| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/17/2005 | US20050035451 Semiconductor chip with bumps and method for manufacturing the same |
| 02/17/2005 | US20050035449 Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors |
| 02/17/2005 | US20050035448 Chip package structure |
| 02/17/2005 | US20050035447 Heat releasing member, package for accommodating semiconductor element and semiconductor device |
| 02/17/2005 | US20050035446 Packaged microchip with premolded-type package |
| 02/17/2005 | US20050035445 Power semiconductor module with deflection-resistant base plate |
| 02/17/2005 | US20050035444 Multi-chip package device with heat sink and fabrication method thereof |
| 02/17/2005 | US20050035442 Electrically isolated and thermally conductive double-sided pre-packaged component |
| 02/17/2005 | US20050035440 Stacked chip assembly with stiffening layer |
| 02/17/2005 | US20050035439 Semiconductor module with scalable construction |
| 02/17/2005 | US20050035438 Insulation sheet and apparatus utilizing the same |
| 02/17/2005 | US20050035437 Package part and method of manufacturing the part |
| 02/17/2005 | US20050035436 Chip packaging and connection for reduced emi |
| 02/17/2005 | US20050035435 Method for fabricating semiconductor components using mold cavities having runners configured to minimize venting |
| 02/17/2005 | US20050035434 Module for EPAS/EHPAS applications |
| 02/17/2005 | US20050035433 Semiconductor device having a measuring pattern and a method of measuring the semiconductor device using the measuring pattern |
| 02/17/2005 | US20050035416 Semiconductor device with improved protection from electrostatic discharge |
| 02/17/2005 | US20050035403 System with meshed power and signal buses on cell array |
| 02/17/2005 | US20050035379 Semiconductor device structured to prevent oxide damage during HDP CVD |
| 02/17/2005 | US20050035347 Probe card assembly |
| 02/17/2005 | US20050035270 Solid state image pickup device and method of fabricating the same |
| 02/17/2005 | US20050035182 Circuit board transferring apparatus and method and solder ball mounting method |
| 02/17/2005 | US20050035092 Method of making a hybrid housing and hybrid housing |
| 02/17/2005 | US20050034888 Encapsulated component which is small in terms of height and method for producing the same |
| 02/17/2005 | US20050034885 Three demensional dynamicaly shielded high-q beol metallization |
| 02/17/2005 | US20050034845 Cooling device having fins arranged to funnel air |
| 02/17/2005 | US20050034841 Integral chip lid and heat sink |
| 02/17/2005 | US20050034818 Apparatus and methods for coverlay removal and adhesive application |
| 02/17/2005 | US20050034577 Apparatus and method for indexing and severing film |
| 02/17/2005 | US20050034526 Semiconductor sensor and method of plating semiconductor devices |
| 02/17/2005 | US20050034466 Electronic equipment provided with cooling system |
| 02/17/2005 | DE19745387B4 Halbleiter-Beschleunigungserfassungsvorrichtung Semiconductor acceleration detecting device |
| 02/17/2005 | DE10348253B3 Bonding of electronic chips inside a radiation transparent housing comprises directing radiation of specific wavelength through the housing wall to cure adhesive between chip and wall |
| 02/17/2005 | DE10345391B3 Multi-chip module for a semiconductor device comprises a rewiring arrangement formed as a contact device on the substrate and on a contact protrusion |
| 02/17/2005 | DE10341246B3 Cooling system for use with electronic equipment uses closed circuit fluid system having evaporator and condenser |
| 02/17/2005 | DE10334124A1 Haftung von Strukturen aus schlecht haftenden Materialien Liability of structures from poorly adhering materials |
| 02/17/2005 | DE10333251A1 Communications semiconductor component has temperature measurement means for measuring a barrier layer temperature of a semiconductor circuit arrangement mounted on it |
| 02/17/2005 | DE10332877A1 Vorrichtung und Verfahren zur Rückseitenbearbeitung von Halbleiterbausteinen Apparatus and method for backworking of semiconductor devices |
| 02/17/2005 | DE10332333A1 Detektormodul Detector module |
| 02/17/2005 | DE10332303A1 Components retainer/holder especially for micro-electronic circuits and micro-mechanical components e.g. revs sensor, has slightly deformable zone and badly deformable zone |
| 02/17/2005 | DE10331574A1 Leistungshalbleitermodul The power semiconductor module |
| 02/17/2005 | DE10331570A1 Halbleiterchip Semiconductor chip |
| 02/17/2005 | DE10331522A1 Reduction of phantom artifacts in digital radiographs produced with a digital detector by maintaining planar substrate, reading matrix and scintillator at a constant raised temperature using a temperature regulating heater element |
| 02/17/2005 | DE10331453A1 Method for forming thermal bridge(s) for waste heat dissipation from substrate carrying, or containing electronic components etc., forming recess(es) in substrate and fitting in it thermally conductive body |
