| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/10/2005 | US20050029641 Semiconductor device and manufacturing method of the same |
| 02/10/2005 | US20050029640 Semiconductor device and method of manufacturing thereof |
| 02/10/2005 | US20050029639 Lead-frame-based semiconductor package and fabrication method thereof |
| 02/10/2005 | US20050029638 Leadframe and semiconductor package made using the leadframe |
| 02/10/2005 | US20050029637 Microelectronic die having a thermoelectric module |
| 02/10/2005 | US20050029636 Semiconductor package including flip chip |
| 02/10/2005 | US20050029635 Film substrate, semiconductor device, method of manufacturing film substrate, method of manufacturing semiconductor device and method of manufacturing circuit board with semiconductor device |
| 02/10/2005 | US20050029634 Topless semiconductor package |
| 02/10/2005 | US20050029633 Optical semiconductor device and method of manufacturing the same |
| 02/10/2005 | US20050029632 Circuit and method for suppression of electromagnetic coupling and switching noise in multilayer printed circuit boards |
| 02/10/2005 | US20050029631 Method of fabricating a semiconductor device having a photo-sensitive polyimide layer and a device fabricated in accordance with the method |
| 02/10/2005 | US20050029630 Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus |
| 02/10/2005 | US20050029628 Semiconductor device whose semiconductor chip has chamfered backside surface edges and method of manufacturing the same |
| 02/10/2005 | US20050029622 Antifuse structure and method of use |
| 02/10/2005 | US20050029621 Semiconductor device having fuse and its manufacture method |
| 02/10/2005 | US20050029620 Semiconductor device |
| 02/10/2005 | US20050029617 Semiconductor module |
| 02/10/2005 | US20050029612 Solid-state image sensing device, manufacturing method and attachment method thereof, imaging apparatus and image read unit for imaging apparatus |
| 02/10/2005 | US20050029609 Techniques to create low K ILD for beol |
| 02/10/2005 | US20050029598 Gate dielectric antifuse circuit to protect a high-voltage transistor |
| 02/10/2005 | US20050029596 Method and apparatus for preventing microcircuit thermo-mechanical damage during an ESD event |
| 02/10/2005 | US20050029595 Method and apparatus for preventing microcircuit dynamic thermo-mechanical damage during an esd event |
| 02/10/2005 | US20050029594 Thin layer semi-conductor structure comprising a heat distribution layer |
| 02/10/2005 | US20050029592 Method and structure for buried circuits and devices |
| 02/10/2005 | US20050029588 Protection circuit device using MOSFETs and a method of manufacturing the same |
| 02/10/2005 | US20050029587 Method and apparatus for forming an integrated circuit electrode having a reduced contact area |
| 02/10/2005 | US20050029566 Method for making a new metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer |
| 02/10/2005 | US20050029555 Silicon building blocks in integrated circuit packaging |
| 02/10/2005 | US20050029554 Molded ball grid array |
| 02/10/2005 | US20050029552 Bow control in an electronic package |
| 02/10/2005 | US20050029550 Semiconductor die packages with recessed interconnecting structures |
| 02/10/2005 | US20050029549 Molded stiffener for thin substrates |
| 02/10/2005 | US20050029546 Mounting structure |
| 02/10/2005 | US20050029534 Semiconductor device and method of manufacturing the same |
| 02/10/2005 | US20050029501 Low k interconnect dielectric using surface transformation |
| 02/10/2005 | US20050029334 Multi-functional solder and articles made therewith, such as microelectronic components |
| 02/10/2005 | US20050029329 Wire bonders and methods of wire-bonding |
| 02/10/2005 | US20050029112 an alkylsulfonic acid surfactant; water soluble tin (II) and silver (I) salts; linear, organic thioether compounds as complexing agents; electrodeposition; oxidation resistance; solder is suitable for high and low current densities; nontoxic |
| 02/10/2005 | US20050029011 Circuit board |
| 02/10/2005 | US20050029010 Void-free metal interconnection steucture and method of forming the same |
| 02/10/2005 | US20050029008 Surface mounted electronic circuit module |
| 02/10/2005 | US20050029002 Semiconductor integrated apparatus |
| 02/10/2005 | US20050028965 Combined structure of a thermal chamber and a thermal tower |
| 02/10/2005 | US20050028923 Process for the production of improved metallized films |
| 02/10/2005 | US20050028887 Electroconductive alloy of tin and lead; first fluxing agent reacting with oxide of metal to promote melting of metal at first temperature; second fluxing agent having higher melting temperature; resolidification; rosin or resin binder |
| 02/10/2005 | US20050028582 Capped microsensor |
| 02/10/2005 | US20050028363 Contact structures and methods for making same |
| 02/10/2005 | US20050028362 Method for producing a semiconductor device in chip format |
| 02/10/2005 | US20050028361 Integrated underfill process for bumped chip assembly |
| 02/10/2005 | US20050028359 Interface for heat exchanger; applying phase change material to interface; liquefaction of phase change mnaterial while controlling temperature; applying to mating; screen printing or stenciling |
| 02/10/2005 | DE4345300B4 Mfg. semiconductor component with first film on substrate - includes forming etching mask with aperture on films, leaving part of film free |
