Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2005
02/09/2005CN1578592A Mount assembly, optical transmission line and photoelectric circuit board
02/09/2005CN1578587A Hybrid integrated circuit device
02/09/2005CN1578419A Photographic elementsand producing and assembling method, camera and image reading unit
02/09/2005CN1577895A Thin-film semiconductor substrate, method of manufacturing thin-film semiconductor substrate, thin-film semiconductor device, and method of manufacture
02/09/2005CN1577878A Solid state image sensing device
02/09/2005CN1577874A Optical component and manufacture method of the same
02/09/2005CN1577873A Solid-state imaging device and method for manufacturing the same
02/09/2005CN1577872A Solid-state imaging device and method for manufacturing the same
02/09/2005CN1577870A 半导体装置 Semiconductor device
02/09/2005CN1577859A 半导体集成电路 The semiconductor integrated circuit
02/09/2005CN1577844A 电源装置 Power supply unit
02/09/2005CN1577842A 芯片装置 Chip device
02/09/2005CN1577841A Stacked chip semiconductor device and method for manufacturing the same
02/09/2005CN1577840A Stack package of semiconductor device
02/09/2005CN1577839A Hybrid integrated circuit
02/09/2005CN1577838A Semiconductor device with integrated overtemperature protection
02/09/2005CN1577835A Semiconductor device with alignment mark
02/09/2005CN1577834A Semiconductor integrated circuit device having diagonal direction wiring and layout method therefor
02/09/2005CN1577833A 半导体装置 Semiconductor device
02/09/2005CN1577832A Semiconductor device and method for fabricating the same
02/09/2005CN1577831A 半导体器件 Semiconductor devices
02/09/2005CN1577830A Electric interconnecting structure on substrate and producing method thereof
02/09/2005CN1577829A Semiconductor carrier film, and semiconductor device and liquid crystal module using the same
02/09/2005CN1577828A Semiconductor device and lead frame
02/09/2005CN1577827A Semiconductor device and its manufacturing method
02/09/2005CN1577826A Semiconductor device and mixed integrated circuit device
02/09/2005CN1577825A Lead frame for semiconductor packages
02/09/2005CN1577824A Method for making a direct chip attach device and structure
02/09/2005CN1577823A Semiconductor device and method of manufacturing the same
02/09/2005CN1577822A 芯片封装结构 Chip package structure
02/09/2005CN1577821A Laminated sheet
02/09/2005CN1577820A Semiconductor package and producing method thereof
02/09/2005CN1577819A Circuit board with in-built electronic component and method for manufacturing the same
02/09/2005CN1577817A Direct chip attach structure and method
02/09/2005CN1577816A Method for forming an encapsulated device and structure
02/09/2005CN1577815A High-density chip scale package and method of manufacturing the same
02/09/2005CN1577814A Foundation plate for semiconductor package structure
02/09/2005CN1577813A 电路模块及其制造方法 Circuit module and manufacturing method thereof
02/09/2005CN1577812A Diode presenting high breakdown voltage
02/09/2005CN1577811A Semiconductor device with anchor type seal ring and producing method thereof and semiconductor assembling structure
02/09/2005CN1577810A Semiconductor chip side contacting method
02/09/2005CN1577805A Storage node contact forming method and structure for use in semiconductor memory
02/09/2005CN1577798A Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus used in it
02/09/2005CN1577797A Structure and producing method of back-fuse type memory assembly
02/09/2005CN1577785A Power semiconductor module with detector for detecting main circuit current through power semiconductor element
02/09/2005CN1577783A Semiconductor device and method of manufacturing the same
02/09/2005CN1577782A Semiconductor device and method of manufacturing the same
02/09/2005CN1577781A Semiconductor device and manufacturing method of the same
02/09/2005CN1577777A Semiconductor device and method of fabricating the same,
02/09/2005CN1577776A Manufacturing method of a semiconductor device
02/09/2005CN1577768A Method for forming nickel silicide and semiconductor device
02/09/2005CN1577755A Laser beam processing method and laser beam processing machine
02/09/2005CN1577752A Method for forming transparent electrode membrane
02/09/2005CN1577736A Module with a built-in semiconductor and method for producing the same
