Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2005
02/02/2005CN1574348A Semiconductor device and switching element
02/02/2005CN1574347A 半导体装置 Semiconductor device
02/02/2005CN1574346A Method of manufacturing a semiconductor device
02/02/2005CN1574345A 半导体封装件 The semiconductor package
02/02/2005CN1574344A Three-dimensionally mounted semiconductor module and three-dimensionally mounted semiconductor system
02/02/2005CN1574342A Tape carrier type semiconductor device and method of producing the same
02/02/2005CN1574341A Semiconductor device having a measuring pattern and a method of measuring the semiconductor device using the measuring pattern
02/02/2005CN1574340A Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the same
02/02/2005CN1574339A Semiconductor device
02/02/2005CN1574338A 半导体器件 Semiconductor devices
02/02/2005CN1574337A Semiconductor device and method of manufacturing the same
02/02/2005CN1574336A Semiconductor device and method of manufacturing the same
02/02/2005CN1574335A Semiconductor power device having a diamond shaped metal interconnect scheme
02/02/2005CN1574334A Integrated circuit, its forming method, and electronic assembly
02/02/2005CN1574333A Interconnection structure of semiconductor device
02/02/2005CN1574332A Electric power semiconductor device
02/02/2005CN1574331A 半导体器件 Semiconductor devices
02/02/2005CN1574330A Lead frame and semiconductor device using the same
02/02/2005CN1574329A 半导体器件 Semiconductor devices
02/02/2005CN1574328A Semiconductor device and method of manufacturing the same
02/02/2005CN1574327A Semiconductor device and method for manufacturing the same
02/02/2005CN1574326A Mold type semiconductor device and method for manufacturing the same
02/02/2005CN1574325A Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
02/02/2005CN1574324A Semiconductor device and manufacturing method thereof
02/02/2005CN1574323A Semiconductor device
02/02/2005CN1574322A Semiconductor device, semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module
02/02/2005CN1574321A Bond pad scheme for cu process
02/02/2005CN1574320A Semiconductor package device and method for fabricating the same
02/02/2005CN1574319A Circuit device and method of manufacturing the same
02/02/2005CN1574318A Semiconductor cooling device
02/02/2005CN1574317A 半导体冷却装置 Semiconductor cooling device
02/02/2005CN1574316A Semiconductor unit with cooling system
02/02/2005CN1574315A Active heat sink
02/02/2005CN1574314A Integrated circuit device for driving a laser diode with reduced heat transfer and method for fabricating the device
02/02/2005CN1574312A Resin sealing type semiconductor device and method of making the same
02/02/2005CN1574311A Terminal structure of multi-layer substrate and method for forming the same
02/02/2005CN1574310A Intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate
02/02/2005CN1574309A Stacked-type semiconductor device
02/02/2005CN1574308A Thermally enhanced component substrate
02/02/2005CN1574307A 半导体器件 Semiconductor devices
02/02/2005CN1574306A Apparatus and method to form ground connections
02/02/2005CN1574305A Packaging assembly and method of assembling the same
02/02/2005CN1574304A Package for semiconductor devices
02/02/2005CN1574303A 半导体装置 Semiconductor device
02/02/2005CN1574302A 半导体器件 Semiconductor devices
02/02/2005CN1574301A Ceramic package and fabrication method thereof
02/02/2005CN1574300A 封装组件和半导体封装 Package assembly and semiconductor packaging
02/02/2005CN1574281A Copper damascene technique and structure thereof
02/02/2005CN1574280A Pattern for reducing interconnect failures
02/02/2005CN1574274A Manufacturing method for semiconductor device
02/02/2005CN1574266A Film carrying belt testing device for mounting electronic element and testing method
02/02/2005CN1574264A Semiconductor device and manufacturing method of the same
02/02/2005CN1574263A Semiconductor package having semiconductor constructing body and method of manufacturing the same
02/02/2005CN1574261A Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus
02/02/2005CN1574260A Method of manufacturing semiconductor device
02/02/2005CN1574257A 半导体装置及其制造方法 Semiconductor device and manufacturing method
02/02/2005CN1574255A Flip chip assembly process and substrate used therewith and printed half-tone screen free from being stained with solder
02/02/2005CN1574254A Method of plating electrode formation
02/02/2005CN1574250A Semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module
02/02/2005CN1574248A Method of manufacturing semiconductor device having nitride film with improved insulating properties
02/02/2005CN1574236A Method for manufacturing semiconductor device
02/02/2005CN1574231A Fabrication method of semiconductor integrated circuit device
02/02/2005CN1574225A Method of fabricating polycrystalline silicon and switching device using polycrystalline silicon
02/02/2005CN1574212A Semiconductor device and its manufacturing method
02/02/2005CN1574169A Conductive sintering briquette for fixing electrode of electronic element envelop
02/02/2005CN1574131A Integrated electronic component
02/02/2005CN1574027A Wired circuit board
02/02/2005CN1573654A Electronic apparatus having a heat-radiating unit for radiating heat of heat-generating components
02/02/2005CN1573653A Cooling system for a portable computer
02/02/2005CN1573483A Thin film transistor substrate and method of manufacturing the same
02/02/2005CN1573453A Display device and manufacturing method of the same
02/02/2005CN1572910A Plating machine and process for producing film carrier tapes for mounting electronic parts
02/02/2005CN1572718A Semiconductor device and manufacturing method of the same
02/02/2005CN1572716A Micromachine and method of fabricating the same
02/02/2005CN1572483A Markite laminate sheet
02/02/2005CN1572456A High efficiency heat conducting module and its making method
02/02/2005CN1188019C Die lead frame assembly and method for mounting lead frame on semiconductor die
02/02/2005CN1187844C Flat type LED and mfg. method thereof
02/02/2005CN1187838C Method for manufacturing electrolight device
02/02/2005CN1187836C 半导体存储装置 The semiconductor memory device
02/02/2005CN1187827C Gate-level fill method for reducing global pattern density effect
02/02/2005CN1187823C Semi-conductor device and its producing method
02/02/2005CN1187822C Semiconductor device, method of manufacture thereof, and electronic device
02/02/2005CN1187820C 晶片结构 Chip structure
02/02/2005CN1187819C Solder pad configuration for flip chip
02/02/2005CN1187818C Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin
02/02/2005CN1187816C Wave type fin radiator and heat exchange using this radiator
02/02/2005CN1187814C Input/output unit configuring method and semi-conductor equipment
02/02/2005CN1187812C Semiconductor device, manufacturing method and design method thereof
02/02/2005CN1187806C Method for producing electric circuit device
02/02/2005CN1187805C Method for using heat radiator with support effect to chip packaging base plate
02/02/2005CN1187801C Method for producing compound semiconductor device
02/02/2005CN1187800C Circuit board and detector, and method for manufacturing the same
02/02/2005CN1187793C Method for generation of electrical conducting or semiconducting structures in three dimensions and methods for erasure of the same structures
02/02/2005CN1187389C Die-attaching paste and semiconductor device
02/01/2005US6850858 Method and apparatus for calibrating a metrology tool
02/01/2005US6850411 Method and structure to support heat sink arrangement on chip carrier packages
02/01/2005US6850117 CMOS transceiver having an integrated power amplifier
02/01/2005US6850001 Light emitting diode
02/01/2005US6849957 Photomask including auxiliary mark area, semiconductor device and manufacturing method thereof