Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2014
03/13/2014WO2014037263A1 Housing for an optical component, assembly, method for producing a housing and method for producing an assembly
03/13/2014WO2014036976A1 Devices and methods for 2.5d interposers
03/13/2014WO2014036594A1 Digital isolator with improved cmti
03/13/2014US20140073721 Resin composition, prepreg and resin sheet and metal foil-clad laminate
03/13/2014US20140073127 Semiconductor device and information processing system including the same
03/13/2014US20140073088 Electronic component mounting line and electronic component mounting method
03/13/2014US20140073068 Method of manufacturing semiconductor device
03/13/2014US20140072774 Substrate bonding apparatus, substrate holding apparatus, substrate bonding method, substrate holding method, multilayered semiconductor device, and multilayered substrate
03/13/2014US20140071650 Wireless module with active devices
03/13/2014US20140071632 Semiconductor device, communication device, and semiconductor package
03/13/2014US20140071566 Overvoltage protection for multi-chip module and system-in-package
03/13/2014US20140070907 Galvanic isolation interface for high-speed data link for spacecraft electronics, and method of using same
03/13/2014US20140070862 Timing calibration for on-chip interconnect
03/13/2014US20140070835 TFT-LCD array substrate and test method for the same
03/13/2014US20140070428 Semiconductor device and method for manufacturing the same
03/13/2014US20140070427 Semiconductor Device and Method of Forming Conductive THV and RDL on Opposite Sides of Semiconductor Die for RDL-to-RDL Bonding
03/13/2014US20140070426 Integrated circuit devices including a via structure and methods of fabricating integrated circuit devices including a via structure
03/13/2014US20140070425 Semiconductor device and manufacturing method thereof
03/13/2014US20140070424 Semiconductor package, method of fabricating the semiconductor package, and interposer structure of the semiconductor package
03/13/2014US20140070423 Tunable composite interposer
03/13/2014US20140070422 Semiconductor Device with Discrete Blocks
03/13/2014US20140070421 Integrated circuit package
03/13/2014US20140070420 Chip To Package Interface
03/13/2014US20140070418 Semiconductor interconnect structure having enhanced performance and reliability
03/13/2014US20140070417 Semiconductor device having barrier metal layer
03/13/2014US20140070416 Guard ring structure and method for forming the same
03/13/2014US20140070415 Microelectronic packages having trench vias and methods for the manufacture thereof
03/13/2014US20140070413 Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus
03/13/2014US20140070412 Semiconductor Device and Method for Manufacturing the Same
03/13/2014US20140070411 Semiconductor device
03/13/2014US20140070410 Semiconductor Device and Method of Forming Multi-Layered UBM with Intermediate Insulating Buffer Layer to Reduce Stress for Semiconductor Wafer
03/13/2014US20140070409 Semiconductor device and semiconductor assembly with lead-free solder
03/13/2014US20140070408 Plating Structure For Wafer Level Packages
03/13/2014US20140070407 Semiconductor package and method of fabricating the same
03/13/2014US20140070406 Devices and Methods for 2.5D Interposers
03/13/2014US20140070405 Stacked semiconductor devices with a glass window wafer having an engineered coefficient of thermal expansion and methods of making same
03/13/2014US20140070404 Semiconductor package structure and interposer therefor
03/13/2014US20140070403 Packaging Methods and Packaged Devices
03/13/2014US20140070402 Stress Reduction Apparatus
03/13/2014US20140070401 Extrusion-resistant solder interconnect structures and methods of forming
03/13/2014US20140070400 Semiconductor device
03/13/2014US20140070399 Electrochemically deposited indium composites
03/13/2014US20140070398 Power semiconductor device and method of manufacturing the same
03/13/2014US20140070397 High power semiconductor package subsystems
03/13/2014US20140070396 Semiconductor package and manufacturing method
03/13/2014US20140070395 Electronic device and manufacturing method thereof
03/13/2014US20140070394 Semiconductor device
03/13/2014US20140070393 Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks
03/13/2014US20140070392 Common drain power clip for battery pack protection mosfet
03/13/2014US20140070391 Lead carrier with print-formed terminal pads
03/13/2014US20140070390 Multi-chip packaging structure and method
03/13/2014US20140070389 Manufacturing method of semiconductor device and semiconductor device
03/13/2014US20140070388 Semiconductor device and method of assembling same
03/13/2014US20140070387 Coupling assembly of power semiconductor device and pcb and method for manufacturing the same
03/13/2014US20140070385 Flip-chip package structure and method for an integrated switching power supply
03/13/2014US20140070384 Stacked semiconductor device and printed circuit board
03/13/2014US20140070383 Pre-Molded MEMS Device Package with Conductive Shell
03/13/2014US20140070381 Semiconductor memory card
