| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/24/2005 | US20050040536 Apparatus and method to reduce signal cross-talk |
| 02/24/2005 | US20050040534 Semiconductor devices and other electronic components including porous insulators created from "void" creating materials |
| 02/24/2005 | US20050040533 Semiconductor devices including porous insulators |
| 02/24/2005 | US20050040532 Dual damascene integration of ultra low dielectric constant porous materials |
| 02/24/2005 | US20050040531 Wiring board, manufacturing method thereof, semiconductor device and manufacturing method thereof |
| 02/24/2005 | US20050040530 Near hermetic power chip on board device and manufacturing method therefor |
| 02/24/2005 | US20050040529 Ball grid array package, stacked semiconductor package and method for manufacturing the same |
| 02/24/2005 | US20050040527 [chip structure] |
| 02/24/2005 | US20050040526 Method of making a substrate having buried structure and method for fabricating a display device including the substrate |
| 02/24/2005 | US20050040525 Package module for an IC device and method of forming the same |
| 02/24/2005 | US20050040524 Chip carrier for semiconductor chip |
| 02/24/2005 | US20050040523 Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment |
| 02/24/2005 | US20050040522 High-frequency semiconductor device |
| 02/24/2005 | US20050040521 Relaxed tolerance flip chip assembly |
| 02/24/2005 | US20050040520 Heat dissipation apparatus for package device |
| 02/24/2005 | US20050040519 Semiconductor package with heat sink |
| 02/24/2005 | US20050040518 indium-containing solder joint has a much higher thermal conductivity than conductive lubricants |
| 02/24/2005 | US20050040517 Encasing arrangement for a semicoductor component |
| 02/24/2005 | US20050040515 Coolant cooled type semiconductor device |
| 02/24/2005 | US20050040514 Semiconductor package with improved chip attachment and manufacturing method thereof |
| 02/24/2005 | US20050040512 Circuit device |
| 02/24/2005 | US20050040510 Interconnect substrate, semiconductor device, methods of fabricating, inspecting, and mounting the semiconductor device, circuit board, and electronic instrument |
| 02/24/2005 | US20050040509 Semiconductor device |
| 02/24/2005 | US20050040508 Area array type package stack and manufacturing method thereof |
| 02/24/2005 | US20050040507 Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials |
| 02/24/2005 | US20050040506 Semiconductor component having dummy segments with trapped corner air |
| 02/24/2005 | US20050040505 Substantially hermetic packages for semiconductor devices and substantially hermetically packaged, semiconductor devices |
| 02/24/2005 | US20050040504 Low-cost flexible film package module and method of manufacturing the same |
| 02/24/2005 | US20050040503 Semiconductor device |
| 02/24/2005 | US20050040502 Interconnections |
| 02/24/2005 | US20050040501 Wirebonded assemblage method and apparatus |
| 02/24/2005 | US20050040500 Semiconductor integrated circuit |
| 02/24/2005 | US20050040498 Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices |
| 02/24/2005 | US20050040494 Thin film resistor device and a method of manufacture therefor |
| 02/24/2005 | US20050040493 Resistor with reduced leakage |
| 02/24/2005 | US20050040491 Fuse stucture |
| 02/24/2005 | US20050040488 a-C:H ISFET device, manufacturing method, and testing methods and apparatus thereof |
| 02/24/2005 | US20050040487 a-C:H ISFET device, manufacturing method, and testing methods and apparatus thereof |
| 02/24/2005 | US20050040471 Spiral inductor formed in a semiconductor substrate and a method for forming the inductor |
| 02/24/2005 | US20050040466 Semiconductor integrated circuit device |
| 02/24/2005 | US20050040452 Method for fabricating semiconductor integrated circuit |
| 02/24/2005 | US20050040443 Wafer cleaning method and resulting wafer |
| 02/24/2005 | US20050040442 Wafer cleaning method and resulting wafer |
| 02/24/2005 | US20050040400 Semiconductor device and manufacturing method thereof |
| 02/24/2005 | US20050040397 Method and apparatus using an on-chip ring oscillator for chip identification |
| 02/24/2005 | US20050040369 comprises a semiconductor substrate and a heat spreader; good thermal conductivity |
| 02/24/2005 | US20050040135 Forming an insulating film on a substrate material, forming a contact hole in the insulating film, and coating a region where a transparent conductive film is to be formed with a liquid containing a precursor of the transparent conductive film liquid coats any unnecessary insulating film formed, annealin |
| 02/24/2005 | US20050039950 High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same |
| 02/24/2005 | US20050039948 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| 02/24/2005 | US20050039945 Flexible circuit board mounted with semiconductor chip and method for mounting semiconductor chip |
| 02/24/2005 | US20050039944 Non-solder mask defined (NSMD) type wiring substrate for ball grid array (BGA) package and method for manufacturing such a wiring substrate |
| 02/24/2005 | US20050039943 Straight angle conductor and method of manufacturing the same |
| 02/24/2005 | US20050039890 Heat dissipating device and method of making it |
| 02/24/2005 | US20050039888 Two-phase cooling apparatus and method for automatic test equipment |