| 02/17/2005 | DE10330192A1 Elektrisch leitender Körper mit einer Haftvermittlungsschicht sowie Verfahren zum Abscheiden einer Haftvermittlungsschicht Electrically conductive body having a bonding layer and methods for depositing a bonding layer |
| 02/17/2005 | DE10329329A1 Kostengünstiges Hochfrequenz-Package Low-cost high-frequency Package |
| 02/17/2005 | DE10327415B3 Cooler housing for electronic components in vehicles has a cover part with radial tags which bend over and are pressed into an external undercut on the outside of a container part |
| 02/17/2005 | DE102004028716A1 Halbleitervorrichtung Semiconductor device |
| 02/17/2005 | DE10162242B4 Leistungshalbleiterbauelement für beispielsweise Halbbrückenschaltungen Power semiconductor component for example, half-bridge circuits |
| 02/17/2005 | DE10159119B4 Umrichter in Druckkontaktierung Inverter in pressure contact |
| 02/16/2005 | EP1507449A2 Electronic equipment provided with cooling system |
| 02/16/2005 | EP1507295A2 Method for manufacturing solid-state imaging devices |
| 02/16/2005 | EP1507291A2 Power module for solid state relay |
| 02/16/2005 | EP1507290A2 Heat Sink |
| 02/16/2005 | EP1507289A2 Diffusion barrier for copper lines in integrated circuits |
| 02/16/2005 | EP1507284A2 Apparatus and method for indexing and severing film |
| 02/16/2005 | EP1507267A1 Wiring material and wiring board using the same |
| 02/16/2005 | EP1506952A2 Cyclohexanetricarboxylic monoester and its use |
| 02/16/2005 | EP1506701A1 Improved structure of stacked vias in multiple layer electronic device carriers |
| 02/16/2005 | EP1506578A2 Glass material for use at high frequencies |
| 02/16/2005 | EP1506577A1 Connecting device for contacting a semiconductor component |
| 02/16/2005 | EP1506576A1 Cooling devices for cooling electric components, module consisting of a cooling device and electric components and assembly comprising a cooling device or module and a support |
| 02/16/2005 | EP1506568A2 Direct-connect signaling system |
| 02/16/2005 | EP1506054A1 Micro-reactor and micro-channel heat exchanger |
| 02/16/2005 | EP1410403A4 Low temperature method and compositions for producing electrical conductors |
| 02/16/2005 | EP1242223B1 Method for molding materials on a planar substrate |
| 02/16/2005 | CN2679850Y Heat collector runner structure of liquid cooling radiator |
| 02/16/2005 | CN2679849Y Combined radiator |
| 02/16/2005 | CN2679848Y Radiator for clear liquid vacuum current conducting electronic semiconductor element |
| 02/16/2005 | CN2679847Y Buckling means for radiator |
| 02/16/2005 | CN2679846Y Radiating modular fixing structure |
| 02/16/2005 | CN2679845Y Locking means of radiator |
| 02/16/2005 | CN2679844Y Radiator of CPU |
| 02/16/2005 | CN2679843Y Closure head for surface mounting assembly |
| 02/16/2005 | CN2679786Y Control chip of LED panel |
| 02/16/2005 | CN1582496A Low cost microelectronic circuit package |
| 02/16/2005 | CN1582495A Wirebond structure and method to connect to a microelectronic die |
| 02/16/2005 | CN1582494A An electronic assembly having a wetting layer on a thermally conductive heat spreader |
| 02/16/2005 | CN1582491A Method of forming reliable Cu interconnects |
| 02/16/2005 | CN1582486A Semiconductor device and method for fabricating same |
| 02/16/2005 | CN1582414A Composition having permitivity being radiation-sensitively changeable and method for forming permitivity pattern |
| 02/16/2005 | CN1582104A Radiating system using silicon rubber |
| 02/16/2005 | CN1582087A Electronic circuit unit |
| 02/16/2005 | CN1582086A 电子线路单元 Electronic circuit unit |
| 02/16/2005 | CN1581524A Light-emitting diode lamp |
| 02/16/2005 | CN1581520A Semiconductor carrier for photoelectric device package |
| 02/16/2005 | CN1581502A Method for manufacturing solid-state imaging devices |
| 02/16/2005 | CN1581501A Solid-state imaging device and method for manufacturing the same |
| 02/16/2005 | CN1581483A Semiconductor device and its making method, circuit substrate and electronic machine |
| 02/16/2005 | CN1581482A Circuit moudel |
| 02/16/2005 | CN1581481A ESD protection circuit with control circuit |
| 02/16/2005 | CN1581480A Static discharge protective circuit structure |
| 02/16/2005 | CN1581479A Semiconductor device |
| 02/16/2005 | CN1581478A 半导体集成电路装置 The semiconductor integrated circuit device |
| 02/16/2005 | CN1581477A Semiconductor device and its making method |
| 02/16/2005 | CN1581476A Void-free metal interconnection steucture and method of forming the same |
| 02/16/2005 | CN1581475A Wire-layingout structure |
| 02/16/2005 | CN1581474A Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package |
| 02/16/2005 | CN1581473A Lead frame and its manufacturing method and semiconductor device |
| 02/16/2005 | CN1581472A Wire-layingout plate and its making method, semiconductor device and its making method |