| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/25/2005 | US6847109 Area array semiconductor package and 3-dimensional stack thereof |
| 01/25/2005 | US6847108 Semiconductor integrated circuit |
| 01/25/2005 | US6847107 Image forming apparatus with improved transfer efficiency |
| 01/25/2005 | US6847106 Semiconductor circuit with mechanically attached lid |
| 01/25/2005 | US6847105 Bumping technology in stacked die configurations |
| 01/25/2005 | US6847104 Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the same |
| 01/25/2005 | US6847103 Semiconductor package with exposed die pad and body-locking leadframe |
| 01/25/2005 | US6847102 Low profile semiconductor device having improved heat dissipation |
| 01/25/2005 | US6847101 Sloping edge and conductive terminals over the top surfaces |
| 01/25/2005 | US6847100 High speed IC package configuration |
| 01/25/2005 | US6847099 Offset etched corner leads for semiconductor package |
| 01/25/2005 | US6847096 Semiconductor wafer having discharge structure to substrate |
| 01/25/2005 | US6847082 Semiconductor integrated device including an electrostatic breakdown protection circuit having uniform electrostatic surge response |
| 01/25/2005 | US6847077 Capacitor for a semiconductor device and method for fabrication therefor |
| 01/25/2005 | US6847067 A-C:H ISFET device, manufacturing method, and testing methods and apparatus thereof |
| 01/25/2005 | US6847066 Semiconductor device |
| 01/25/2005 | US6847065 Radiation-hardened transistor fabricated by modified CMOS process |
| 01/25/2005 | US6847010 Methods and circuits for measuring the thermal resistance of a packaged IC |
| 01/25/2005 | US6846987 Power electronics component |
| 01/25/2005 | US6846765 Silicon nitride powder, silicon nitride sintered body, sintered silicon nitride substrate, and circuit board and thermoelectric module comprising such sintered silicon nitride substrate |
| 01/25/2005 | US6846743 Method for vapor deposition of a metal compound film |
| 01/25/2005 | US6846738 High permeability composite films to reduce noise in high speed interconnects |
| 01/25/2005 | US6846737 Plasma induced depletion of fluorine from surfaces of fluorinated low-k dielectric materials |
| 01/25/2005 | US6846736 Creation of subresolution features via flow characteristics |
| 01/25/2005 | US6846733 Stacked capacitor-type semiconductor storage device and manufacturing method thereof |
| 01/25/2005 | US6846717 Semiconductor device having a wire bond pad and method therefor |
| 01/25/2005 | US6846704 Semiconductor package and method for manufacturing the same |
| 01/25/2005 | US6846703 Three-dimensional device |
| 01/25/2005 | US6846701 Traceless flip chip assembly and method |
| 01/25/2005 | US6846700 Method of fabricating microelectronic connections using masses of fusible material |
| 01/25/2005 | US6846699 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument |
| 01/25/2005 | US6846697 Integrated circuit packages and the method for making the same |
| 01/25/2005 | US6846694 Semiconductor device with built-in light receiving element, production method thereof, and optical pickup incorporating the same |
| 01/25/2005 | US6846682 Chemically synthesized and assembled electronic devices |
| 01/25/2005 | US6846550 Heat resistant sealing resin between wire circuit and semiconductor |
| 01/25/2005 | US6846193 Socket |
| 01/25/2005 | US6846117 Optical module package |
| 01/25/2005 | US6846112 Optical transmitter-receiver module, method of manufacturing the module, and electronic device using the module |
| 01/25/2005 | US6845898 Bondhead lead clamp apparatus |
| 01/25/2005 | US6845812 Heatsink with multiple, selectable fin densities |
| 01/25/2005 | US6845661 Lead frame for automotive electronics |
| 01/25/2005 | US6845557 Method for producing an electronic package possessing controlled impedance characteristics |
| 01/25/2005 | CA2380126C Wire bonding surface |
| 01/20/2005 | WO2005006556A2 Integrated circuit with interface tile for coupling to a stacked -die second integrated circuit |
| 01/20/2005 | WO2005006458A2 Test structures and methods |
| 01/20/2005 | WO2005006441A1 Encapsulation structure for display devices |
| 01/20/2005 | WO2005006438A1 Microelectronic package method and apparatus |
| 01/20/2005 | WO2005006437A1 Security-sensitive semiconductor product, particularly a smart-card chip |
| 01/20/2005 | WO2005006436A1 Integrated coolant circuit arrangement, operating method and production method |
| 01/20/2005 | WO2005006435A1 Heat sink |
