| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/27/2005 | DE19800474B4 Leiterrahmen und Halbleiterbaustein Lead frame and semiconductor device |
| 01/27/2005 | DE10338024B3 Raster electron microscope process to monitor the presence of corrosive substances present in the vicinity of semiconductor manufacture |
| 01/27/2005 | DE10333328B3 Leistungshalbleitermodul in skalierbarer Aufbautechnik Power semiconductor module in a scalable design technology |
| 01/27/2005 | DE10329267A1 Circuit carrier arrangement for carrying an electronic circuit, has heat conducting body extending between upper and lower surfaces of circuit carrier and flush with upper and lower surfaces |
| 01/27/2005 | DE10329102A1 Halbleitermodul Semiconductor module |
| 01/27/2005 | DE10329101A1 Semiconductor components containing substrate and power semiconductor chip with source terminal fitted on substrate with rear contacting, while source terminal and forwarding conductor |
| 01/27/2005 | DE10328265A1 Sensorbauteil und Nutzen zu seiner Herstellung Sensor component and benefits for its preparation |
| 01/27/2005 | DE10297642T5 Verfahren und Vorrichtung zum Steuern der Höhe der Chiphalterandnaht, um Chipscherungsbelastungen zu reduzieren Method and apparatus for controlling the height of the chip holding edge seam to reduce Chipscherungsbelastungen |
| 01/27/2005 | DE102004031954A1 Semiconductor package for use in electronic product, has substrate including inner lands connected to pads of semiconductor chip via window of substrate by electrical connection medium |
| 01/27/2005 | DE102004030806A1 Halbleitrvorrichtung und Verfahren zur Herstellung derselben Halbleitrvorrichtung and methods for making the same |
| 01/27/2005 | DE102004028425A1 Semiconductor device e.g. integrated circuit comprises dummy pattern formed within measurement pattern so as to decrease empty space in surface cross-section of measurement pattern |
| 01/27/2005 | DE102004006494A1 Semiconducting wafer has separation longer than sum of difference between maximum, minimum final tolerances of wafer, bearer plate diameter and maximum positioning error when wafer and plate joined |
| 01/27/2005 | DE10141571B4 Verfahren zum Zusammenbau eines Halbleiterbauelements und damit hergestellte integrierte Schaltungsanordnung, die für dreidimensionale, mehrschichtige Schaltungen geeignet ist A method of assembling a semiconductor device and integrated circuit arrangement so manufactured, which is suitable for three-dimensional, multi-layer circuits |
| 01/27/2005 | DE10030436B4 Verfahren zur Herstellung einer Masse für eine elektrisch leitfähige Dickschicht, Masse für eine elektrisch leitfähige Dickschicht und laminiertes keramisches Elektronikteil A process for preparing a composition for an electrically conductive thick film composition for an electrically conductive thick film and laminated ceramic electronic part |
| 01/26/2005 | EP1501127A2 Power semiconductor module with base plate having high bending stiffness |
| 01/26/2005 | EP1501125A2 Power semiconductor module with scalable structural-design technology |
| 01/26/2005 | EP1501123A2 Adherence of structures comprising badly adhering material |
| 01/26/2005 | EP1500314A1 Electrically insulating body, and electronic device |
| 01/26/2005 | EP1500147A1 Modular thermoelectric couple and stack |
| 01/26/2005 | EP1500142A2 Component |
| 01/26/2005 | EP1500141A1 Electronic device and method of manufacturing same |
| 01/26/2005 | EP1500140A1 Integrated circuit with integrated capacitor and methods for making same |
| 01/26/2005 | EP1500139A1 Bond pad structure comprising tungsten or tungsten compound layer on top of metallization level |
| 01/26/2005 | EP1500138A1 Connection device and method for producing the same |
| 01/26/2005 | EP1500137A1 Carrier, method of manufacturing a carrier and an electronic device |
| 01/26/2005 | EP1500136A1 Semiconductor device and method of manufacturing same |
| 01/26/2005 | EP1500135A1 Method of manufacturing an electronic device, and electronic device |
| 01/26/2005 | EP1500134A1 Method of manufacturing an electronic device |
| 01/26/2005 | EP1500132A2 Method of bonding and transferring a material to form a semiconductor device |
| 01/26/2005 | EP1500130A1 Partially patterned lead frames and methods of making and using the same in semiconductor packaging |
| 01/26/2005 | EP1500043A2 Manufacturing method for a wireless communication device and manufacturing apparatus |
| 01/26/2005 | EP1500041A1 Module for a data carrier with improved bump counterparts |
| 01/26/2005 | EP1499905A1 Method and arrangement for protecting a chip and checking its authenticity |
| 01/26/2005 | EP1499759A2 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
| 01/26/2005 | EP1138076A4 Methods and compositions for improving interconnect metallization performance in integrated circuits |
| 01/26/2005 | CN2674651Y Single fan double blade radiating structure |
| 01/26/2005 | CN2674650Y Fin combined radiator |
| 01/26/2005 | CN2674649Y 散热器 Heat sink |
| 01/26/2005 | CN2674648Y Hermetic sealing composite cover plate for integrated circuit |
| 01/26/2005 | CN1572129A Solder-coated ball and method for manufacture thereof, and method for forming semiconductor interconnecting structure |
| 01/26/2005 | CN1572128A Photoimageable dielectric material for circuit protection |
| 01/26/2005 | CN1572028A Integrated circuit bus grid having wires with pre-selected variable widths |
