| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/08/2005 | US6853075 Self-assembled nanobump array stuctures and a method to fabricate such structures |
| 02/08/2005 | US6853074 Electronic part, an electronic part mounting element and a process for manufacturing such the articles |
| 02/08/2005 | US6853072 Semiconductor switching circuit device and manufacturing method thereof |
| 02/08/2005 | US6853071 Electronic device having dewing prevention structure and dewing prevention structure of electronic device |
| 02/08/2005 | US6853070 Die-down ball grid array package with die-attached heat spreader and method for making the same |
| 02/08/2005 | US6853069 Packaged die on PCB with heat sink encapsulant and methods |
| 02/08/2005 | US6853068 Heatsinking and packaging of integrated circuit chips |
| 02/08/2005 | US6853067 Microelectromechanical systems using thermocompression bonding |
| 02/08/2005 | US6853066 Semiconductor device |
| 02/08/2005 | US6853065 Tab tape, method of making same and semiconductor device |
| 02/08/2005 | US6853064 Semiconductor component having stacked, encapsulated dice |
| 02/08/2005 | US6853063 Semiconductor device and communication terminal using thereof |
| 02/08/2005 | US6853061 Dual power supply method and apparatus |
| 02/08/2005 | US6853060 Semiconductor package using a printed circuit board and a method of manufacturing the same |
| 02/08/2005 | US6853059 Semiconductor package having improved adhesiveness and ground bonding |
| 02/08/2005 | US6853058 Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member |
| 02/08/2005 | US6853057 Lead frame for a plastic encapsulated semiconductor device |
| 02/08/2005 | US6853056 Semiconductor device having a base metal lead frame |
| 02/08/2005 | US6853055 Radiation shielding die carrier package |
| 02/08/2005 | US6853054 High frequency semiconductor device |
| 02/08/2005 | US6853051 Thin film capacitor and method of manufacturing the same |
| 02/08/2005 | US6853050 Semiconductor device with fuse box and method for fabricating the same |
| 02/08/2005 | US6853049 Silicide-silicon oxide-semiconductor antifuse device and method of making |
| 02/08/2005 | US6853039 Dual-gate CMOS semiconductor device and dual-gate CMOS semiconductor device manufacturing method |
| 02/08/2005 | US6853036 Method and apparatus for preventing microcircuit dynamic thermo-mechanical damage during an ESD event |
| 02/08/2005 | US6853003 Semiconductor devices with capacitors of metal/insulator/metal structure and methods for forming the same |
| 02/08/2005 | US6853000 Test structure for determining a doping region of an electrode connection between a trench capacitor and a selection transistor in a memory cell array |
| 02/08/2005 | US6852999 Reduced terminal testing system |
| 02/08/2005 | US6852931 Configuration having an electronic device electrically connected to a printed circuit board |
| 02/08/2005 | US6852928 Cooled externally modulated laser for transmitter optical subassembly |
| 02/08/2005 | US6852927 Thin metal package and manufacturing method thereof |
| 02/08/2005 | US6852926 Packaging microelectromechanical structures |
| 02/08/2005 | US6852651 Semiconductor device and method of manufacturing the same |
| 02/08/2005 | US6852650 Insulation film on semiconductor substrate and method for forming same |
| 02/08/2005 | US6852635 Method for bottomless deposition of barrier layers in integrated circuit metallization schemes |
| 02/08/2005 | US6852627 Conductive through wafer vias |
| 02/08/2005 | US6852626 Film deposition method and apparatus |
| 02/08/2005 | US6852625 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| 02/08/2005 | US6852621 Semiconductor device and manufacturing method therefor, circuit board, and electronic equipment |
| 02/08/2005 | US6852619 Dual damascene semiconductor devices |
| 02/08/2005 | US6852617 Semiconductor device fabrication method |
| 02/08/2005 | US6852616 Semiconductor device and method for producing the same |
| 02/08/2005 | US6852613 High permeability thin films and patterned thin films to reduce noise in high speed interconnections |
| 02/08/2005 | US6852612 Semiconductor device and method for fabricating the same |
| 02/08/2005 | US6852607 Wafer level package having a side package |
| 02/08/2005 | US6852605 Method of forming an inductor with continuous metal deposition |
| 02/08/2005 | US6852587 Method for fabricating a semiconductor device |
| 02/08/2005 | US6852574 Method of forming a leadframe for a semiconductor package |
| 02/08/2005 | US6852573 Heat sink sheet and fabrication method therefor |
| 02/08/2005 | US6852572 Method of manufacturing semiconductor device |
| 02/08/2005 | US6852570 Method of manufacturing a stacked semiconductor device |