03/13/2014US20140070380 Bridge interconnect with air gap in package assembly
03/13/2014US20140070375 Electronic device including a via and a conductive structure, a process of forming the same, and an interposer
03/13/2014US20140070374 Semiconductor device and method of fabricating semiconductor device
03/13/2014US20140070368 Semiconductor device
03/13/2014US20140070367 Semiconductor device
03/13/2014US20140070364 Anti-fuse device
03/13/2014US20140070363 Electronic anti-fuse
03/13/2014US20140070362 E-fuse structures and methods of manufacture
03/13/2014US20140070346 Radio-frequency device package and method for fabricating the same
03/13/2014US20140070337 Integrated circuit including an environmental sensor
03/13/2014US20140070329 Wireless module with active and passive components
03/13/2014US20140070214 Semiconductor device
03/13/2014US20140069703 Dual row quad flat no-lead semiconductor package
03/13/2014US20140069611 Heat Dissipater
03/13/2014US20140069564 Die Bonder And Bonding Method
03/13/2014US20140069490 Lead Frame Package for Solar Concentrators
03/13/2014DE112012002724T5 Leiterrahmen und Leistungsmodul Ladder frame and power module
03/13/2014DE102013217830A1 Timing-Kalibrierung für chipinterne Verdrahtung Timing calibration for on-chip wiring
03/13/2014DE102013215392A1 Leistungshalbleitervorrichtung und Verfahren zu deren Herstellung Power semiconductor device and process for their preparation
03/13/2014DE102013112423A1 Component e.g. semiconductor chip, for use in electronic device, has insulating layer arranged above first metal coating, second metal coating applied above insulating layer, and ductile metal film arranged between metal coatings
03/13/2014DE102013110006A1 Schnittstelle von Chip zu Kapselung Interface from chip to encapsulation
03/13/2014DE102013109881A1 Verfahren zur Herstellung einer Chipanordnung, Verfahren zur Herstellung einer Chipbaugruppe, Chipbaugruppe und Chipanordnungen A method for producing a chip arrangement, method for producing a chip module, chip package and chip assemblies
03/13/2014DE102013109297A1 Halbleitervorrichtungen mit Stützmustern in Zwischenraumbereichen zwischen leitfähigen Mustern und Verfahren zum Herstellen derselben Semiconductor devices with support patterns in space areas between conductive patterns and methods of making the same
03/13/2014DE102013108946A1 Halbleitervorrichtung, integrierte Schaltung und Herstellungsverfahren hierfür A semiconductor device, integrated circuit, and manufacturing method thereof
03/13/2014DE102013108585A1 Halbleitervorrichtung mit einer entspannungsschicht und herstellungsverfahren Semiconductor device having a relaxation layer and manufacturing processes
03/13/2014DE102013014881A1 Verbesserte Silizium-Durchkontaktierung mit einer Füllung aus mehreren-Materialien Improved Through-silicon via with a filling of several materials
03/13/2014DE102012216086A1 Power electronics module used in e.g. automotive industry, has housing comprising first gap with cooling fluid between layer facing first inner surface of housing, and thermally conductive and electrically insulating layer
03/13/2014DE102012108522A1 Method for manufacturing semiconductor stack for stacking semiconductor chips with components for three-dimensional integration of electronic circuit, involves arranging through-contacts in aperture after connecting stack components
03/13/2014DE102012108413A1 Gehäuse für ein optoelektronisches Bauteil, Optoelektronisches Bauelement und Verfahren zur Herstellung des optoelektronischen Bauelements A housing for an optoelectronic device, optoelectronic component and method of manufacturing the optoelectronic component,
03/13/2014DE102012106566A9 Leistungshalbleiterchip mit zwei Metallschichten auf einer Fläche Power semiconductor chip with two metal layers on a surface
03/13/2014DE102012018013A1 Planar helical coil e.g. three spiral superposed coils, has central terminal made by semiconductor substrate using metal one-semiconductor contacts in external supplying unit, where metal one-semiconductor contacts are provided at coil
03/13/2014DE10196677B4 Elektrodenstruktur und Verfahren zum Herstellen eines Dünnschicht-Strukturkörpers Electrode structure and method of manufacturing a thin-film structure body
03/12/2014EP2706571A2 One-time programmable memory cell
03/12/2014EP2706569A2 Radiator, electronic apparatus and cooling apparatus
03/12/2014EP2706568A2 Cooling unit and electronic equipment
03/12/2014EP2706567A1 Integrated circuit including an environmental sensor
03/12/2014EP2706410A1 Semiconductor device and method of manufacturing the same
03/12/2014EP2705737A1 Systems and methods for cooling of power electronic devices
03/12/2014EP2705536A1 Non-planar chip assembly
03/12/2014EP2705533A1 Package-on-package assembly with wire bonds to encapsulation surface
03/12/2014EP2705532A2 Radio- and electromagnetic interference through-silicon vias for stacked-die packages, and methods of making same
03/12/2014EP2705531A2 Method for producing reconstituted wafers with support of the chips during their encapsulation
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