Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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01/19/2005 | EP1316140A4 Portable electronic device with enhanced battery life and cooling |
01/19/2005 | EP0898786B1 Method and apparatus for programming anti-fuses using internally generated programming voltage |
01/19/2005 | CN2672876Y Earth shield structure |
01/19/2005 | CN2672875Y Radiator |
01/19/2005 | CN2672874Y Stair type radiator |
01/19/2005 | CN2672873Y Phase change radiator |
01/19/2005 | CN2672872Y Heat pipe radiator |
01/19/2005 | CN2672871Y Intelligent heat pipe type semiconductor radiator for microprocessor |
01/19/2005 | CN2672870Y Embedded radiation fin |
01/19/2005 | CN2672869Y Heat radiator |
01/19/2005 | CN2672868Y Mosaic combined structure of integrated circuit radiator |
01/19/2005 | CN2672867Y Heat radiator |
01/19/2005 | CN2672866Y Heat radiator fixer |
01/19/2005 | CN2672865Y Heat radiator |
01/19/2005 | CN2672864Y Heat radiator fastener |
01/19/2005 | CN2672863Y Heat radiating module with double fan |
01/19/2005 | CN2672862Y Heat radiator |
01/19/2005 | CN2672861Y Heat radiating fin module |
01/19/2005 | CN2672860Y Heat radiating fin module |
01/19/2005 | CN2672859Y High power microelectronic product |
01/19/2005 | CN2672858Y Square flat pin-less wafer support device |
01/19/2005 | CN2672857Y Flip-chip package base plate |
01/19/2005 | CN2672856Y Chip package structure |
01/19/2005 | CN2672732Y Industrial server heat radiation structure |
01/19/2005 | CN2672713Y 散热器固定装置 Sink fixtures |
01/19/2005 | CN2672712Y 固定装置 Fixtures |
01/19/2005 | CN2672651Y Hot flow producing device |
01/19/2005 | CN1568547A Triggering of an ESD NMOS through the use of an n-type buried layer |
01/19/2005 | CN1568546A Semiconductor device and method of manufacturing the same |
01/19/2005 | CN1568545A Electronic device carrier adapted for transmitting high frequency signals |
01/19/2005 | CN1568544A High-density flip-chip interconnect |
01/19/2005 | CN1568543A Semiconductor component |
01/19/2005 | CN1568542A Thermal interface material and electronic assembly having such a thermal interface material |
01/19/2005 | CN1568541A Semiconductor device package with improved cooling |
01/19/2005 | CN1568534A Metal-insulator-metal capacitor in copper |
01/19/2005 | CN1568430A Method and apparatus for accelerated determination of electromigration characteristics of semiconductor wiring |
01/19/2005 | CN1568376A Method of depositing a material layer |
01/19/2005 | CN1568129A Circuit substrate and manufacturing method thereof |
01/19/2005 | CN1567608A Wavelength-converting casting composition and white light-emitting semiconductor component |
01/19/2005 | CN1567592A Structure for packaging image sensor |
01/19/2005 | CN1567591A Image sensor packaging structure and packaging method |
01/19/2005 | CN1567588A Sandwich antireflection structural metal layer of semiconductor and making process thereof |
01/19/2005 | CN1567587A Packaging structure of high speed memory |
01/19/2005 | CN1567586A Semiconductor package capable of improving earthing quality and lead rack thereof |
01/19/2005 | CN1567585A Semiconductor package having heat sink |
01/19/2005 | CN1567584A Semiconductor packaging element with chip planted conductive lug and making method thereof |
01/19/2005 | CN1567583A External electrode material of chip type electronic module and preparing method thereof |
01/19/2005 | CN1567582A Flip chip packaging joint structure and method for manufacturing same |
01/19/2005 | CN1567581A Circulation channel type heat conductive heat-exchange device |
01/19/2005 | CN1567580A Mini refrigeration system for computer chip heat radiating |
01/19/2005 | CN1567579A Radiating fin and fin assembly |
01/19/2005 | CN1567578A Functional module with built-in radiating fin |
01/19/2005 | CN1567577A Semiconductor package with high heat radiation performance and making method thereof |
01/19/2005 | CN1567576A Chip packaging base plate having flexible circuit board and method for manufacturing the same |