02/09/2005CN1577733A Semiconductor wafer and method of manufacturing semiconductor device
02/09/2005CN1577725A Semiconductor device and method of manufacturing the same,
02/09/2005CN1577724A Semiconductor device and method of manufacturing the same
02/09/2005CN1577654A Magnetic coupler and electronic equipment using the same magnetic coupler
02/09/2005CN1577637A Silver alloy material, circuit substrate, electronic device, and method for manufacturing circuit substrate
02/09/2005CN1577390A IC module and IC card
02/09/2005CN1577212A 热辐射器 Heat radiator
02/09/2005CN1577082A Temperature calibration method for baking processing apparatus, adjustment method for development processing apparatus, and method of manufacturing semiconductor apparatus
02/09/2005CN1577081A Layout method for miniaturized memory array area
02/09/2005CN1577020A Connecting structure for conduction thin film and thin film transistor array panel including the same connection structure
02/09/2005CN1576853A 半导体器件 Semiconductor devices
02/09/2005CN1576782A Pattern inspection method and apparatus, and pattern alignment method
02/09/2005CN1576344A Method for producing a semiconductor-molding tablet, a semiconductor-molding tablet obtained thereby and a semiconductor device using the same
02/09/2005CN1576299A Siloxane-based resin containing germanium and an interlayer insulating film for a semiconductor device using the same
02/09/2005CN1576297A Siloxane-based resin and a semiconductor interlayer insulating film using the same
02/09/2005CN1576294A Polyimide resin for electrical insulating material
02/09/2005CN1576231A Method and apparatus for preparing aluminum nitride
02/09/2005CN1576229A Fluidic mems device
02/09/2005CN1189069C Shielding and radiating parts for microelectronic assemblies
02/09/2005CN1189065C Method for making printed circuit board with corrosion-resistant dry film
02/09/2005CN1188912C Vertical fuse and making method thereof
02/09/2005CN1188911C Security method and device for a chip stack with a multidimensional structure
02/09/2005CN1188910C Semiconductor chip and producing method thereof
02/09/2005CN1188908C Metallizing system
02/09/2005CN1188907C Electroplating appts.
02/09/2005CN1188906C Manufacturing method of stack chip package
02/09/2005CN1188367C Insulation ceramic press block, ceramic laminal substrate and ceramic electronic device
02/08/2005US6854030 Integrated circuit device having a capacitive coupling element
02/08/2005US6853679 Interconnect circuit for data transmission in an integrated circuit
02/08/2005US6853559 Thermal management of power delivery systems for integrated circuits
02/08/2005US6853555 Tube-in-plate cooling or heating plate
02/08/2005US6853178 Integrated circuit leadframes patterned for measuring the accurate amplitude of changing currents
02/08/2005US6853093 Anti-tampering enclosure for electronic circuitry
02/08/2005US6853092 Circuit board, mounting structure for semiconductor device with bumps, and electro-optic device and electronic device
02/08/2005US6853090 TAB tape for semiconductor package
02/08/2005US6853089 Semiconductor device and method of manufacturing the same
02/08/2005US6853087 Component and antennae assembly in radio frequency identification devices
02/08/2005US6853086 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument
02/08/2005US6853085 Method and device for securing a multi-dimensionally constructed chip stack and chip configuration
02/08/2005US6853084 Conducting wires for electroplating are not necessary to be formed on the substrate, so that the effective area for circuit layout pattern is increased and the noise is thus reduced.
02/08/2005US6853082 Method and structure for integrating metal insulator metal capacitor with copper
02/08/2005US6853081 Plug in a via connecting first wiring layer through first insulating layer that includes a titanium nitride film having halogen elements formed by chemical vapor deposition and includes a refractory metal film
02/08/2005US6853079 Conductive trace with reduced RF impedance resulting from the skin effect
02/08/2005US6853078 Semiconductor device and method for fabricating the same
02/08/2005US6853077 Ball electrode made of a Sn Zn-based lead-free solder of 7-9.5 wt % zinc and the remaining tin.
02/08/2005US6853076 Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same