| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/13/2005 | US20050009234 Stacked module systems and methods for CSP packages |
| 01/13/2005 | US20050009219 Semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module |
| 01/13/2005 | US20050009160 Multilayer matrix for use in propagation and maintenance of cells; bioreactors |
| 01/13/2005 | US20050008979 Temperature calibration method for baking processing apparatus, adjustment method for development processing apparatus, and method of manufacturing semiconductor apparatus |
| 01/13/2005 | US20050008959 Patterning layers comprised of spin-on ceramic films |
| 01/13/2005 | US20050008874 nondeforming, low temperature fired multilayer glass laminates structures having capacitor functions |
| 01/13/2005 | US20050008873 Laminated sheet |
| 01/13/2005 | US20050008834 Hillock-free aluminum layer and method of forming the same |
| 01/13/2005 | US20050008832 Connecting microelectronic circuit |
| 01/13/2005 | US20050008824 Ceramic multilayer substrate manufacturing method and unfired composite multilayer body |
| 01/13/2005 | US20050007817 High permeability composite films to reduce noise in high speed interconnects |
| 01/13/2005 | US20050007744 IC module and IC card |
| 01/13/2005 | US20050007743 High serviceability heatsink retainer method and apparatus |
| 01/13/2005 | US20050007740 Optimised application of pcms in chillers |
| 01/13/2005 | US20050007739 Electronic apparatus having a heat-radiating unit for radiating heat of heat-generating components |
| 01/13/2005 | US20050007730 Electronic apparatus |
| 01/13/2005 | US20050007726 Ion-driven air pump device and method |
| 01/13/2005 | US20050007537 Thin film transistor array panel for a liquid crystal display |
| 01/13/2005 | US20050007139 Power semiconductor module with detector for detecting main circuit current through power semiconductor element |
| 01/13/2005 | US20050007015 Method of manufacturing laminated structure, laminated structure, display device and display unit |
| 01/13/2005 | US20050006793 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 01/13/2005 | US20050006791 Semiconductor device, manufacturing method thereof, electronic device, electronic equipment |
| 01/13/2005 | US20050006790 [bonding pad structure] |
| 01/13/2005 | US20050006789 Packaging assembly and method of assembling the same |
| 01/13/2005 | US20050006788 Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board |
| 01/13/2005 | US20050006787 Substrate-less microelectronic package |
| 01/13/2005 | US20050006786 Semiconductor device and method of fabricating the same |
| 01/13/2005 | US20050006784 Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device |
| 01/13/2005 | US20050006783 Semiconductor device and manufacturing method thereof |
| 01/13/2005 | US20050006782 Test patterns for measurement of effective vacancy diffusion area |
| 01/13/2005 | US20050006781 Semiconductor integrated circuit having reduced cross-talk noise |
| 01/13/2005 | US20050006780 Semiconductor integrated circuit having reduced cross-talk noise |
| 01/13/2005 | US20050006778 Semiconductor device having aluminum and metal electrodes and method for manufacturing the same |
| 01/13/2005 | US20050006777 Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof |
| 01/13/2005 | US20050006776 Adhesion of copper and etch stop layer for copper alloy |
| 01/13/2005 | US20050006775 Method, structure and process flow to reduce line-line capacitance with low-K material |
| 01/13/2005 | US20050006773 Semiconductor device and method for fabricating the same |
| 01/13/2005 | US20050006772 Integrated circuit having at least one metallization level |
| 01/13/2005 | US20050006771 Semiconductor device and method of fabricating the same |
| 01/13/2005 | US20050006770 Copper-low-K dual damascene interconnect with improved reliability |
| 01/13/2005 | US20050006769 Semiconductor device with metal fill by treatment of mobility layers |
| 01/13/2005 | US20050006766 Semiconductor device and method of manufacturing the same |
| 01/13/2005 | US20050006765 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 01/13/2005 | US20050006764 Semiconductor device |
| 01/13/2005 | US20050006763 Circuit substrate, semiconductor module and method of manufacturing circuit substrate |
| 01/13/2005 | US20050006762 Semiconductor device, semiconductor module, and method of manufacturing semiconductor device |
| 01/13/2005 | US20050006761 Bit line contact structure and fabrication method thereof |
| 01/13/2005 | US20050006760 Semiconductor device with improved design freedom of external terminal |
| 01/13/2005 | US20050006759 [wafer structure and bumping process thereof] |
| 01/13/2005 | US20050006758 Method for packaging electronic modules and multiple chip packaging |
