Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2005
02/23/2005CN2681349Y An auxiliary heat-exchanging device
02/23/2005CN2681348Y Liquid cooling type heat sink
02/23/2005CN2681347Y Heat radiation and circulation system
02/23/2005CN2681346Y Heat pipe radiator for assistant heat radiation using power supply fan
02/23/2005CN2681345Y Heat sink using heat pipe
02/23/2005CN2681344Y Heat sink assembly
02/23/2005CN2681343Y Heat sink using heat pipe
02/23/2005CN2681342Y Heat sink using heat pipe
02/23/2005CN2681341Y Heat sink using heat pipe
02/23/2005CN2681340Y Flat and long heat exchanger
02/23/2005CN2681339Y 热交换器 Heat exchanger
02/23/2005CN2681338Y Highly effective aluminium sunflower radiating fin
02/23/2005CN2681337Y Radiator having radiating fins
02/23/2005CN2681336Y Heat sink
02/23/2005CN2681335Y Heat sink
02/23/2005CN2681334Y Fixed compression bar of heat radiating component
02/23/2005CN2681333Y Heat sink
02/23/2005CN2681332Y 散热器固定装置 Sink fixtures
02/23/2005CN2681331Y Heat sink
02/23/2005CN2681330Y 散热器固定装置 Sink fixtures
02/23/2005CN2681329Y 散热器固定装置 Sink fixtures
02/23/2005CN2681328Y Fastener of radiator
02/23/2005CN2681327Y Flip-chip heat radiation packaging arrangement
02/23/2005CN2681326Y Heat sink
02/23/2005CN2681325Y Apertured structure ceramic radiator
02/23/2005CN2681217Y Locking device for radiator
02/23/2005CN2681215Y A computer heat sink
02/23/2005CN1586005A Contactor device of semiconductor integrated element
02/23/2005CN1585991A Magnetic component
02/23/2005CN1585960A Method for making a module comprising at least an electronic component
02/23/2005CN1585591A Flexible circuit board mounted with semiconductor chip and method for mounting semiconductor chip
02/23/2005CN1585589A Electric circuit substrate
02/23/2005CN1585244A Radiating mechanism for semi-control rectifying bridge of permanent magnetic generator set
02/23/2005CN1585125A 电路装置 Circuit device
02/23/2005CN1585124A Fuse circuit
02/23/2005CN1585123A Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip typ
02/23/2005CN1585122A Composite scab structure and producing method thereof
02/23/2005CN1585121A Packaging structure with projected zone carrying crystals, crystals carried substrate and crystals carried assembly
02/23/2005CN1585120A Liquid cooling radiator
02/23/2005CN1585119A Air outlet flow guiding structure of radiating fan
02/23/2005CN1585118A Air outlet flow guiding structure of radiating fan
02/23/2005CN1585117A Air outlet flow guiding structure of radiating fan
02/23/2005CN1585116A Piled radiator
02/23/2005CN1585115A Semiconductor sealer with radiating structure
02/23/2005CN1585114A Semiconductor sealing baseplate structure of electric padding metal protective layer and producing method thereof
02/23/2005CN1585113A 半导体集成电路 The semiconductor integrated circuit
02/23/2005CN1585092A LSI package, heat radiator and interface module for installation of heat radiator
02/23/2005CN1584779A Radiator for power element on main board of computer
02/23/2005CN1584720A Thin film transistor array panels and their manufacture
02/23/2005CN1584684A Display device
02/23/2005CN1584673A Manufacture of electronic device installing bodies
02/23/2005CN1584672A Installation structure and method of electronic device, photoelectric device and electronic apparatus
02/23/2005CN1584670A Electronic components and their manufacture
02/23/2005CN1191001C Circuit base board
02/23/2005CN1190999C Electronic element apparatus and its mfg. method
02/23/2005CN1190846C Method for mfg. semiconductor device and semiconductor device
02/23/2005CN1190843C Semiconductor device and mfg. method thereof
02/23/2005CN1190841C 静电放电保护装置 Electrostatic discharge protection device
02/23/2005CN1190840C Lead frame for semiconductor device
02/23/2005CN1190839C Connecting terminal bay and its mfg. method
02/23/2005CN1190838C 功率半导体模块 Power semiconductor module
02/23/2005CN1190837C 半导体装置 Semiconductor device
02/23/2005CN1190836C Clad Plate, interposer for semiconductor device and method for mfg. them
02/23/2005CN1190827C Formation method of insulating film and mfg. method for semicondrctor appliance
02/23/2005CN1190823C Laser repair process
02/23/2005CN1190523C Electrolyte and method for depositing tin-silver alloy layers
02/22/2005US6859916 Polygonal vias
02/22/2005US6859748 Test structure for measuring effect of trench isolation on oxide in a memory device
02/22/2005US6859571 Hybrid integration of electrical and optical chips
02/22/2005US6859408 Current limiting antifuse programming path
02/22/2005US6859368 Fixing structure for dissipation device
02/22/2005US6859367 Heat sink attachment device
02/22/2005US6859352 Capacitor sheet
02/22/2005US6858947 Semiconductor device
02/22/2005US6858946 Semiconductor device
02/22/2005US6858945 Multi-concentric pad arrangements for integrated circuit pads
02/22/2005US6858944 Bonding pad metal layer geometry design
02/22/2005US6858943 Release resistant electrical interconnections for MEMS devices
02/22/2005US6858942 Semiconductor package with improved thermal cycling performance, and method of forming same
02/22/2005US6858941 Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array
02/22/2005US6858939 Integrated circuit diagonal wiring architectures with zag conductors
02/22/2005US6858938 Semiconductor device
02/22/2005US6858936 Semiconductor device having an improved construction in the interlayer insulating film
02/22/2005US6858935 Simulating euclidean wiring directions using manhattan and diagonal directional wires
02/22/2005US6858934 Semiconductor device structures including metal silicide interconnect structures that extend at least partially over transistor gate structures and methods for making the same
02/22/2005US6858933 Wherein transverse surface of chip insert has roughness chosen such that face of block of encapsulation material of semiconductor package has a suitable roughness in the region of the face of the block of encapsulation
02/22/2005US6858932 Packaged semiconductor device and method of formation
02/22/2005US6858931 Heat sink with collapse structure for semiconductor package
02/22/2005US6858930 Multi chip module
02/22/2005US6858929 Semiconductor package with lid heat spreader
02/22/2005US6858928 Multi-directional wiring on a single metal layer
02/22/2005US6858926 Stackable ceramic FBGA for high thermal applications
02/22/2005US6858925 Semiconductor device and a method of manufacturing the same
02/22/2005US6858924 Flip-chip semiconductor device having I/O modules in an internal circuit area
02/22/2005US6858922 Small footprint package for two or more semiconductor die includes first and second die, mounted on opposite respective surfaces of a lead frame pad in vertical alignment;MOSFET (metal oxide semiconductor field effect transistors)
02/22/2005US6858920 Semiconductor device with stacked semiconductor elements
02/22/2005US6858919 Semiconductor package
02/22/2005US6858916 Semiconductor memory device with series-connected antifuse-components
02/22/2005US6858914 Semiconductor device with fuses
02/22/2005US6858913 Fuse structure window
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