| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/18/2005 | US6844633 Mixture of polymer and filler; sealing semiconductor |
| 01/18/2005 | US6844631 Semiconductor device having a bond pad and method therefor |
| 01/18/2005 | US6844630 Semiconductor integrated circuit device and wiring arranging method thereof |
| 01/18/2005 | US6844628 Electronic device and method for manufacturing the same |
| 01/18/2005 | US6844627 Metal film semiconductor device and a method for forming the same |
| 01/18/2005 | US6844626 Bond pad scheme for Cu process |
| 01/18/2005 | US6844625 Method for producing input/output permutation of several conductive strips with parallel branches of an integrated circuit and resulting circuit |
| 01/18/2005 | US6844623 Temporary coatings for protection of microelectronic devices during packaging |
| 01/18/2005 | US6844622 Semiconductor package with heat sink |
| 01/18/2005 | US6844621 Semiconductor device and method of relaxing thermal stress |
| 01/18/2005 | US6844620 Power layout structure of main bridge chip substrate and motherboard |
| 01/18/2005 | US6844619 Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same |
| 01/18/2005 | US6844618 Microelectronic package with reduced underfill and methods for forming such packages |
| 01/18/2005 | US6844617 Packaging mold with electrostatic discharge protection |
| 01/18/2005 | US6844616 Multi-chip semiconductor package structure |
| 01/18/2005 | US6844615 Leadframe package for semiconductor devices |
| 01/18/2005 | US6844614 Semiconductor integrated circuit |
| 01/18/2005 | US6844613 Semiconductor device |
| 01/18/2005 | US6844612 Low dielectric constant fluorine-doped silica glass film for use in integrated circuit chips and method of forming the same |
| 01/18/2005 | US6844609 Antifuse with electrostatic assist |
| 01/18/2005 | US6844608 Composite of complex in matrix; dissociation under applied electricity; electroconductivity passageways |
| 01/18/2005 | US6844606 Surface-mount package for an optical sensing device and method of manufacture |
| 01/18/2005 | US6844601 Substate, nitrogen-free titanium layer, titanium nitride layer, refractory metal layer overlying the titanium nitride layer, and a silicon layer overlying the refractory metal layer |
| 01/18/2005 | US6844597 Low voltage NMOS-based electrostatic discharge clamp |
| 01/18/2005 | US6844596 Si-MOS high-frequency semiconductor device |
| 01/18/2005 | US6844593 Semiconductor device |
| 01/18/2005 | US6844575 Heterojunction bipolar transistor and method for fabricating the same |
| 01/18/2005 | US6844379 Organic component comprises long-chain cycloaliphatic epoxy resin, short-chain cycloaliphatic epoxy resin, cyanate ester, lewis acid catalyst; useful in die attach adhesives, underfills, encapsulants, via fills, prepreg binders |
| 01/18/2005 | US6844283 Zero thermal expansion material and practical component parts making use of the same |
| 01/18/2005 | US6844257 Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens |
| 01/18/2005 | US6844256 High permeability composite films to reduce noise in high speed interconnects |
| 01/18/2005 | US6844254 Semiconductor device having bonding pad electrode of multi-layer structure |
| 01/18/2005 | US6844245 Method of preparing a self-passivating Cu laser fuse |
| 01/18/2005 | US6844244 Dual sided lithographic substrate imaging |
| 01/18/2005 | US6844241 Fabrication of semiconductor structures having multiple conductive layers in an opening |
| 01/18/2005 | US6844236 Method and structure for DC and RF shielding of integrated circuits |
| 01/18/2005 | US6844221 Method of manufacturing a wire bond-less electronic component for use with an external circuit |
| 01/18/2005 | US6844220 Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component |
| 01/18/2005 | US6844219 Semiconductor device and lead frame therefor |
| 01/18/2005 | US6844218 Semiconductor wafer with grouped integrated circuit die having inter-die connections for group testing |
| 01/18/2005 | US6844217 Die support structure |
| 01/18/2005 | US6844214 Microelectromechanical system based sensors, sensor arrays, sensing systems, sensing methods and methods of fabrication |
| 01/18/2005 | US6844209 Semiconductor device having a matrix array of contacts and a fabrication process thereof |
| 01/18/2005 | US6844054 Thermal management material, devices and methods therefor |
| 01/18/2005 | US6844023 Alumina insulation for coating implantable components and other microminiature devices |
| 01/18/2005 | US6843335 Power conversion apparatus and mobile object incorporating thereof |
| 01/18/2005 | US6843310 Semi-closed air cooling type radiator |
| 01/18/2005 | US6843308 Heat exchanger device using a two-phase active fluid, and a method of manufacturing such a device |