| 01/13/2005 | US20050006756 Package structure compatible with cooling system |
| 01/13/2005 | US20050006754 Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking |
| 01/13/2005 | US20050006753 Semiconductor device and method of manufacturing the same, circuit board, together with electronic instrument |
| 01/13/2005 | US20050006752 Multi-layer interconnection circuit module and manufacturing method thereof |
| 01/13/2005 | US20050006751 Semiconductor device |
| 01/13/2005 | US20050006750 Integrated semiconductor power device for multiple battery systems |
| 01/13/2005 | US20050006749 Semiconductor device and method for manufacturing the same |
| 01/13/2005 | US20050006748 Multiple chip semiconductor package |
| 01/13/2005 | US20050006747 Chip mounting substrate, first level assembly, and second level assembly |
| 01/13/2005 | US20050006746 Fabrication method for stacked multi-chip package |
| 01/13/2005 | US20050006745 Stacked-type semiconductor device |
| 01/13/2005 | US20050006744 Package for semiconductor devices |
| 01/13/2005 | US20050006743 In-line apparatus and method for manufacturing double-sided stacked multi-chip packages |
| 01/13/2005 | US20050006742 High frequency semiconductor module, high frequency semiconductor device and manufacturing method for the same |
| 01/13/2005 | US20050006741 Substrate-based chip package |
| 01/13/2005 | US20050006739 Semiconductor packages for enhanced number of terminals, speed and power performance |
| 01/13/2005 | US20050006738 Structure and process for packaging rf mems and other devices |
| 01/13/2005 | US20050006737 Partially patterned lead frames and methods of making and using the same in semiconductor packaging |
| 01/13/2005 | US20050006736 Selective consolidation processes for electrically connecting contacts of semiconductor device components |
| 01/13/2005 | US20050006735 Die package |
| 01/13/2005 | US20050006734 Bonding pad for a packaged integrated circuit |
| 01/13/2005 | US20050006733 Lead frame and semiconductor device using the same |
| 01/13/2005 | US20050006732 Semiconductor package containing an integrated-circuit chip supported by electrical connection leads |
| 01/13/2005 | US20050006731 Surface mount multichip devices |
| 01/13/2005 | US20050006730 Semiconductor component and method of manufacturing same |
| 01/13/2005 | US20050006728 Semiconductor device and method of manufacturing the same |
| 01/13/2005 | US20050006727 High permeability composite films to reduce noise in high speed interconnects |
| 01/13/2005 | US20050006719 [three-dimensional memory structure and manufacturing method thereof] |
| 01/13/2005 | US20050006718 Semiconductor device |
| 01/13/2005 | US20050006712 PECVD silicon-rich oxide layer for reduced UV charging |
| 01/13/2005 | US20050006688 Arrangement comprising a capacitor |
| 01/13/2005 | US20050006681 Semiconductor memory device and method for fabricating the same |
| 01/13/2005 | US20050006672 Method of fabricating semiconductor memory device and semiconductor memory device driver |
| 01/13/2005 | US20050006669 Group III nitride based flip-chip integrated circuit and method for fabricating |
| 01/13/2005 | US20050006668 Semiconductor device package |
| 01/13/2005 | US20050006665 Carbon containing silicon oxide film having high ashing tolerance and adhesion |
| 01/13/2005 | US20050006647 Thin film circuit device, manufacturing method thereof, electro-optical apparatus, and electronic system |
| 01/13/2005 | US20050006644 Electroless deposition of doped noble metals and noble metal alloys |
| 01/13/2005 | US20050006372 Temperature regulator for microchemical chip |
| 01/13/2005 | US20050006142 Circuit board with in-built electronic component and method for manufacturing the same |
| 01/13/2005 | US20050006140 Circuit board with at least one electronic component |
| 01/13/2005 | US20050006137 Electronic device carrier adapted for transmitting high frequency signals |
| 01/13/2005 | US20050006115 Heat dissipating microdevice and method of making the same |
| 01/13/2005 | US20050006083 Temperature-homogenizing device |
| 01/13/2005 | US20050006062 Cooling unit having a plurality of heat-radiating fins, and electronic apparatus with the cooling unit |
| 01/13/2005 | US20050006061 Toroidal low-profile extrusion cooling system and method thereof |
| 01/13/2005 | US20050006055 Method and apparatus for mounting a heat transfer apparatus upon an electronic component |
| 01/13/2005 | US20050006054 Heat sink having high efficiency cooling capacity and semiconductor device comprising it |
| 01/13/2005 | US20050005623 Pumped liquid cooling system using a phase change refrigerant |
| 01/13/2005 | DE4343706B4 Hitzeempfindlicher Kondensator Heat-sensitive capacitor |