| 02/10/2005 | DE202004014777U1 Kühlkörper Heat Sink |
| 02/10/2005 | DE19506091B4 Kühlelement Cooling element |
| 02/10/2005 | DE10336171B3 Multichip-Schaltungsmodul und Verfahren zur Herstellung hierzu Multichip circuit module and method for manufacturing this, |
| 02/10/2005 | DE10334577B3 Verfahren zum Aufbringen einer Umverdrahtung auf einen Nutzen unter Kompensation von Positionsfehlern und Halbleiterchips in Bauteilpositionen des Nutzens Method for applying a rewiring of a benefit under compensation of position errors and semiconductor chips in component positions of the benefits |
| 02/10/2005 | DE10331923A1 Elektronische Schaltung mit einem Leistungshalbleiterbauelement und mit einem Sicherungsmittel zum Schutz des Leistungshalbleiterbauelements vor Überhitzung An electronic circuit comprising a power semiconductor component and with a safety means for protecting the power semiconductor device against overheating |
| 02/10/2005 | DE10331208A1 Method for securing electric or electronic components, generating waste heat, to cooler of aluminum, or its alloy, with cooler enameled, at least in fastening region of components, |
| 02/10/2005 | DE10331026B3 Heat sink element for electronic component has projection of heat-conductive core of heat sink body fitting into opening in base element used for contacting electronic component |
| 02/10/2005 | DE10330053A1 Semiconductor component with pressure contact and its round surround, e.g. high voltage (HV) thyristor for HV rectifier for distribution of electric energy, comprising connecting electrode on one semiconductor side |
| 02/10/2005 | DE10316357B4 Verfahren zur Überwachung von Leistungshalbleiterbauelementen The method for monitoring power semiconductor components |
| 02/10/2005 | DE10305365B4 Verfahren und Anordnung zum Kontaktieren von Anschlüssen eines Bipolartransistors Method and apparatus for contacting terminals of a bipolar transistor |
| 02/10/2005 | DE102004029023A1 Leistungshalbleitermodul mit einem Detektor zum Erfassen eines durch ein Leistungshalbleiterbauteil fliessenden Schaltungshauptstroms Power semiconductor module with a detector for detecting a current flowing through a power semiconductor device circuit the main current |
| 02/09/2005 | EP1505860A1 Surface mounted electronic circuit module |
| 02/09/2005 | EP1505858A2 Circuit module and manufacturing method thereof |
| 02/09/2005 | EP1505856A2 Circuit board and semiconductor device using the same |
| 02/09/2005 | EP1505646A1 IC-Chip with Nanowires |
| 02/09/2005 | EP1505645A2 Resin moulded electronic module |
| 02/09/2005 | EP1505644A2 Thermally enhanced electronic module |
| 02/09/2005 | EP1505643A2 Semiconductor device and manufacturing method thereof |
| 02/09/2005 | EP1505638A2 Method of producing of a break-proof plate-like object, and corresponding semiconductor circuit |
| 02/09/2005 | EP1504476A2 Method for fixing a semiconductor chip in a plastic housing body, optoelectronic semiconductor component and method for the production thereof |
| 02/09/2005 | EP1504469A1 Semiconductor package and method of preparing same |
| 02/09/2005 | EP1504468A2 Microelectronic assembly with die support and method |
| 02/09/2005 | EP1504466A2 Metal object to be at least partially coated with a substance |
| 02/09/2005 | EP1504138A2 Method for using low dielectric constant film by electron beam |
| 02/09/2005 | EP1503870A1 Method and apparatus for two dimensional assembly of particles |
| 02/09/2005 | EP1401987B1 Thermoconductive composition |
| 02/09/2005 | CN2678142Y Packing structure of optical sensing chip |
| 02/09/2005 | CN2678140Y LED luminous module |
| 02/09/2005 | CN2678139Y Light source structure of LED |
| 02/09/2005 | CN2678137Y CUP fan wind cover heat sink structure of computer mainframe |
| 02/09/2005 | CN2678136Y Curved heat pipe radiator |
| 02/09/2005 | CN2678135Y Heat pipe and radiator with the heat pipe |
| 02/09/2005 | CN2678134Y Radiating plate with thermal expanding conductor |
| 02/09/2005 | CN2678133Y Radiating device with circulating runner |
| 02/09/2005 | CN2678132Y Conjoined needling type plane heat pipe radiating device |
| 02/09/2005 | CN2678131Y 散热器 Heat sink |
| 02/09/2005 | CN2678130Y Fastener of radiation device |
| 02/09/2005 | CN2678129Y Protection device for heat conduction medium of radiator |
| 02/09/2005 | CN2677852Y Heat-pipe sealing structure |
| 02/09/2005 | CN2677755Y Integral lamp with metal radiator |
| 02/09/2005 | CN1579021A Method of manufacture of silicon on insulator device with improved heat removal |
| 02/09/2005 | CN1579020A Semiconductor device and producing method thereof |
| 02/09/2005 | CN1579019A Alternate bump metallurgy bars for power and ground routing |
| 02/09/2005 | CN1579018A Integrated circuit device with bump bridges and method for making the same |
| 02/09/2005 | CN1579017A Locally increasing sidewall density by ion implantation |
| 02/09/2005 | CN1579015A 模块部件 Module Features |
| 02/09/2005 | CN1578879A Internal blower with air end shell and cooling unit and electronic device containing the same blower |
| 02/09/2005 | CN1578614A Axial-flow fan unit and heat-emitting element cooling apparatus |
| 02/09/2005 | CN1578601A Module with embedded semiconductor and method of fabricating the module |