| 02/08/2005 | US6852569 Method of fabricating multilayer ceramic substrate |
| 02/08/2005 | US6852568 Pin-assignment method for integrated circuit packages to increase the electro-static discharge protective capability |
| 02/08/2005 | US6852567 Method of assembling a semiconductor device package |
| 02/08/2005 | US6852564 Semiconductor device and method of fabricating the same |
| 02/08/2005 | US6852561 Encapsulated surface acoustic wave component and method of collective fabrication |
| 02/08/2005 | US6852553 Semiconductor device fabrication method and semiconductor device fabrication apparatus |
| 02/08/2005 | US6852263 An epoxy resin formulation with suppression in the generation of bowing and high relilability, containing an epoxy resin and phenol-novolak resin as curing agent; curing |
| 02/08/2005 | US6851467 Heat sink assembly |
| 02/08/2005 | US6851184 Method for manufacturing a printed circuit board |
| 02/08/2005 | US6851183 Semiconductor package assembly and method for electrically isolating modules |
| 02/08/2005 | CA2377336C Mounting method and apparatus for electrical components |
| 02/08/2005 | CA2320064C Method of making microwave, multifunction modules using fluoropolymer composite substrates |
| 02/03/2005 | WO2005011350A2 Cooling method and apparatus |
| 02/03/2005 | WO2005011349A2 Cooling device for leading dissipated heat away from an electrical or electronic component or assembly groups |
| 02/03/2005 | WO2005011341A2 Electronic module with dual connectvity |
| 02/03/2005 | WO2005011099A2 Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded |
| 02/03/2005 | WO2005010993A1 Electronic assembly having a die with rounded corner edge portions and a method of fabricating the same |
| 02/03/2005 | WO2005010990A2 Memory stack using flexible circuit and low-profile contacts |
| 02/03/2005 | WO2005010989A1 Ground arch for wirebond ball grid arrays |
| 02/03/2005 | WO2005010988A1 Electronic component with semiconductor chip and semiconductor wafer having contact pads, and method for the production thereof |
| 02/03/2005 | WO2005010987A1 Wiring board embedded with spherical semiconductor element |
| 02/03/2005 | WO2005010986A1 In-print method and in-print device |
| 02/03/2005 | WO2005010985A1 Semiconductor device, method for manufacturing semiconductor device, semiconductor module and personal computer card |
| 02/03/2005 | WO2005010984A2 Pecvd silicon-rich oxide layer for reduced uv charging in an eeprom |
| 02/03/2005 | WO2005010976A1 A programmable multi-chip module |
| 02/03/2005 | WO2005010975A1 Planar magnetic tunnel junction substrate having recessed alignment marks |
| 02/03/2005 | WO2005010972A1 Improvements in the use of silyating agents |
| 02/03/2005 | WO2005010967A2 Device and method for machining the rear side of semiconductor chips |
| 02/03/2005 | WO2005010937A2 Packaging of semiconductor devices for incrased reliability |
| 02/03/2005 | WO2005010927A2 Anisotropic electroconductive film and method for the production thereof |
| 02/03/2005 | WO2005010925A2 Integrated sensor chip unit |
| 02/03/2005 | WO2005010900A1 Inductors and transformers in integrated circuits |
| 02/03/2005 | WO2005010891A1 Ferroelectric and high dielectric constant integrated circuit capacitors with three-dimensional orientation for high density memories, and method of making the same |
| 02/03/2005 | WO2005010452A2 Thermal diffusion apparatus |
| 02/03/2005 | WO2004109770A3 Through wafer via process and amplifier with through wafer via |
| 02/03/2005 | WO2004107352A3 Use of voids between elements in semiconductor structures for isolation |
| 02/03/2005 | WO2004090942A3 Thermally conductive adhesive composition and process for device attachment |
| 02/03/2005 | WO2004079974A3 Industrial ethernet switch |
| 02/03/2005 | WO2004077506A3 Resistive vias in a substrate and method of making |
| 02/03/2005 | WO2004075261A3 Thermal interconnect systems methods of production and uses thereof |
| 02/03/2005 | WO2004061859A3 Stochastic assembly of sublithographic nanoscale interfaces |
| 02/03/2005 | WO2003063248A8 Semiconductor die package with semiconductor die having side electrical connection |
| 02/03/2005 | US20050028130 Customized mesh plane, method and computer program product for creating customized mesh planes within electronic packages |
| 02/03/2005 | US20050028126 Integrated circuit structure and a design method thereof |
| 02/03/2005 | US20050028125 Layout method for miniaturized memory array area |
| 02/03/2005 | US20050027055 bonded to a die and a heat sink; includes a phase-change polymer matrix material; heat spreading |
| 02/03/2005 | US20050026490 Electrical connector with safety load lever |
| 02/03/2005 | US20050026475 Connector |
| 02/03/2005 | US20050026438 Semiconductor processing methods |