| 01/20/2005 | WO2005006434A1 Information processing device functional part |
| 01/20/2005 | WO2005006433A2 Mold compound cap in a flip chip multi-matrix array package and process of making same |
| 01/20/2005 | WO2005006428A1 Underfill and mold compounds including siloxane-based aromatic diamines |
| 01/20/2005 | WO2005006427A1 Method for passivating semiconductor devices |
| 01/20/2005 | WO2005006403A2 Thermal paste for improving thermal contacts |
| 01/20/2005 | WO2005006395A2 Heat transfer device and method of making same |
| 01/20/2005 | WO2005006362A2 Methods for the control of flatness and electron mobility of diamond coated silicon and structures formed thereby |
| 01/20/2005 | WO2005006361A2 Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same |
| 01/20/2005 | WO2005006160A1 Electronic device cooling control method, cooling control circuit, electronic device, and program thereof |
| 01/20/2005 | WO2005005903A2 Brazed wick for a heat transfer device and method of making same |
| 01/20/2005 | WO2005005142A1 Conductive sheet having more than one through hole or via hole |
| 01/20/2005 | WO2004090980A3 Overlay metrology mark |
| 01/20/2005 | WO2004090978A3 Overlay metrology mark |
| 01/20/2005 | WO2004090976A3 Optical communication between face-to-face semiconductor chips |
| 01/20/2005 | WO2004086827A3 Thermal apparatus for engaging electronic device |
| 01/20/2005 | WO2004064151A3 Electronic device and method of manufacturing a substrate |
| 01/20/2005 | WO2004036643A3 Device |
| 01/20/2005 | WO2003100859A3 Method for producing a component comprising a conductor structure that is suitable for use at high frequencies and corresponding component |
| 01/20/2005 | US20050015651 Self-timed reliability and yield vehicle with gated data and clock |
| 01/20/2005 | US20050014397 Tailored interconnect module |
| 01/20/2005 | US20050014381 Method of forming metal line layer in semiconductor device |
| 01/20/2005 | US20050014363 Method of forming metal line layer in semiconductor device |
| 01/20/2005 | US20050014359 Semiconductor device manufacturing method |
| 01/20/2005 | US20050014356 Method for forming a bond pad interface |
| 01/20/2005 | US20050014355 Under-bump metallization layers and electroplated solder bumping technology for flip-chip |
| 01/20/2005 | US20050014348 Method of making a semiconductor device having an opening in a solder mask |
| 01/20/2005 | US20050014334 Method for making high density nonvolatile memory |
| 01/20/2005 | US20050014328 Electrical contact for high dielectric constant capacitors and method for fabricating the same |
| 01/20/2005 | US20050014327 Sequential unique marking |
| 01/20/2005 | US20050014322 Method for making high density nonvolatile memory |
| 01/20/2005 | US20050014317 Method for forming inductor in semiconductor device |
| 01/20/2005 | US20050014312 Wafer applied thermally conductive interposer |
| 01/20/2005 | US20050014311 Multichip semiconductor device, chip therefor and method of formation thereof |
| 01/20/2005 | US20050014310 Stencil mask design method and under bump metallurgy for C4 solder bump |
| 01/20/2005 | US20050014309 Method for producing an integrated circuit with a rewiring device and corresponding integrated circuit |
| 01/20/2005 | US20050014307 Manufacturing method of a semiconductor device |
| 01/20/2005 | US20050014009 Siloxane-based resin containing germanium and an interlayer insulating film for a semiconductor device using the same |
| 01/20/2005 | US20050013989 Coating aluminum nitride sheet with tungsten powder; forming holes; filling holes with tungsten powder; sintering |
| 01/20/2005 | US20050013562 Optical component and manufacture method of the same |
| 01/20/2005 | US20050013124 Area array package with low inductance connecting device |
| 01/20/2005 | US20050013121 Heat dissipation device including wire clips |
| 01/20/2005 | US20050013120 Configurable heat sink with matrix clipping system |
| 01/20/2005 | US20050013119 Thermal diffusion apparatus |
| 01/20/2005 | US20050013118 Cooling body and rectifier module for an electrical machine |
| 01/20/2005 | US20050013117 Chassis conducted cooling thermal dissipation apparatus for servers |
| 01/20/2005 | US20050013088 Capacitor device and method of manufacturing the same |
| 01/20/2005 | US20050013073 Protection circuit for electro static discharge |
| 01/20/2005 | US20050012587 Fuse structure |
| 01/20/2005 | US20050012574 Device with hybrid microwave circuits shielded by elastic contact members |
| 01/20/2005 | US20050012566 High-frequency layered part and manufacturing method thereof |