| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/20/2005 | US20050012556 Method and apparatus for determining characteristics of MOS devices |
| 01/20/2005 | US20050012228 Thin-film semiconductor substrate, method of manufacturing thin-film semiconductor substrate, method of crystallization, apparatus for crystallization, thin-film semiconductor device, and method of manufacturing thin-film semiconductor device |
| 01/20/2005 | US20050012227 Semiconductor assembly encapsulation mold and method for forming same |
| 01/20/2005 | US20050012226 Chip package structure |
| 01/20/2005 | US20050012225 Wafer-level chip scale package and method for fabricating and using the same |
| 01/20/2005 | US20050012224 Semiconductor device, semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module |
| 01/20/2005 | US20050012222 [chip structure] |
| 01/20/2005 | US20050012221 Semiconductor interconnect having conductive spring contacts, method of fabrication, and test systems incorporating the interconnect |
| 01/20/2005 | US20050012220 Contacts for an improved high-density nonvolatile memory |
| 01/20/2005 | US20050012219 Air gap integration |
| 01/20/2005 | US20050012218 [semiconductor device and fabricating method thereof] |
| 01/20/2005 | US20050012217 Multilayer wiring board and manufacture method thereof |
| 01/20/2005 | US20050012216 Solder interface locking using unidirectional growth of an intermetallic compound |
| 01/20/2005 | US20050012215 Semiconductor arrangement |
| 01/20/2005 | US20050012214 Semiconductor device and manufacturing method thereof |
| 01/20/2005 | US20050012213 Wiring board, stacked wiring board and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 01/20/2005 | US20050012212 Reconnectable chip interface and chip package |
| 01/20/2005 | US20050012211 Under-bump metallugical structure |
| 01/20/2005 | US20050012210 Semiconductor device |
| 01/20/2005 | US20050012209 Semiconductor wafer, semiconductor device and method for manufacturing same, circuit board, and electronic apparatus |
| 01/20/2005 | US20050012208 Method of surface-mounting semiconductor chip on PCB |
| 01/20/2005 | US20050012207 Substrate structure for an integrated circuit package and method for manufacturing the same |
| 01/20/2005 | US20050012206 Semiconductor unit with cooling system |
| 01/20/2005 | US20050012205 Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices |
| 01/20/2005 | US20050012204 High efficiency semiconductor cooling device |
| 01/20/2005 | US20050012203 Enhanced die-down ball grid array and method for making the same |
| 01/20/2005 | US20050012202 Heat sink for semiconductor components or similar devices, method for producing the same and tool for carrying out said method |
| 01/20/2005 | US20050012201 Method and system for using ion implantation for treating a low-k dielectric film |
| 01/20/2005 | US20050012198 Semiconductor device |
| 01/20/2005 | US20050012197 Fluidic MEMS device |
| 01/20/2005 | US20050012195 BGA package with stacked semiconductor chips and method of manufacturing the same |
| 01/20/2005 | US20050012194 Electronic package having a folded package substrate |
| 01/20/2005 | US20050012193 Cutting method and method of manufacturing semiconductor device |
| 01/20/2005 | US20050012192 Hybrid integrated circuit |
| 01/20/2005 | US20050012191 Reconnectable chip interface and chip package |
| 01/20/2005 | US20050012189 Integrated circuit package with a balanced-part structure |
| 01/20/2005 | US20050012188 Device for the hermetic encapsulation of a component that must be protected against all stresses |
| 01/20/2005 | US20050012187 Semiconductor device and its manufacturing method |
| 01/20/2005 | US20050012186 Lead for integrated circuit package |
| 01/20/2005 | US20050012185 Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths |
| 01/20/2005 | US20050012184 Semiconductor packaging structure |
| 01/20/2005 | US20050012183 Dual gauge leadframe |
| 01/20/2005 | US20050012177 Oversized integrated circuit component |
| 01/20/2005 | US20050012171 Semiconductor device and method of fabricating the same |
| 01/20/2005 | US20050012169 Semiconductor device and manufacturing method of the same |
| 01/20/2005 | US20050012165 Semiconductor device |
| 01/20/2005 | US20050012155 Turn-on-efficient bipolar structures with deep N-well for on-chip ESD protection |
| 01/20/2005 | US20050012154 Method for making high density nonvolatile memory |
| 01/20/2005 | US20050012153 Semiconductor device |
| 01/20/2005 | US20050012148 Transistor with improved safe operating area |
| 01/20/2005 | US20050012144 Semiconductor device |
| 01/20/2005 | US20050012126 Hydrogen barrier for protecting ferroelectric capacitors in a semiconductor device and methods for fabricating the same |
| 01/20/2005 | US20050012123 Semiconductor device having a flip-chip construction |
| 01/20/2005 | US20050012122 Semiconductor device and manufacturing method thereof |
| 01/20/2005 | US20050012120 Method for making high density nonvolatile memory |
| 01/20/2005 | US20050012119 Method for making high density nonvolatile memory |
| 01/20/2005 | US20050012118 Flange for integrated circuit package |