| 01/18/2005 | US6843307 Heat pipe unit and heat pipe type heat exchanger |
| 01/18/2005 | CA2472900A1 Device with microwave integrated circuits shielded by elastic contact element(s) |
| 01/13/2005 | WO2005004571A1 Cover for cooling heat generating element, heat generating element mounter and test head |
| 01/13/2005 | WO2005004238A2 Offset dependent resistor for measuring misalignment of stitched masks |
| 01/13/2005 | WO2005004237A1 Method for interconnecting active and passive components, and a resulting thin heterogeneous component |
| 01/13/2005 | WO2005004236A1 Electronic power module comprising a rubber seal and corresponding production method |
| 01/13/2005 | WO2005004235A1 Heat exchanger |
| 01/13/2005 | WO2005004225A1 Joining method and joining device |
| 01/13/2005 | WO2005004207A2 Semi-fusible link system for a multi-layer integrated circuit and method of making same |
| 01/13/2005 | WO2005004205A2 Methods for forming patterns of a filled dielectric material on substrates |
| 01/13/2005 | WO2005004200A2 Lead frame routed chip pads for semiconductor packages |
| 01/13/2005 | WO2005004195A2 Method and apparatus for packaging integrated circuit devices |
| 01/13/2005 | WO2005004049A1 Flexible semiconductor device and identification label |
| 01/13/2005 | WO2005004045A1 Ic card and ic card manufacturing method |
| 01/13/2005 | WO2005003668A2 Microchannel heat exchangers and methods of manufacturing the same |
| 01/13/2005 | WO2005003250A2 Silicon composition which can be crosslinked into an adhesive gel |
| 01/13/2005 | WO2004105456A9 Transfer assembly for manufacturing electronic devices |
| 01/13/2005 | WO2004097898A3 Fuse and method for forming |
| 01/13/2005 | WO2004042828A3 Cooling assembly for light concentrator photovoltaic systems |
| 01/13/2005 | US20050010887 Nested voltage island architecture |
| 01/13/2005 | US20050009356 Method of manufacturing semiconductor device and method of cleaning plasma etching apparatus used therefor |
| 01/13/2005 | US20050009340 Method and apparatus for forming capping film |
| 01/13/2005 | US20050009333 Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses |
| 01/13/2005 | US20050009331 Method of forming copper wiring in semiconductor device |
| 01/13/2005 | US20050009329 Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device |
| 01/13/2005 | US20050009326 Integrated circuitry and a semiconductor processing method of forming a series of conductive lines |
| 01/13/2005 | US20050009322 Slurry for CMP, and method of manufacturing semiconductor device |
| 01/13/2005 | US20050009321 Method of forming metal line in semiconductor device |
| 01/13/2005 | US20050009320 Method of forming silicon carbide films |
| 01/13/2005 | US20050009318 Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby |
| 01/13/2005 | US20050009317 Bumping process |
| 01/13/2005 | US20050009315 Method for manufacturing micro electro-mechanical systems using solder balls |
| 01/13/2005 | US20050009314 Method for forming a bonding pad of a semiconductor device |
| 01/13/2005 | US20050009313 Manufacturing method for semiconductor device |
| 01/13/2005 | US20050009312 Gate length proximity corrected device |
| 01/13/2005 | US20050009307 Laser beam processing method and laser beam processing machine |
| 01/13/2005 | US20050009300 Electronic semiconductor device having a thermal spreader |
| 01/13/2005 | US20050009298 Method for manufacturing semiconductor device |
| 01/13/2005 | US20050009289 Aluminum cap with electroless nickel/immersion gold |
| 01/13/2005 | US20050009287 Alignment mark and method for manufacturing a semiconductor device having the same |
| 01/13/2005 | US20050009275 Method for fabricating semiconductor memory device |
| 01/13/2005 | US20050009259 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography |
| 01/13/2005 | US20050009251 Manufacturing method of semiconductor device |
| 01/13/2005 | US20050009246 Wafer bonding hermetic encapsulation |
| 01/13/2005 | US20050009245 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages |
| 01/13/2005 | US20050009244 Method for sealing semiconductor component |
| 01/13/2005 | US20050009243 Semiconductor device and method of manufacturing the same, cirucit board, and electronic instrument |
| 01/13/2005 | US20050009242 Packaging method for thin integrated circuits |
| 01/13/2005 | US20050009241 Process for producing semiconductor device and semiconductor device |
| 01/13/2005 | US20050009240 Manufacturing method of semiconductor device, manufacturing method of electronic device |
| 01/13/2005 | US20050009238 Semiconductor integrated device including support substrate fastened using resin, and manufacturing method thereof |
| 01/13/2005 | US20050009237 Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus used in it |