| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/03/2005 | US20050023643 Mechanically-stable BJT with reduced base-collector capacitance |
| 02/03/2005 | US20050023641 Damascene resistor and method for measuring the width of same |
| 02/03/2005 | US20050023638 Scalable high performance antifuse structure and process |
| 02/03/2005 | US20050023637 Method for producing an antifuse structure and antifuse |
| 02/03/2005 | US20050023617 Conductive lines buried in insulating areas |
| 02/03/2005 | US20050023614 Electrostatic discharge protection circuit |
| 02/03/2005 | US20050023583 Multi media card formed by transfer molding |
| 02/03/2005 | US20050023575 ESD protection configuration and method for light emitting diodes |
| 02/03/2005 | US20050023572 Electronic device package |
| 02/03/2005 | US20050023568 Semiconductor integrated circuit device |
| 02/03/2005 | US20050023565 Healing of micro-cracks in an on-chip dielectric |
| 02/03/2005 | US20050023563 Semiconductor chip with fuse unit |
| 02/03/2005 | US20050023562 Standoffs for centralizing internals in packaging process |
| 02/03/2005 | US20050023558 Near hermetic packaging of gallium arsenide semiconductor devices and manufacturing method therefor |
| 02/03/2005 | US20050023521 Electro-optical device, method for making the same, and electronic apparatus |
| 02/03/2005 | US20050023147 Including an interconnect pattern having portions of its surface with different properties; since the first and second plating layers are formed on the interconnect pattern, oxidation of the surface of the interconnect pattern can be prevented, and also the electrical contact resistance can be lowered |
| 02/03/2005 | US20050023034 Printed wiring board and manufacturing method therefor |
| 02/03/2005 | US20050023033 Intermediate substrate, intermediate substrate with semiconductor element, substrate with intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate |
| 02/03/2005 | US20050023032 Laminated wiring board and its mounting structure |
| 02/03/2005 | US20050023030 Printed circuit board with a heat dissipation element and package comprising the printed circuit board |
| 02/03/2005 | US20050022984 Heat transfer device and method of making same |
| 02/03/2005 | US20050022978 Heat exchanger device using a two-phase active fluid, and a method of manufacturing such a device |
| 02/03/2005 | US20050022977 Counter-stream-mode oscillating-flow heat transport apparatus |
| 02/03/2005 | US20050022976 Heat transfer device and method of making same |
| 02/03/2005 | US20050022975 Brazed wick for a heat transfer device and method of making same |
| 02/03/2005 | US20050022973 Heat dissipation assembly with retaining device |
| 02/03/2005 | US20050022972 Heat sink element coupling structure |
| 02/03/2005 | US20050022971 Thermal interface material |
| 02/03/2005 | US20050022970 Wrap around heat sink apparatus and method |
| 02/03/2005 | US20050022969 Heat sink structure with flexible heat dissipation pad |
| 02/03/2005 | US20050022745 Electroless plating method, electroless plating device, and production method and production device of semiconductor device |
| 02/03/2005 | US20050022379 Method of making a semiconductor device having an opening in a solder mask |
| 02/03/2005 | US20050022378 Apparatus used to package multimedia card by transfer molding |
| 02/03/2005 | DE20314960U1 Cooler for electrical or electronic components, comprises partial parallel channels bounded by micro-strips in regular pattern |
| 02/03/2005 | DE19831634B4 Chipträgeranordnung sowie Verfahren zur Herstellung einer Chipträgeranordnung mit elektrischem Test Chip carrier assembly and method of manufacturing a chip carrier assembly with electrical test |
| 02/03/2005 | DE10332513A1 Halbleiterbauelement mit integriertem Übertemperaturschutz Semiconductor device with integrated temperature protection |
| 02/03/2005 | DE10329326B3 Manufacturing packages with electrical, electronic, micromechanical components or microelectromechanical systems involves providing protective wafer of ceramic, metal or plastic |
| 02/03/2005 | DE102004031920A1 Mehrchippackung und Herstellungsverfahren Multi-chip package and manufacturing processes |
| 02/03/2005 | DE102004031706A1 Klemmschaltung für elektrostatische Entladung Clamp circuit for electrostatic discharge |
| 02/03/2005 | DE102004030860A1 Verfahren zum Schützen eines Metallisierungsgebiets und Halbleiterstruktur mit mindestens einem Metallisierungsgebiet A method for protecting a Metallisierungsgebiets and semiconductor structure with at least one Metallisierungsgebiet |
| 02/03/2005 | DE102004029844A1 Semiconductor package for mobile apparatus e.g. cell phone, has selecting circuit sending disable control signal to power generator when ground voltage is connected to input of selecting circuit |
| 02/03/2005 | DE10148021B4 Meßstruktur zur Bestimmung der Positionsgenauigkeit eines Halbleiterwafers zu einer Maske Measuring structure for determining the positional accuracy of a semiconductor wafer to a mask |
| 02/03/2005 | CA2533155A1 Cooling method and apparatus |
