| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/01/2005 | US6849956 Semiconductor integrated circuit with shortened pad pitch |
| 02/01/2005 | US6849955 Flip-chips/solder pads |
| 02/01/2005 | US6849954 IC package substrate with over voltage protection function |
| 02/01/2005 | US6849953 Microelectronic assemblies with composite conductive elements |
| 02/01/2005 | US6849952 Semiconductor device and its manufacturing method |
| 02/01/2005 | US6849951 Bypass capacitor solution for integrated circuit dice |
| 02/01/2005 | US6849950 Semiconductor device and method of manufacturing same |
| 02/01/2005 | US6849949 Thin stacked package |
| 02/01/2005 | US6849948 Dielectrics; semiconductors |
| 02/01/2005 | US6849945 Multi-layered semiconductor device and method for producing the same |
| 02/01/2005 | US6849944 Using a supporting structure to control collapse of a die towards a die pad during a reflow process for coupling the die to the die pad |
| 02/01/2005 | US6849942 Semiconductor package with heat sink attached to substrate |
| 02/01/2005 | US6849941 Heat sink and heat spreader assembly |
| 02/01/2005 | US6849940 Semiconductors; heat sinks; printed circuits |
| 02/01/2005 | US6849939 Electronic component package and method of manufacturing same |
| 02/01/2005 | US6849937 Variable rotational assignment of interconnect levels in integrated circuit fabrication |
| 02/01/2005 | US6849936 System and method for using film deposition techniques to provide an antenna within an integrated circuit package |
| 02/01/2005 | US6849934 Dielectric film for printed wiring board, multilayer printed board, and semiconductor device |
| 02/01/2005 | US6849933 Semiconductor mounting device and method of manufacturing the same |
| 02/01/2005 | US6849932 Double-sided thermally enhanced IC chip package |
| 02/01/2005 | US6849931 Lead frame |
| 02/01/2005 | US6849930 Semiconductor device with uneven metal plate to improve adhesion to molding compound |
| 02/01/2005 | US6849929 IC chip and semiconductor device |
| 02/01/2005 | US6849927 Oxidation resistance; transistors |
| 02/01/2005 | US6849920 Semiconductor capacitive element, method for manufacturing same and semiconductor device provided with same |
| 02/01/2005 | US6849916 Flip chip on glass sensor package |
| 02/01/2005 | US6849910 Systems and methods for improving the performance of sensing devices using oscillatory devices |
| 02/01/2005 | US6849907 Electrostatic discharge protection device |
| 02/01/2005 | US6849902 Input/output cell with robust electrostatic discharge protection |
| 02/01/2005 | US6849896 Flash memory with UV opaque passivation layer |
| 02/01/2005 | US6849887 Semiconductor device and method for fabricating the same |
| 02/01/2005 | US6849879 Crosstalk reduction in a crosspoint thyristor switching array using a shielded dielectric stack |
| 02/01/2005 | US6849867 Method of making radiation emitter devices |
| 02/01/2005 | US6849806 Electrical apparatus having resistance to atmospheric effects and method of manufacture therefor |
| 02/01/2005 | US6849802 Semiconductor chip, chip stack package and manufacturing method |
| 02/01/2005 | US6849800 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating |
| 02/01/2005 | US6849563 Method and apparatus for controlling coating thickness |
| 02/01/2005 | US6849561 Method of forming low-k films |
| 02/01/2005 | US6849550 Method for manufacturing semiconductor device |
| 02/01/2005 | US6849545 System and method to form a composite film stack utilizing sequential deposition techniques |
| 02/01/2005 | US6849537 Method of suppressing void formation in a metal line |
| 02/01/2005 | US6849535 Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device |
| 02/01/2005 | US6849534 Process of forming bonding columns |
| 02/01/2005 | US6849479 Substrate based ESD network protection method for flip chip design |
| 02/01/2005 | US6849478 Power amplifier having high heat dissipation |
| 02/01/2005 | US6849477 Method of fabricating and mounting flip chips |
| 02/01/2005 | US6849387 Multilayer lithography |
| 02/01/2005 | US6849298 Method for forming diffusion barrier film of semiconductor device |
| 02/01/2005 | US6849109 Multimetallic nanofillers with domain size less than 100 nanometers exhibiting transparency to visible light that differs by more than 20% as compared to fillers having a domain size of at least one micron. |
| 02/01/2005 | US6848619 Micro-controller protected against current attacks |
| 02/01/2005 | US6848500 Cooling system for pulsed power electronics |
| 02/01/2005 | US6848338 High acceleration spindle drive and method of using same |
