| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/27/2005 | US20050020047 Methods of forming conductive structures including titanium-tungsten base layers and related structures |
| 01/27/2005 | US20050020029 Method of producing a contact system on the rear of a component with stacked substrates and a component equipped with one such contact system |
| 01/27/2005 | US20050020025 Semiconductor device and method of manufacturing the same |
| 01/27/2005 | US20050020007 Semiconductor element and method for its production |
| 01/27/2005 | US20050019991 Method of manufacturing semiconductor device having thin film SOI structure |
| 01/27/2005 | US20050019989 Method for making a module comprising at least an electronic component |
| 01/27/2005 | US20050019988 Method and apparatus for attaching microelectronic substrates and support members |
| 01/27/2005 | US20050019986 Method for making electronic devices including silicon and LTCC and devices produced thereby |
| 01/27/2005 | US20050019985 Charge coupled device package |
| 01/27/2005 | US20050019984 Multiple substrate microelectronic devices and methods of manufacture |
| 01/27/2005 | US20050019982 Semiconductor package having semiconductor constructing body and method of manufacturing the same |
| 01/27/2005 | US20050019981 [method of fabricating flip chip ball grid array package] |
| 01/27/2005 | US20050019966 Systems and methods for overlay shift determination |
| 01/27/2005 | US20050019965 Process for testing IC wafer |
| 01/27/2005 | US20050019582 Blend curable at a low and high temperature of an epoxy resin-unsaturated aliphatic acid adduct, a (meth)acrylate, a free radical initiator, a crystallizable epoxy resin, and latent curing agent; smooth undercoatings for circuit boards |
| 01/27/2005 | US20050019576 Nucleation of diamond films using higher diamondoids |
| 01/27/2005 | US20050019203 Silver alloy material, circuit substrate, electronic device, and method for manufacturing circuit substrate |
| 01/27/2005 | US20050018823 Methods and systems for enabling return to same position in a review of messages in a voice mail system using tag or identifier stored in the voice mail system |
| 01/27/2005 | US20050018515 Stress balanced semiconductor packages, method of fabrication and modified mold segment |
| 01/27/2005 | US20050018412 Pitch change and chip scale stacking system |
| 01/27/2005 | US20050018407 Stack up assembly |
| 01/27/2005 | US20050018406 Stack up assembly |
| 01/27/2005 | US20050018405 Electronic apparatus |
| 01/27/2005 | US20050018404 Heat sink assembly for integrated circuits having a slidable contact capability with a mounting member portion of an electronic equipment chassis |
| 01/27/2005 | US20050018402 Thermally enhanced electronic module |
| 01/27/2005 | US20050018401 Device for cooling memory modules |
| 01/27/2005 | US20050018379 Ceramic substrate |
| 01/27/2005 | US20050018190 Overlay alignment metrology using diffraction gratings |
| 01/27/2005 | US20050018097 Array substrate having double-layered metal patterns and method of fabricating the same |
| 01/27/2005 | US20050017837 Integrated transformer |
| 01/27/2005 | US20050017836 Inductors having interconnect and inductor portions to provide combined magnetic fields |
| 01/27/2005 | US20050017817 Off-chip bias feed system |
| 01/27/2005 | US20050017752 Semiconductor integrated circuit and methods for protecting the circuit from reverse engineering |
| 01/27/2005 | US20050017740 Module part |
| 01/27/2005 | US20050017376 IC chip with improved pillar bumps |
| 01/27/2005 | US20050017375 Ball grid array package substrate and method for manufacturing the same |
| 01/27/2005 | US20050017374 Semiconductor component of semiconductor chip size with flip-chip-like external contacts, and method of producing the same |
| 01/27/2005 | US20050017372 Prevent short circuiting; flip chip bonding |
| 01/27/2005 | US20050017371 Electronic assembly having a die with rounded corner edge portions and a method of fabricating the same |
| 01/27/2005 | US20050017369 Interposer |
| 01/27/2005 | US20050017368 Multi-level redistribution layer traces for reducing current crowding in flipchip solder bumps |
| 01/27/2005 | US20050017364 Semiconductor device and method of fabricating the same |
| 01/27/2005 | US20050017363 Semiconductor device with anchor type seal ring |
| 01/27/2005 | US20050017362 Low gate resistance layout procedure for RF transistor devices |
| 01/27/2005 | US20050017361 Post-passivation metal scheme on an IC chip with copper interconnection |
| 01/27/2005 | US20050017360 Semiconductor device |
| 01/27/2005 | US20050017358 Semiconductor component having conductors with wire bondable metalization layers |
| 01/27/2005 | US20050017357 Semiconductor device |
| 01/27/2005 | US20050017356 Semiconductor device |
| 01/27/2005 | US20050017355 Water level processing method and structure to manufacture two kinds of bumps, gold and solder, on one wafer |
| 01/27/2005 | US20050017354 Arrangement for reducing stress in substrate-based chip packages |
