Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2014
03/12/2014EP2705530A1 Heat spreader for electrical components
03/12/2014CN203482479U Electrostatic leakage circuit of static electricity generation body
03/12/2014CN203481231U TFT array substrate and display equipment
03/12/2014CN203481226U Large power crimping type IGBT device
03/12/2014CN203481225U Electric leakage monitoring structure
03/12/2014CN203481224U Reference chip structure on wafer
03/12/2014CN203481223U Semiconductor device
03/12/2014CN203481222U Framework CSP package based on chips of different sizes and adopting ball mounting optimization technology
03/12/2014CN203481221U Framework CSP package adopting ball mounting optimization technology
03/12/2014CN203481220U Connecting structure
03/12/2014CN203481219U Module packaging framework for power device
03/12/2014CN203481218U Intelligent power module
03/12/2014CN203481217U Chip structure on wafer
03/12/2014CN203481216U Three-phase full-bridge fast-recovery rectifier module
03/12/2014CN203481215U Chip-type electronic part
03/12/2014CN203481214U An electronic device module
03/12/2014CN203481213U Packaging member based on framework connected through bonding wires
03/12/2014CN203481212U Cooler and semiconductor module
03/12/2014CN203481211U Spiral radiator
03/12/2014CN203481210U Flat packaging piece employing dispensing technology based on framework
03/12/2014CN203481209U Wafer-level packaging structure of image sensor
03/12/2014CN203481208U Novel ceramic-shell diode
03/12/2014CN203481192U Semiconductor device
03/12/2014CN203481191U Frame-based AAQFN package adopting pre-plastic-package optimization technology
03/12/2014CN203478680U Chilling plate structure of refrigerating equipment
03/12/2014CN103636014A High heat-radiant optical device substrate and manufacturing method thereof
03/12/2014CN103636013A Light-emitting device
03/12/2014CN103635999A Semiconductor device
03/12/2014CN103635998A Power semiconductor housing with contact mechanism
03/12/2014CN103635997A Method for producing structured sintering connection layers and semiconductor component comprising a structured sintering connection layer
03/12/2014CN103635996A Bumpless build-up layer package warpage reduction
03/12/2014CN103635993A Interposer having molded low CTE dielectric
03/12/2014CN103634504A Camera module
03/12/2014CN103633105A Semiconductor device and electronic device
03/12/2014CN103633101A Array structure, manufacture method of array structure, array substrate and display device
03/12/2014CN103633095A One-bit memory cell for nonvolatile memory and associated controlling method
03/12/2014CN103633078A Press fitting device for flat power semiconductor devices
03/12/2014CN103633077A Power module
03/12/2014CN103633076A Chip type package on encapsulating piece
03/12/2014CN103633075A Package-on-package semiconductor device
03/12/2014CN103633074A Packaging structure for million sets of encoding transmitting chips
03/12/2014CN103633073A Detachable SiP (system in package) structure capable of being assembled
03/12/2014CN103633072A Resistance structure, integrated circuit, and method of fabricating resistance structure
03/12/2014CN103633071A ESD (Electro-Static Discharge) protection circuit
03/12/2014CN103633070A Electrostatic discharge protection device and method for manufacturing the same
03/12/2014CN103633069A Package structure and electronic apparatus
03/12/2014CN103633068A Flexible crss adjustment in a sgt mosfet to smooth waveforms and to avoid emi in dc-dc application
03/12/2014CN103633067A Crossed annular aligning mark based on TSV (through silicon via) three-dimensional integration process
03/12/2014CN103633066A A double layer fuse and a manufacturing method thereof
03/12/2014CN103633065A Electric fuse and programming method of electric fuse
03/12/2014CN103633064A Electrically programmable metal fuse device structure
03/12/2014CN103633063A Semiconductor device, integrated circuit and manufacturing method thereof
03/12/2014CN103633062A Compound semiconductor integrated circuit
03/12/2014CN103633061A Device with integrated power supply
03/12/2014CN103633060A Wiring board with embedded device and electromagnetic shielding
03/12/2014CN103633059A Semiconductor package and method of manufacturing the same
03/12/2014CN103633058A Packaging assembly and manufacturing method thereof
03/12/2014CN103633057A TO-220HF waterproof sealing lead frame
03/12/2014CN103633056A Lead frame, packaging subassembly and manufacturing method for lead frame and packaging subassembly
03/12/2014CN103633055A Plastic package lead frame provided with U-shaped grooves
03/12/2014CN103633054A Forward series-connection diode frame structure
03/12/2014CN103633053A Intelligent power module and manufacturing method thereof
03/12/2014CN103633052A Electronic assembly with three dimensional inkjet printed traces
03/12/2014CN103633051A Laminated chip wafer-level copper bump packaging structure
03/12/2014CN103633050A Chip, chip packaging structure and chip welding method
03/12/2014CN103633049A Flip-chip package
03/12/2014CN103633048A Three-dimensional memory (3D-M) with reading/writing voltage generator chip
03/12/2014CN103633047A Electronic device
03/12/2014CN103633046A Semiconductor device and manufacturing method thereof
03/12/2014CN103633045A TSV (through silicon via) high-frequency three-dimensional integrated interconnection structure based on SOI (silicon on insulator)
03/12/2014CN103633044A Semiconductor device
03/12/2014CN103633043A Three-dimensional semiconductor device
03/12/2014CN103633042A Semiconductor device package and methods of packaging thereof
03/12/2014CN103633041A Semiconductor device and method for fabricating the same
03/12/2014CN103633040A Semiconductor device
03/12/2014CN103633039A Semiconductor heat radiation structure and formation method thereof and semiconductor chip
03/12/2014CN103633038A Packaging structure and forming method thereof
03/12/2014CN103633037A Encapsulation structure and manufacturing method thereof
03/12/2014CN103633036A Electric field sensor packaging element based on high-resistance material
03/12/2014CN103633035A IGBT (insulated gate bipolar transistor) modular structure
03/12/2014CN103633034A Image sensor module and image capture module
03/12/2014CN103633033A Image sensor module and image capture module
03/12/2014CN103633020A Semiconductor device and method of forming rdl using uv-cured conductive ink over wafer level package
03/12/2014CN103633019A Multi-level vertical plug formation with stop layers of increasing thicknesses
03/12/2014CN103633016A Semiconductor structure and manufacture method thereof
03/12/2014CN103633013A Method of forming through-silicon-via package structure
03/12/2014CN103632990A Method for fusing a laser fuse and method for processing a wafer
03/12/2014CN103632988A Stacked encapsulation structure and manufacturing method thereof
03/12/2014CN103632985A Method for manufacturing a metal pad structure of a die, a die arrangement and a chip arrangement
03/12/2014CN103632982A Wiring board and manufacturing method of wiring board
03/12/2014CN103632981A Wiring board and manufacturing method of wiring board
03/12/2014CN103632979A Chip packaging substrate and structure, and manufacturing methods thereof
03/12/2014CN103630825A Chip test circuit and formation method thereof
03/12/2014CN103630802A TSV (through silicon via) through hole insulation layer test structure based on SOI (silicon on insulator) substrate
03/12/2014CN103629963A Multi-scale capillary core flat plate loop heat pipe type heat-dissipation device
03/12/2014CN102593095B Flexible display panel
03/12/2014CN102569250B High-density capacitor and electrode leading-out method thereof
03/12/2014CN102543717B Semiconductor device
03/12/2014CN102522379B High-current transistor packaging structure and manufacturing method thereof
03/12/2014CN102487057B Metal front dielectric layer and preparation method thereof
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