| 01/26/2005 | CN1572025A Semiconductor device and its manufacturing method |
| 01/26/2005 | CN1572024A Method and apparatus for die stacking |
| 01/26/2005 | CN1572023A Encapsulation of pin solder for maintaining accuracy in pin position |
| 01/26/2005 | CN1572022A Sheet for sealing electrical wiring |
| 01/26/2005 | CN1572021A Thin metal package and manufacturing method thereof |
| 01/26/2005 | CN1572015A Film removing apparatus, film removing method and substrate processing system |
| 01/26/2005 | CN1571629A Circuit arrangement for components to be cooled and corresponding cooling method |
| 01/26/2005 | CN1571626A Bonding pads for a printed circuit board |
| 01/26/2005 | CN1571621A Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module |
| 01/26/2005 | CN1571223A IC socket assembly |
| 01/26/2005 | CN1571157A Stack type double-chip packaging structure |
| 01/26/2005 | CN1571156A Electrostatic discharge protecting circuit |
| 01/26/2005 | CN1571155A Electrostatic discharge protecting circuit |
| 01/26/2005 | CN1571154A Electrostatic discharge protecting circuit |
| 01/26/2005 | CN1571153A Electrostatic discharge clamp circuit |
| 01/26/2005 | CN1571152A Multiple metallic layers inner connecting wire structure |
| 01/26/2005 | CN1571151A Double gauge lead frame |
| 01/26/2005 | CN1571150A Mini flipchip transistor and method for manufacturing same |
| 01/26/2005 | CN1571149A Discontinuous solder ball contact and circuit board assembly using the same |
| 01/26/2005 | CN1571148A Heat radiation structure of semiconductor device, and manufacturing method thereof |
| 01/26/2005 | CN1571147A Radiator fin and manufacturing method thereof |
| 01/26/2005 | CN1571141A A method for reducing noise of RFCMOS device |
| 01/26/2005 | CN1571130A Lead frame for reinforcing lower joint alignment in automatic lead bonding process |
| 01/26/2005 | CN1571128A Method for manufacturing image sensor base plate |
| 01/26/2005 | CN1571127A Electrical line end shortening quantification |
| 01/26/2005 | CN1570807A Water cooling type heat radiating device |
| 01/26/2005 | CN1569955A Electronic device manufacture |
| 01/26/2005 | CN1186818C Metal wire fused wire structure possessing cavity body |
| 01/26/2005 | CN1186816C Voltage control element for preventing electrostatic discharge and its protecting circuit |
| 01/26/2005 | CN1186815C Passivating glass coating liquid for improving high-temp. reversal property of glass passivating silicon device |
| 01/26/2005 | CN1186814C Diffusion barrier and semiconductor device with diffusion barrier and manufacturing method thereof |
| 01/26/2005 | CN1186813C Flip chip packaging structure and its preparing process |
| 01/26/2005 | CN1186810C Semiconductor device chip scale surface assembling and packaging, and mfg. method therefor |
| 01/26/2005 | CN1186808C Method for producing circuit device |
| 01/26/2005 | CN1186807C Method for producing circuit device |
| 01/26/2005 | CN1186388C Semiconductor packing epoxy resin composition and its making process and semiconductor device |
| 01/26/2005 | CN1186387C Method for preparing epoxy resin composition for sealing optoelectronic semiconductor elements |
| 01/26/2005 | CN1186294C Crystal glass composite article, crystal glass, insulating composite article, insulating paste and thick film circuit board |
| 01/26/2005 | CN1186166C Heating head for hot-pressing bonding and making method thereof |
| 01/25/2005 | US6847529 Ultra-low impedance power interconnection system for electronic packages |
| 01/25/2005 | US6847527 Interconnect module with reduced power distribution impedance |
| 01/25/2005 | US6847525 Forced convection heat sink system with fluid vector control |
| 01/25/2005 | US6847275 High-frequency circuit board unit, high frequency module using the same unit, electronic apparatus using the same module, and manufacturing method for the high-frequency circuit board unit |
| 01/25/2005 | US6847262 Integrated power amplifier module with power sensor |
| 01/25/2005 | US6847220 Method for ball grid array chip packages having improved testing and stacking characteristics |
| 01/25/2005 | US6847125 Resin-encapsulated semiconductor apparatus and process for its fabrication |
| 01/25/2005 | US6847124 Semiconductor device and fabrication method thereof |
| 01/25/2005 | US6847123 Vertically staggered bondpad array |
| 01/25/2005 | US6847122 Insulative particles having a diameter smaller than a gap between adjacent conductors providing interconnection between the elements |
| 01/25/2005 | US6847120 Flip chip semiconductor device having signal pads arranged outside of power supply pads |
| 01/25/2005 | US6847117 Semiconductor device including a passivation film to cover directly an interface of a bump and an intermediated layer |
| 01/25/2005 | US6847116 Chip-type semiconductor light-emitting device |
| 01/25/2005 | US6847115 Radio frequency shield boxes; elongated conductor contactors, cavity with beveled walls |
| 01/25/2005 | US6847114 Micro-scale interconnect device with internal heat spreader and method for fabricating same |
| 01/25/2005 | US6847113 Electronic apparatus with plate-like member having plural recesses containing heat accumulating material |
| 01/25/2005 | US6847112 Semiconductor device and manufacturing the same |
| 01/25/2005 | US6847111 Semiconductor device with heat-dissipating capability |
| 01/25/2005 | US6847110 Method and apparatus for conducting heat in a flip-chip assembly |