| 01/27/2005 | US20050017353 Semiconductor device and method of producing a high contrast identification mark |
| 01/27/2005 | US20050017352 Structure of multi-tier wire bonding for high frequency integrated circuit |
| 01/27/2005 | US20050017351 Silicon on diamond wafers and devices |
| 01/27/2005 | US20050017350 Thermal enhanced extended surface tape for integrated circuit heat dissipation |
| 01/27/2005 | US20050017348 Manufacture of mountable capped chips |
| 01/27/2005 | US20050017347 Circuit module and manufacturing method thereof |
| 01/27/2005 | US20050017346 Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device |
| 01/27/2005 | US20050017345 Flexible tape electronics packaging and methods of manufacture |
| 01/27/2005 | US20050017344 Interconnecting component |
| 01/27/2005 | US20050017343 Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same |
| 01/27/2005 | US20050017342 Semiconductor packages; connector frame lock tapes; circuit having dielectric segments; support layer; redistribution bonding pads |
| 01/27/2005 | US20050017341 Semiconductor device voltage supply for a system with at least two, especially stacked, semiconductor devices |
| 01/27/2005 | US20050017340 Semiconductor device and fabrication method thereof |
| 01/27/2005 | US20050017339 Semiconductor device and switching element |
| 01/27/2005 | US20050017338 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 01/27/2005 | US20050017336 [multi-chip package] |
| 01/27/2005 | US20050017335 Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package |
| 01/27/2005 | US20050017333 Interposer and method of making same |
| 01/27/2005 | US20050017332 Asymmetric partially-etched leads for finer pitch semiconductor chip package |
| 01/27/2005 | US20050017330 Process for fabricating a semiconductor package and semiconductor package with leadframe |
| 01/27/2005 | US20050017329 Multiple internal seal ring micro-electro-mechanical system vacuum package |
| 01/27/2005 | US20050017327 High permeability composite films to reduce noise in high speed interconnects |
| 01/27/2005 | US20050017326 Semiconductor device obtained by dividing semiconductor wafer by use of laser dicing technique and method of manufacturing the same |
| 01/27/2005 | US20050017324 Multilayer analog interconnecting line layout for a mixed-signal integrated circuit |
| 01/27/2005 | US20050017306 Semiconductor integrated circuit |
| 01/27/2005 | US20050017299 Power MOSFET |
| 01/27/2005 | US20050017298 Shielding structure for use in a metal-oxide-semiconductor device |
| 01/27/2005 | US20050017296 Semiconductor device and a method of manufacturing the same |
| 01/27/2005 | US20050017295 Semiconductor devices having a buried and enlarged contact hole and methods of fabricating the same |
| 01/27/2005 | US20050017291 Semiconductor structure and method for fabricating such a structure |
| 01/27/2005 | US20050017271 Multilayered substrate for semiconductor device and method of manufacturing same |
| 01/27/2005 | US20050017267 Hetero-bipolar transistor having the base interconnection provided on the normal mesa surface of the collector mesa |
| 01/27/2005 | US20050017264 Module for high voltage power for converting a base of IGBT components |
| 01/27/2005 | US20050017252 Light-emitting semiconductor component |
| 01/27/2005 | US20050017239 Test element group, method of manufacturing a test element group, method of testing a semiconductor device, and semiconductor device |
| 01/27/2005 | US20050017156 High-speed, precision, laser-based method and system for processing material of one or more targets within a field |
| 01/27/2005 | US20050016897 Connection structure of circuit substrate |
| 01/27/2005 | US20050016859 Increasing step current to carry out an electroplating operation so that the bumps have a uniform thickness |
| 01/27/2005 | US20050016767 Electronic module with dual connectivity |
| 01/27/2005 | US20050016751 Microelectronic package with reduced underfill and methods for forming such packages |
| 01/27/2005 | US20050016750 Methods for enclosing a thermoplastic package |
| 01/27/2005 | US20050016749 Method and system for optimizing routing layers and board space requirements for a ball grid array land pattern |
| 01/27/2005 | US20050016720 Heat radiator |
| 01/27/2005 | US20050016715 Hermetic closed loop fluid system |
| 01/27/2005 | US20050016714 Thermal paste for improving thermal contacts |
| 01/27/2005 | US20050016707 Mold and method for manufacturing metal-ceramic composite member |
| 01/27/2005 | US20050016289 Physical value detecting apparatus and housing for physical value detecting means |
| 01/27/2005 | US20050016251 Forming tool for forming a contoured microelectronic spring mold |
| 01/27/2005 | DE202004018218U1 Heat sink for cooling purposes e.g. for CPU, has concave section that can uniformly distribute air flow from fan to improve cooling effect; concave section is of curved form, gradually deepening form or stepped |