| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/16/2005 | CN1581471A Heat-tube radiator for integrated circuit and its manufacturing method |
| 02/16/2005 | CN1581470A Connector |
| 02/16/2005 | CN1581464A Semiconductor element manufacturing method by detecting nitride content of gage silicon oxide layer |
| 02/16/2005 | CN1581454A Encapsulated pin structure for improved reliability of wafer |
| 02/16/2005 | CN1581453A Semiconductor and its making method |
| 02/16/2005 | CN1581432A Processing method and method for making semiconductor device |
| 02/16/2005 | CN1581428A 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 02/16/2005 | CN1581366A Electronic equipment provided with cooling system |
| 02/16/2005 | CN1581359A Semiconductor testing apparatus using leakage current and compensation system for leakage current |
| 02/16/2005 | CN1581354A Semiconductor device |
| 02/16/2005 | CN1580917A Thin-film transistor array panel and its making method |
| 02/16/2005 | CN1580535A Mounting structure of electronic device |
| 02/16/2005 | CN1190113C Ceramic laminated device |
| 02/16/2005 | CN1189941C 静电放电保护电路 Electrostatic discharge protection circuit |
| 02/16/2005 | CN1189940C Blocking circuit for IC |
| 02/16/2005 | CN1189939C Semiconductor device and making method |
| 02/16/2005 | CN1189938C Wire solder free semiconductor device and package method thereof |
| 02/16/2005 | CN1189937C Readiator |
| 02/16/2005 | CN1189936C Adhesive film for semiconductor, leadframe using the same, semiconductor device and its manufacturing method |
| 02/16/2005 | CN1189930C Weld interface with mechanical strengthened and its method |
| 02/16/2005 | CN1189929C Electronic element mounting body and its producing method and electronic apparatus using it |
| 02/16/2005 | CN1189927C Dielectric film forming material, delectric film method of forming delectric film and semiconductor device |
| 02/16/2005 | CN1189517C 热固性树脂组合物 The thermosetting resin composition |
| 02/15/2005 | US6856921 Adaptable heat dissipation device for a personal computer |
| 02/15/2005 | US6856562 Test structure for measuring a junction resistance in a DRAM memory cell array |
| 02/15/2005 | US6856511 Methods and apparatus for attaching a heat sink to a circuit board component |
| 02/15/2005 | US6856510 Efficient cooler |
| 02/15/2005 | US6856501 Capacitor having copper electrodes and diffusion barrier layers |
| 02/15/2005 | US6856442 Transmission line, optical module using the same and manufacturing method of optical module |
| 02/15/2005 | US6856235 Methods for manufacturing resistors using a sacrificial layer |
| 02/15/2005 | US6856228 Integrated inductor |
| 02/15/2005 | US6856226 Integrated transformer |
| 02/15/2005 | US6856225 Photolithographically-patterned out-of-plane coil structures and method of making |
| 02/15/2005 | US6856213 High frequency composite switch module |
| 02/15/2005 | US6856123 Semiconductor device provided with regulator circuit having reduced layout area and improved phase margin |
| 02/15/2005 | US6856037 Method and apparatus for converting dissipated heat to work energy |
| 02/15/2005 | US6856029 Process independent alignment marks |
| 02/15/2005 | US6856028 Alleviating stress developing in a solder joint of the external electrodes of the circuit board. |
| 02/15/2005 | US6856026 Semiconductor chip, wiring board and manufacturing process thereof as well as semiconductor device |
| 02/15/2005 | US6856025 Chip and wafer integration process using vertical connections |
| 02/15/2005 | US6856023 Semiconductor device and method of manufacturing semiconductor device |
| 02/15/2005 | US6856022 Semiconductor device |
| 02/15/2005 | US6856021 Aluminum metal conductors formed on a side of a main face of a substrate and suppresses the precipitation of copper |
| 02/15/2005 | US6856020 Semiconductor device and method for fabricating the same |
| 02/15/2005 | US6856019 Semiconductor integrated circuit device |
| 02/15/2005 | US6856018 Semiconductor device and method of manufacture thereof |
| 02/15/2005 | US6856017 Device having resin package and method of producing the same |
| 02/15/2005 | US6856016 Method and apparatus using nanotubes for cooling and grounding die |
| 02/15/2005 | US6856015 Semiconductor package with heat sink |
| 02/15/2005 | US6856014 Method for fabricating a lid for a wafer level packaged optical MEMS device |