01/19/2005 | CN1567575A Double-face flip chip film |
01/19/2005 | CN1567574A Semiconductor package having heat sink |
01/19/2005 | CN1567561A Electrostatic discharge protection structure and process thereof |
01/19/2005 | CN1567554A Method for packaging electronic component |
01/19/2005 | CN1567552A Method for handling electroplating lead layout of IC packaging base plate and electroplating lead structure |
01/19/2005 | CN1567536A Metallic silicifying double-layer structure and method for forming same |
01/19/2005 | CN1567528A Wiring and its making method including the described wired semiconductor device and dry etching process |
01/19/2005 | CN1567131A Heat radiation unit for electronic component and production process thereof |
01/19/2005 | CN1567078A Wiring and its making method including the described wired semiconductor device and dry etching process |
01/19/2005 | CN1566888A Heat guiding tube manufacturing method and arrangement thereof |
01/19/2005 | CN1566710A Wind direction outlet control unit |
01/19/2005 | CN1565797A Manufacturing method of heat pipe batch |
01/19/2005 | CN1565796A Manufacturing method of localizable heat conduction pipe and tool thereof |
01/19/2005 | CN1565324A Electric cooker cooler |
01/19/2005 | CN1565322A Electric cooker printing circuit board cooling structure |
01/19/2005 | CN1185915C Flexible substrate, semiconductor device, camera device and X-ray camera system |
01/19/2005 | CN1185913C Wiring circuit board with projecture and its producing method |
01/19/2005 | CN1185716C Wiring and its making method including the described wired semiconductor device and dry etching process |
01/19/2005 | CN1185715C An integrated circuit and manufacturing method thereof |
01/19/2005 | CN1185712C Semiconductor device |
01/19/2005 | CN1185710C 半导体装置 Semiconductor device |
01/19/2005 | CN1185709C Semiconductor device and mfg. method thereof |
01/19/2005 | CN1185708C Multi-chip semiconductor device and storage card |
01/19/2005 | CN1185707C Bottom buffering metal lug structure |
01/19/2005 | CN1185706C 半导体器件 Semiconductor devices |
01/19/2005 | CN1185705C Photovoltaic element using sealed resin component |
01/19/2005 | CN1185704C Semiconductor device and method of manufacturing same |
01/19/2005 | CN1185703C Flip-chip package substrate |
01/19/2005 | CN1185702C Process for manufacturing semiconductor package and circuit board base plate |
01/19/2005 | CN1185698C Semiconductor device and manufacture method thereof, circuit board and electronic apparatus |
01/19/2005 | CN1185697C Method for installing semiconductor chip |
01/19/2005 | CN1185693C Method for forming low K value etching barrier and a semiconductor device |
01/19/2005 | CN1185499C Method and apparatus for searching conductor in conductor array with tight space |
01/19/2005 | CN1185458C Device and method for cooling heat source in high density chip carrier equipment |
01/19/2005 | CN1185290C Salt-modified electrostatic dissipative polymer composition and its use |
01/19/2005 | CN1185061C Production method of multi gauge strips |
01/18/2005 | US6845493 Electrical line end shortening quantification |
01/18/2005 | US6845491 Method of designing, fabricating, testing and interconnecting an IC to external circuit nodes |
01/18/2005 | US6845184 Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making |
01/18/2005 | US6845017 Substrate-level DC bus design to reduce module inductance |
01/18/2005 | US6845012 Coolant cooled type semiconductor device |
01/18/2005 | US6845011 Electronic apparatus having a circulation path of liquid coolant to cool a heat-generating component |
01/18/2005 | US6845010 High performance heat sink configurations for use in high density packaging applications |
01/18/2005 | US6845004 Protecting resin-encapsulated components |
01/18/2005 | US6844918 Alignment system and methods for lithographic systems using at least two wavelengths |
01/18/2005 | US6844751 Multi-state test structures and methods |