| 01/20/2005 | US20050012117 Power MOSFET, power MOSFET packaged device, and method of manufacturing power MOSFET |
| 01/20/2005 | US20050012112 Semiconductor device wiring structure |
| 01/20/2005 | US20050012098 Thin film transistor formed on a transparent substrate |
| 01/20/2005 | US20050012080 Thermoplastic material |
| 01/20/2005 | US20050012047 Detector module |
| 01/20/2005 | US20050012032 Camera module for compact electronic equipments |
| 01/20/2005 | US20050011674 Via and via landing structures for smoothing transitions in multi-layer substrates |
| 01/20/2005 | US20050011668 Thin printed circuit board for manufacturing chip scale package |
| 01/20/2005 | US20050011656 Packaging of semiconductor devices for increased reliability |
| 01/20/2005 | US20050011635 Cold plate with vortex generator |
| 01/20/2005 | US20050011634 Heat dissipation device |
| 01/20/2005 | US20050011633 Tower heat sink with sintered grooved wick |
| 01/20/2005 | US20050011212 Device for cooling housing, areas. components, media and the like |
| 01/20/2005 | DE202004016257U1 Lufthutzenkühler Lufthutzenkühler |
| 01/20/2005 | DE19845821B4 Stromrichtereinheit in Modulbauweise, insbesondere für Schienenfahrzeuge Converter unit of modular construction, in particular for rail vehicles |
| 01/20/2005 | DE19758547B4 Ball grid array for semiconductor component - has substrate plate dimensions forming multiple of dimensions of individual substrate parts |
| 01/20/2005 | DE10332312B3 Integrated semiconductor circuit with electrically-programmable switch element using positive and negative programming voltages respectively applied to counter-electrode and substrate electrode |
| 01/20/2005 | DE10329575A1 Baueinheit mit einem wannenförmigen Gehäuseteil und mit einem darin befindlichen Vergusswerkstoff Structural unit with a trough-shaped housing part and having therein a casting material |
| 01/20/2005 | DE10327530A1 Vorrichtung mit wenigstens einer von einem zu kühlenden Funktionselement gebildeten Wärmequelle, mit wenigstens einer Wärmesenke und mit wenigstens einer Zwischenlage aus einer thermischen leitenden Masse zwischen der Wärmequelle und der Wärmesenke sowie thermische leitende Masse, insbesondere zur Verwendung bei einer solchen Vorrichtung Device with at least one formed by a to be cooled functional element heat source, with at least one heat sink and at least one intermediate layer of a thermal conductive ground between the heat source and the heat sink and thermal conductive ground, particularly for use in such a device |
| 01/20/2005 | DE10327515A1 Substratbasiertes IC-Package Substrate-based IC package |
| 01/20/2005 | DE10326458A1 Kühlkörper zur Wärmeableitung für elektronische Bauelemente Heat sink for heat dissipation for electronic components |
| 01/20/2005 | DE10323378B3 Test mark arrangement for detection of alignment and measuring mark structures in lithographic structuring of substrate for integrated circuit manufacture using 5 parallel rows of differing test mark elements |
| 01/20/2005 | DE10211831B4 Schaltungsanordnung und Verfahren zur Überwachung von Leistungshalbleiterbauelementen Circuit arrangement and method for monitoring power semiconductor components |
| 01/20/2005 | DE102004030056A1 Ausgeformte Halbleitervorrichtung und Verfahren zur Herstellung derselben Molded semiconductor device and method of manufacturing the same |
| 01/20/2005 | DE10102434B4 Kühlkörper mit innenliegendem Lüfter Heatsink with internal fan |
| 01/19/2005 | EP1498959A2 Manufacturing method of a semiconductor device |
| 01/19/2005 | EP1498951A2 Semiconductor device with integrated overtemperature protection |
| 01/19/2005 | EP1498950A1 Microwave hybrid circuit device with resilient contact shielding elements |
| 01/19/2005 | EP1498949A2 Module with tailored interconnections between integrated circuit chips |
| 01/19/2005 | EP1498948A2 A reconnectable chip interface and chip package |
| 01/19/2005 | EP1498947A2 Electronic circuit with a power semiconductor device and a protection device protecting the power semiconductor device of overheating |
| 01/19/2005 | EP1498946A1 Circuit board, process for producing the same and power module |
| 01/19/2005 | EP1498842A1 Communication device and package thereof |
| 01/19/2005 | EP1498443A1 Siloxane-based resin containing germanium and interlayer insulating film for semiconductor device using the same |
| 01/19/2005 | EP1498385A2 Fluidic MEMS device |
| 01/19/2005 | EP1498244A1 Method for producing a semiconductor-molding tablet, a semiconductor-molding tablet obtained thereby and a semiconductor device using the same |
| 01/19/2005 | EP1498015A1 Power converter module |
| 01/19/2005 | EP1497869A2 Semiconductor component comprising an integrated capacitor structure that has a plurality of metallization planes |
| 01/19/2005 | EP1497865A2 Electrical contacts for flexible displays |
| 01/19/2005 | EP1497864A2 Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device |
| 01/19/2005 | EP1497863A2 Authentication of integrated circuits |
| 01/19/2005 | EP1497862A1 Semiconductor component comprising an integrated latticed capacitance structure |
| 01/19/2005 | EP1497861A1 Semiconductor component having an integrated capacitance structure and method for producing the same |