| 02/01/2005 | US6848178 Enhancement of current-carrying capacity of a multilayer circuit board |
| 02/01/2005 | US6848177 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme |
| 02/01/2005 | US6848176 Process for manufacturing flexible wiring boards |
| 02/01/2005 | US6848175 Method of forming an out-of-plane structure |
| 02/01/2005 | US6848173 Microelectric packages having deformed bonded leads and methods therefor |
| 02/01/2005 | US6848172 Device and method for package warp compensation in an integrated heat spreader |
| 02/01/2005 | US6848162 System and method of transferring dies using an adhesive surface |
| 02/01/2005 | CA2339019C Preparation of metal-matrix composite materials with high particulate loadings by concentration |
| 01/27/2005 | WO2005009095A1 A cross-over of conductive interconnects and a method of crossing conductive interconnects |
| 01/27/2005 | WO2005008838A1 Normally closed zero insertion force connector |
| 01/27/2005 | WO2005008774A2 Semiconductor chip comprising terminal contact areas grouped together in a confined zone |
| 01/27/2005 | WO2005008773A1 Semiconductor device including optimized driver layout for integrated circuit with staggered bond pads |
| 01/27/2005 | WO2005008772A2 Electronic component and flat conductor frame comprising a structured metal layer which is non-wettable by a solder material for the production of the component |
| 01/27/2005 | WO2005008771A1 Method of forming a contact hole with a barrier layer in a device and resulting device |
| 01/27/2005 | WO2005008767A2 Metal bump with an insulation for the side walls and method of fabricating a chip with such a metal bump |
| 01/27/2005 | WO2005008765A2 Semiconductor power module with strip conductors which are detached from a substrate as external connections |
| 01/27/2005 | WO2005008730A2 Low cost, high performance flip chip package structure |
| 01/27/2005 | WO2005008728A2 Surface mount multichip devices |
| 01/27/2005 | WO2005008725A2 Nested voltage island architecture |
| 01/27/2005 | WO2005008724A2 Wafer-level chip scale package and method for fabricating and using the same |
| 01/27/2005 | WO2005008698A1 Surface mounting type part |
| 01/27/2005 | WO2005008695A2 Inductive and capacitive elements for semiconductor technologies with minimum pattern density requirements |
| 01/27/2005 | WO2005008694A1 Compact impedance transformation circuit |
| 01/27/2005 | WO2005008682A1 Electrically conducting element comprising an adhesive layer, and method for depositing an adhesive layer |
| 01/27/2005 | WO2005008676A2 A fuse structure |
| 01/27/2005 | WO2005008348A2 System and method for thermal management using distributed synthetic jet actuators |
| 01/27/2005 | WO2004102653A8 Semiconductor device and interposer |
| 01/27/2005 | WO2004100227A3 Application specific heat-dissipating apparatus that provides electrical isolation for components |
| 01/27/2005 | WO2004093185A3 Electrical interconnect structures for integrated circuits and methods of manufacturing the same |
| 01/27/2005 | WO2004080134A3 High frequency chip packages with connecting elements |
| 01/27/2005 | WO2004077508A3 Lead frame with included passive devices |
| 01/27/2005 | WO2004066477A3 Semiconducting island as active layer in fet |
| 01/27/2005 | WO2004061960A3 Semiconductor device power interconnect striping |
| 01/27/2005 | WO2004032198A3 Method for maintaining solder thickness in flipchip attach packaging processes |
| 01/27/2005 | WO2004017476A3 Semiconductor device with a cooling element |
| 01/27/2005 | US20050022148 Semiconductor device layout method, a computer program, and a semiconductor device manufacture method |
| 01/27/2005 | US20050021993 Semiconductor device card methods of intializing checking the authenticity and the indentity thereof |
| 01/27/2005 | US20050020748 Elastomer formed product |
| 01/27/2005 | US20050020702 Organic compositions |
| 01/27/2005 | US20050020117 Socket for electronic part |
| 01/27/2005 | US20050020098 Land grid array connector |
| 01/27/2005 | US20050020069 Nickel bonding cap over copper metalized bondpads |
| 01/27/2005 | US20050020064 Stable electroless fine pitch interconnect plating |
| 01/27/2005 | US20050020054 Formation of a contact in a device, and the device including the contact |
| 01/27/2005 | US20050020052 Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging |
| 01/27/2005 | US20050020051 Method for forming bump protective collars on a bumped wafer |
| 01/27/2005 | US20050020050 [bumping process] |
| 01/27/2005 | US20050020048 Method of depositing dielectric films |