surface |
| 01/12/2005 | EP1495105A1 Substrate and method for measuring the electrophysiological properties of cell membranes |
| 01/12/2005 | EP1494965A2 Method for producing a product having a structured surface |
| 01/12/2005 | CN2671302Y Radiating module |
| 01/12/2005 | CN2671286Y Diode circuit for protection of ESD |
| 01/12/2005 | CN2671129Y Heat-pipe radiator of heating electronic component |
| 01/12/2005 | CN2671128Y Cooling heat-pipe radiator |
| 01/12/2005 | CN2671127Y Fins of radiator |
| 01/12/2005 | CN2671126Y Radiative blades |
| 01/12/2005 | CN2671125Y 散热器结构 Radiator structure |
| 01/12/2005 | CN2671124Y Edged radiator structure |
| 01/12/2005 | CN2671123Y Metal fins |
| 01/12/2005 | CN2671122Y Fin jointing structure |
| 01/12/2005 | CN2671121Y Improved fin jointing structure |
| 01/12/2005 | CN2671120Y Assembled radiator |
| 01/12/2005 | CN2671119Y Radiator |
| 01/12/2005 | CN2671118Y Sealed base plate structure |
| 01/12/2005 | CN1565152A Thermally enhanced interposer and method |
| 01/12/2005 | CN1565151A Socket and contact of semiconductor package |
| 01/12/2005 | CN1565057A Plural semiconductor devices in monolithic flip chip |
| 01/12/2005 | CN1565056A Method of manufacturing heat conductive substrate |
| 01/12/2005 | CN1565055A Multiple die interconnect system |
| 01/12/2005 | CN1565052A Apparatus for molding a semiconductor wafer and process therefor |
| 01/12/2005 | CN1565047A Method of manufacturing semiconductor device |
| 01/12/2005 | CN1564947A Socket and contact of semiconductor package |
| 01/12/2005 | CN1564794A Thick film conductor compositions for use on aluminum nitride substrates |
| 01/12/2005 | CN1564754A Method of manufacturing an electronic component and electronic component obtained by means of said method |
| 01/12/2005 | CN1564726A Joining material and joining method |
| 01/12/2005 | CN1564721A Highly filled composites of powdered fillers and polymer matrix |
| 01/12/2005 | CN1564330A High radiation LED light emitting assembly and its mfg. method |
| 01/12/2005 | CN1564322A Curve thermotube radiator and application thereof |
| 01/12/2005 | CN1564060A LCD panel protective circuit and LCD |
| 01/12/2005 | CN1184868C Method for producing multi-layer circuit board |
| 01/12/2005 | CN1184866C Thermal management device and method of making such device |
| 01/12/2005 | CN1184687C Semiconductor device and manufacture method thereof |
| 01/12/2005 | CN1184686C Electronic package for electronic element and manufacturing method thereof |
| 01/12/2005 | CN1184685C Semconductor device and its mfg. method and electronic camera installation |
| 01/12/2005 | CN1184684C Semiconductor device and semiconductor module |
| 01/12/2005 | CN1184683C Semconductor and liquid crystal module of utilizing semiconductor |
| 01/12/2005 | CN1184680C Method forp roducing semi-conductor device |
| 01/12/2005 | CN1184678C Semicnoductor and making method, circuit substrate and electronic instrument |
| 01/12/2005 | CN1184677C Method for producing semi-conductor device |
| 01/12/2005 | CN1184670C Semiconductor device and mfg. method thereof |
| 01/12/2005 | CN1184594C Integrated circuit device which is secured against attacks resulting from controlled destruction of additional layer |
| 01/12/2005 | CN1184362C Electrochemical corrosion of high-tin solder ridge |
| 01/12/2005 | CN1184349C Formation of metal interconnection structure |
| 01/12/2005 | CN1184040C Manufacturing method of base plate material for electron device |
| 01/11/2005 | US6842885 Computer program product for defining slits in a bus on a chip |
| 01/11/2005 | US6842662 Method and apparatus for fully aligned flip-chip assembly having a variable pitch packaging substrate |
| 01/11/2005 | US6842473 Metallic container of cylindrical shape having a mechanical retainer; annular metal member with L-shaped profile inserted; retains solids, permeable to gas; telecommunications |
| 01/11/2005 | US6842347 Data processing system and associated control chip and printed circuit board |
| 01/11/2005 | US6842346 Semiconductor device |
| 01/11/2005 | US6842342 Heat sink |
| 01/11/2005 | US6842340 CPU and electronic chipset cooler |
| 01/11/2005 | US6842318 Low leakage input protection device and scheme for electrostatic discharge |
| 01/11/2005 | US6842245 Pattern test device |
| 01/11/2005 | US6842092 Apparatus and method for reducing propagation delay in a conductor |
| 01/11/2005 | US6842042 Global chip interconnect |
| 01/11/2005 | US6841890 Wafer alignment mark for image processing including rectangular patterns, image processing alignment method and method of manufacturing semiconductor device |
| 01/11/2005 | US6841888 Polyepoxide and glass particle filler; light transmittance, variable coefficient of thermal expansion; refractive index |
| 01/11/2005 | US6841887 Comprising corners spaced respectively from four corners of bottom surface, and escapes between; controller for rotating electrical machine comprising cylindrical open ended casing body |
| 01/11/2005 | US6841886 Layout structure for a flip chip semiconductor integrated circuit |
| 01/11/2005 | US6841885 High melting metal on insulator; lead-free electroless plated metal coating covering Group 1B precipitated metal |
| 01/11/2005 | US6841884 Re-distribution wirings on dielectric layer connect plurality of conductive posts to electrode pads; sealing resin for chip mounting surface |
| 01/11/2005 | US6841883 Multi-dice chip scale semiconductor components and wafer level methods of fabrication |
| 01/11/2005 | US6841882 Elastomer interposer for grid array packages and method of manufacturing the same |
| 01/11/2005 | US6841880 Semiconductor device and method of fabricating semiconductor device with high CMP uniformity and resistance to loss that occurs in dicing |