Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
01/2005
01/19/2005EP1316140A4 Portable electronic device with enhanced battery life and cooling
01/19/2005EP0898786B1 Method and apparatus for programming anti-fuses using internally generated programming voltage
01/19/2005CN2672876Y Earth shield structure
01/19/2005CN2672875Y Radiator
01/19/2005CN2672874Y Stair type radiator
01/19/2005CN2672873Y Phase change radiator
01/19/2005CN2672872Y Heat pipe radiator
01/19/2005CN2672871Y Intelligent heat pipe type semiconductor radiator for microprocessor
01/19/2005CN2672870Y Embedded radiation fin
01/19/2005CN2672869Y Heat radiator
01/19/2005CN2672868Y Mosaic combined structure of integrated circuit radiator
01/19/2005CN2672867Y Heat radiator
01/19/2005CN2672866Y Heat radiator fixer
01/19/2005CN2672865Y Heat radiator
01/19/2005CN2672864Y Heat radiator fastener
01/19/2005CN2672863Y Heat radiating module with double fan
01/19/2005CN2672862Y Heat radiator
01/19/2005CN2672861Y Heat radiating fin module
01/19/2005CN2672860Y Heat radiating fin module
01/19/2005CN2672859Y High power microelectronic product
01/19/2005CN2672858Y Square flat pin-less wafer support device
01/19/2005CN2672857Y Flip-chip package base plate
01/19/2005CN2672856Y Chip package structure
01/19/2005CN2672732Y Industrial server heat radiation structure
01/19/2005CN2672713Y 散热器固定装置 Sink fixtures
01/19/2005CN2672712Y 固定装置 Fixtures
01/19/2005CN2672651Y Hot flow producing device
01/19/2005CN1568547A Triggering of an ESD NMOS through the use of an n-type buried layer
01/19/2005CN1568546A Semiconductor device and method of manufacturing the same
01/19/2005CN1568545A Electronic device carrier adapted for transmitting high frequency signals
01/19/2005CN1568544A High-density flip-chip interconnect
01/19/2005CN1568543A Semiconductor component
01/19/2005CN1568542A Thermal interface material and electronic assembly having such a thermal interface material
01/19/2005CN1568541A Semiconductor device package with improved cooling
01/19/2005CN1568534A Metal-insulator-metal capacitor in copper
01/19/2005CN1568430A Method and apparatus for accelerated determination of electromigration characteristics of semiconductor wiring
01/19/2005CN1568376A Method of depositing a material layer
01/19/2005CN1568129A Circuit substrate and manufacturing method thereof
01/19/2005CN1567608A Wavelength-converting casting composition and white light-emitting semiconductor component
01/19/2005CN1567592A Structure for packaging image sensor
01/19/2005CN1567591A Image sensor packaging structure and packaging method
01/19/2005CN1567588A Sandwich antireflection structural metal layer of semiconductor and making process thereof
01/19/2005CN1567587A Packaging structure of high speed memory
01/19/2005CN1567586A Semiconductor package capable of improving earthing quality and lead rack thereof
01/19/2005CN1567585A Semiconductor package having heat sink
01/19/2005CN1567584A Semiconductor packaging element with chip planted conductive lug and making method thereof
01/19/2005CN1567583A External electrode material of chip type electronic module and preparing method thereof
01/19/2005CN1567582A Flip chip packaging joint structure and method for manufacturing same
01/19/2005CN1567581A Circulation channel type heat conductive heat-exchange device
01/19/2005CN1567580A Mini refrigeration system for computer chip heat radiating
01/19/2005CN1567579A Radiating fin and fin assembly
01/19/2005CN1567578A Functional module with built-in radiating fin
01/19/2005CN1567577A Semiconductor package with high heat radiation performance and making method thereof
01/19/2005CN1567576A Chip packaging base plate having flexible circuit board and method for manufacturing the same
01/19/2005CN1567575A Double-face flip chip film
01/19/2005CN1567574A Semiconductor package having heat sink
01/19/2005CN1567561A Electrostatic discharge protection structure and process thereof
01/19/2005CN1567554A Method for packaging electronic component
01/19/2005CN1567552A Method for handling electroplating lead layout of IC packaging base plate and electroplating lead structure
01/19/2005CN1567536A Metallic silicifying double-layer structure and method for forming same
01/19/2005CN1567528A Wiring and its making method including the described wired semiconductor device and dry etching process
01/19/2005CN1567131A Heat radiation unit for electronic component and production process thereof
01/19/2005CN1567078A Wiring and its making method including the described wired semiconductor device and dry etching process
01/19/2005CN1566888A Heat guiding tube manufacturing method and arrangement thereof
01/19/2005CN1566710A Wind direction outlet control unit
01/19/2005CN1565797A Manufacturing method of heat pipe batch
01/19/2005CN1565796A Manufacturing method of localizable heat conduction pipe and tool thereof
01/19/2005CN1565324A Electric cooker cooler
01/19/2005CN1565322A Electric cooker printing circuit board cooling structure
01/19/2005CN1185915C Flexible substrate, semiconductor device, camera device and X-ray camera system
01/19/2005CN1185913C Wiring circuit board with projecture and its producing method
01/19/2005CN1185716C Wiring and its making method including the described wired semiconductor device and dry etching process
01/19/2005CN1185715C An integrated circuit and manufacturing method thereof
01/19/2005CN1185712C Semiconductor device
01/19/2005CN1185710C 半导体装置 Semiconductor device
01/19/2005CN1185709C Semiconductor device and mfg. method thereof
01/19/2005CN1185708C Multi-chip semiconductor device and storage card
01/19/2005CN1185707C Bottom buffering metal lug structure
01/19/2005CN1185706C 半导体器件 Semiconductor devices
01/19/2005CN1185705C Photovoltaic element using sealed resin component
01/19/2005CN1185704C Semiconductor device and method of manufacturing same
01/19/2005CN1185703C Flip-chip package substrate
01/19/2005CN1185702C Process for manufacturing semiconductor package and circuit board base plate
01/19/2005CN1185698C Semiconductor device and manufacture method thereof, circuit board and electronic apparatus
01/19/2005CN1185697C Method for installing semiconductor chip
01/19/2005CN1185693C Method for forming low K value etching barrier and a semiconductor device
01/19/2005CN1185499C Method and apparatus for searching conductor in conductor array with tight space
01/19/2005CN1185458C Device and method for cooling heat source in high density chip carrier equipment
01/19/2005CN1185290C Salt-modified electrostatic dissipative polymer composition and its use
01/19/2005CN1185061C Production method of multi gauge strips
01/18/2005US6845493 Electrical line end shortening quantification
01/18/2005US6845491 Method of designing, fabricating, testing and interconnecting an IC to external circuit nodes
01/18/2005US6845184 Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making
01/18/2005US6845017 Substrate-level DC bus design to reduce module inductance
01/18/2005US6845012 Coolant cooled type semiconductor device
01/18/2005US6845011 Electronic apparatus having a circulation path of liquid coolant to cool a heat-generating component
01/18/2005US6845010 High performance heat sink configurations for use in high density packaging applications
01/18/2005US6845004 Protecting resin-encapsulated components
01/18/2005US6844918 Alignment system and methods for lithographic systems using at least two wavelengths
01/18/2005US6844751 Multi-state test structures and methods