| 02/02/2005 | EP1503473A1 Monolithically Integrated circuit for overvoltage protection |
| 02/02/2005 | EP1503420A2 Solid-state imaging device and method for manufacturing the same |
| 02/02/2005 | EP1503416A2 Power grid layout techniques on integrated circuits |
| 02/02/2005 | EP1503415A2 On-chip Inductors having interconnect and inductor portions providing combined magnetic fields |
| 02/02/2005 | EP1503414A2 Ball grid array package |
| 02/02/2005 | EP1503413A2 Thermal interface material |
| 02/02/2005 | EP1503412A2 Semiconductor device and manufacturing method of the same |
| 02/02/2005 | EP1503411A1 Conductive lines embedded in isolation regions |
| 02/02/2005 | EP1503409A2 Module with embedded semiconductor IC which has a narrow electrode pitch and method of fabricating the module |
| 02/02/2005 | EP1503408A1 Method for measuring withstand voltage of semiconductor epitaxial wafer and semiconductor epitaxial wafer |
| 02/02/2005 | EP1503407A2 Wafer applied thermally conductive interposer |
| 02/02/2005 | EP1503406A2 Back-side contact pads of a semiconductor chip |
| 02/02/2005 | EP1503389A1 Switchable inductance |
| 02/02/2005 | EP1503216A1 Sheet-form connector and production method and application therefor |
| 02/02/2005 | EP1502930A1 Epoxy resin of electromagnetic interference suppression and manufacturing method thereof and an inductor applied in the electromagnetic interference suppression |
| 02/02/2005 | EP1502922A1 Curable encapsulant compositions |
| 02/02/2005 | EP1502309A1 Integrated circuit with internal impedance matching circuit |
| 02/02/2005 | EP1502300A1 Circuit comprising a capacitor and at least one semiconductor component, and method for designing same |
| 02/02/2005 | EP1502299A2 Contacting of nanotubes |
| 02/02/2005 | EP1502293A2 Method for the production of structured layers on substrates |
| 02/02/2005 | EP1502066A2 Cooling unit and flow distributing element for use in such unit |
| 02/02/2005 | EP1501756A2 Method of manufacturing an electronic device in a cavity with a cover |
| 02/02/2005 | EP1386327A4 Interface materials and methods of production and use thereof |
| 02/02/2005 | EP1214741B1 Control device, particularly for use in automotive engineering |
| 02/02/2005 | EP0995226B1 Heat-transfer enhancing features for semiconductor carriers and devices |
| 02/02/2005 | EP0962123B1 Heat sink mounting assembly for surface mount electronic device packages |
| 02/02/2005 | CN2676411Y 金手指结构 Goldfinger structure |
| 02/02/2005 | CN2676410Y Radiator for computer CPU |
| 02/02/2005 | CN2676409Y Radiator carriage and radiating device employing same carriage |
| 02/02/2005 | CN2676408Y 一种散热器结构 Radiator structure |
| 02/02/2005 | CN2676128Y 导热装置 Thermal unit |
| 02/02/2005 | CN1575523A Micro- or nano-electronic component comprising a power source and means for protecting the power source |
| 02/02/2005 | CN1575522A Substrate design and process for reducing electromagnetic emission |
| 02/02/2005 | CN1575521A Pattern for improved visual inspection of semiconductor devices |
| 02/02/2005 | CN1575520A Microelectronic lid designs, heat spreader designs, and semiconductor packages |
| 02/02/2005 | CN1575518A Integration of barrier layer and seed layer |
| 02/02/2005 | CN1575516A Fill pattern generation for spin-on glass and related self-planarization deposition |
| 02/02/2005 | CN1575512A 键合线 Bonding wire |
| 02/02/2005 | CN1575511A Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces |
| 02/02/2005 | CN1575510A Adhesive wafers for die attach application |
| 02/02/2005 | CN1575508A Copper alloy interconnections for integrated circuits and methods of making same |
| 02/02/2005 | CN1575265A A heat conductive material |
| 02/02/2005 | CN1575111A Printed wiring board for mounting semiconductor |
| 02/02/2005 | CN1575090A 混合集成电路装置 Hybrid integrated circuit device |
| 02/02/2005 | CN1575060A Active matrix electroluminescence device and method for fabricating the same |
| 02/02/2005 | CN1575057A Method of manufacturing a laminated structure, laminated structure, display device and display unit with laminated structure |
| 02/02/2005 | CN1574626A Surface acoustic wave device, package for the device, and method of fabricating the device |
| 02/02/2005 | CN1574625A Surface acoustic wave device, package for the device, and method of fabricating the device |
| 02/02/2005 | CN1574624A Electronic component and package |
| 02/02/2005 | CN1574411A Methods for depositing a thickfilm dielectric on a substrate |
| 02/02/2005 | CN1574398A Semiconductor device with low resistance and method of fabricating the same |
| 02/02/2005 | CN1574391A Power MOSFET, power MOSFET packaged device, and method of manufacturing power MOSFET |
| 02/02/2005 | CN1574390A Semiconductor device |
| 02/02/2005 | CN1574379A Solid-state imaging method and apparatus |
| 02/02/2005 | CN1574374A Solid-state imaging apparatus and method for making the same |
| 02/02/2005 | CN1574368A Thin film circuit device, manufacturing method thereof, electro-optical apparatus, and electronic system |
| 02/02/2005 | CN1574349A Lsi package |