| 02/15/2005 | US6856013 Integrated circuit packages, ball-grid array integrated circuit packages and methods of packaging an integrated circuit |
| 02/15/2005 | US6856012 Contact system |
| 02/15/2005 | US6856011 Semiconductor chip package and method of fabricating same |
| 02/15/2005 | US6856009 Techniques for packaging multiple device components |
| 02/15/2005 | US6856008 Laminated multilayer package |
| 02/15/2005 | US6856007 High-frequency chip packages |
| 02/15/2005 | US6856006 Encapsulation method and leadframe for leadless semiconductor packages |
| 02/15/2005 | US6856004 Compact layout for a semiconductor device |
| 02/15/2005 | US6855997 Mask, exposure method, line width measuring method, and method for manufacturing semiconductor devices |
| 02/15/2005 | US6855967 Utilization of MACRO power routing area for buffer insertion |
| 02/15/2005 | US6855964 Triggering of an ESD NMOS through the use of an N-type buried layer |
| 02/15/2005 | US6855955 Thin film transistor array panel |
| 02/15/2005 | US6855953 Electronic circuit assembly having high contrast fiducial |
| 02/15/2005 | US6855952 Semiconductor device and semiconductor package |
| 02/15/2005 | US6855946 Fiducial transistor in an integrated circuit |
| 02/15/2005 | US6855893 Wiring board, semiconductor device, electronic device, and circuit board for electronic parts |
| 02/15/2005 | US6855886 Photodetection sensor |
| 02/15/2005 | US6855885 Electrical component housing |
| 02/15/2005 | US6855880 Modular thermoelectric couple and stack |
| 02/15/2005 | US6855648 Method of reducing stress migration in integrated circuits |
| 02/15/2005 | US6855628 Semiconductor processing methods of forming contact openings, methods of forming electrical connections and interconnections, and integrated circuitry |
| 02/15/2005 | US6855626 Wiring substrate having position information |
| 02/15/2005 | US6855624 Low-loss on-chip transmission line for integrated circuit structures and method of manufacture |
| 02/15/2005 | US6855611 Fabrication method of an electrostatic discharge protection circuit with a low resistant current path |
| 02/15/2005 | US6855610 Method of forming self-aligned contact structure with locally etched gate conductive layer |
| 02/15/2005 | US6855586 Low voltage breakdown element for ESD trigger device |
| 02/15/2005 | US6855579 Semiconductor device and process for fabrication thereof |
| 02/15/2005 | US6855577 Semiconductor devices having different package sizes made by using common parts |
| 02/15/2005 | US6855575 Semiconductor chip package having a semiconductor chip with center and edge bonding pads and manufacturing method thereof |
| 02/15/2005 | US6855574 Stress balanced semiconductor packages, method of fabrication and modified mold segment |
| 02/15/2005 | US6855573 Integrated circuit package and manufacturing method therefor with unique interconnector |
| 02/15/2005 | US6855572 Castellation wafer level packaging of integrated circuit chips |
| 02/15/2005 | US6855566 Optical semiconductor module and method of producing the same |
| 02/15/2005 | US6855441 Functionally improved battery and method of making same |
| 02/15/2005 | US6855418 Tape for forming resin tie bar, resin tie bar, lead frame equipped with resin tie bar, resin-molded semiconductor device, and method for producing same |
| 02/15/2005 | US6855399 Copper paste and wiring board using the same |
| 02/15/2005 | US6855004 Electrostatic protection cover |
| 02/15/2005 | US6854636 Structure and method for lead free solder electronic package interconnections |
| 02/15/2005 | US6854181 Folded-fin heat sink assembly and method of manufacturing same |
| 02/15/2005 | US6854179 Modification of circuit features that are interior to a packaged integrated circuit |
| 02/15/2005 | CA2325148C Bus bar heat sink |
| 02/12/2005 | CA2476251A1 Heat sink |
| 02/10/2005 | WO2005013658A1 Power element cooling device |
| 02/10/2005 | WO2005013657A1 Electronic device cooler |
| 02/10/2005 | WO2005013364A2 Electronic component and panel for producing the same |
| 02/10/2005 | WO2005013363A2 Circuit arrangement placed on a substrate and method for producing the same |
| 02/10/2005 | WO2005013362A1 Phase change thermal interface materials using polyester resin and clay filled |
| 02/10/2005 | WO2005013360A1 Flip chip mounting substrate |
| 02/10/2005 | WO2005013359A1 Semiconductor device |
| 02/10/2005 | WO2005013358A2 Arrangement of an electrical component placed on a substrate, and method for producing the same |