| 02/24/2005 | US20050039887 Stacked low profile cooling system and method for making same |
| 02/24/2005 | US20050039885 Microchannel heat exchangers and methods of manufacturing the same |
| 02/24/2005 | US20050039884 Conformal heat sink |
| 02/24/2005 | US20050039883 High flux heat removal system using liquid ice |
| 02/24/2005 | US20050039882 Cooling device for a chip and method for its production |
| 02/24/2005 | US20050039881 Cooling assembly |
| 02/24/2005 | US20050039880 Computer cooling apparatus |
| 02/24/2005 | US20050039879 Heat transmission member and an electronics device using the member |
| 02/24/2005 | US20050039840 Circuitized substrate and method of making same |
| 02/24/2005 | US20050039465 Peltier temperature control system for electronic components |
| 02/24/2005 | DE19931082B4 Abgleichbares Halbleiterbauelement Abgleichbares semiconductor device |
| 02/24/2005 | DE10392228T5 Halbleiterplättchenpackung mit Halbleiterplättchen mit seitlichem elektrischen Anschluss Semiconductor die package with semiconductor wafer with a side electrical connection |
| 02/24/2005 | DE10349477A1 Semiconductor component especially for low voltage power components has chip with contact bumps surrounded by conductive adhesive and electrodes shorted to a metal contact layer |
| 02/24/2005 | DE10335383A1 Monolithisch integrierbare Schaltungsanordnung zum Überspannungsschutz Monolithic integrated circuit for surge protection |
| 02/24/2005 | DE10335197A1 Kühlvorrichtung für ein elektronisches Bauelement, insbesondere für einen Mikroprozessor Cooling device for an electronic component, in particular for a microprocessor |
| 02/24/2005 | DE10333877A1 Cooling of power electronics is provided by closed fluid circuit having evaporator and condenser together with a fan |
| 02/24/2005 | DE10333841A1 Halbleiterbauteil in Halbleiterchipgröße mit flipchipartigen Außenkontakten und Verfahren zur Herstellung desselben Of the same semiconductor device in the semiconductor chip size flipchipartigen with external contacts and methods for preparing |
| 02/24/2005 | DE10333840A1 Semiconductor component for row and column uses, has plastic housing including a wiring structure connected to flip chip contacts and uses two different metal alloys for conductors |
| 02/24/2005 | DE10333229A1 Heatsink, especially a microprocessor heatsink, has a heat conducting element in contact with microprocessor linked by heat conducting pipes to a heat diffusion of capacity equal to twice that of the processor heat capacity |
| 02/24/2005 | DE10332770A1 Kühlvorrichtung zum Abführen von Verlustwärme von einem elektrischen oder elektronischen Bauelement oder Baugruppe Cooling means for dissipating the heat loss of an electric or electronic component or assembly |
| 02/24/2005 | DE10332096A1 Liquid cooling arrangement, e.g. for a CPU fan, has a liquid cooling circuit the coolant circulating pump of which is driven by the fan drive |
| 02/24/2005 | DE10332009A1 Semiconductor element especially a DRAM has electromagnetic screening against high frequency radiation and alpha and beta rays and conductive plastic sheath around chip |
| 02/24/2005 | DE10308926B4 Halbleiterchipanordnung und Verfahren zu ihrer Herstellung A semiconductor chip assembly and process for their preparation |
| 02/24/2005 | DE102004036889A1 Detektorschaltung und Zugriffdetektionsverfahren für eine Chipkarte And access detection circuit detecting method for a chip card |
| 02/24/2005 | DE102004032184A1 Laserstrahlbearbeitungsverfahren und Laserstrahlbearbeitungsmaschine bzw. -Vorrichtung Laser beam machining method and laser processing machine |
| 02/24/2005 | DE102004027278A1 Schutzschaltung gegen elektrostatische Entladung und Verfahren zu ihrer Herstellung Protection circuit against electrostatic discharge, and processes for their preparation |
| 02/24/2005 | DE10006505B4 Leistungshalbleiter-Modul aus einer Vielzahl von parallel zueinander geschalteten IGBT-Chips Power semiconductor module consisting of a plurality of parallel-connected IGBT chips |
| 02/23/2005 | EP1509071A1 Aluminum nitride sintered compact having metallized layer and method for preparation thereof |
| 02/23/2005 | EP1508942A1 Electrical connection device between two boards and method of use in a microelectronic component |
| 02/23/2005 | EP1508917A2 Semiconductor integrated circuit |
| 02/23/2005 | EP1508916A1 Apparatus for cooling semiconductor devices attached to a printed circuit board |
| 02/23/2005 | EP1508915A2 Process and electronic assembly for removing heat from a circuit device |
| 02/23/2005 | EP1508914A2 Semiconductor processing method comprising the fabrication of a barrier layer |
| 02/23/2005 | EP1508583A1 Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the same, and sealing material and laminate each comprising or made with the same |
| 02/23/2005 | EP1508261A1 Nanoparticle filled underfill |
| 02/23/2005 | EP1508170A2 Active shield of an integrated circuit |
| 02/23/2005 | EP1508169A1 Compliant component for supporting electrical interface component |
| 02/23/2005 | EP1508168A1 Semiconductor component |
| 02/23/2005 | EP1508167A2 High-frequency power semiconductor module with a hollow housing and method for the production thereof |
| 02/23/2005 | EP1508166A2 Electronic component comprising external surface contacts and a method for producing the same |
| 02/23/2005 | EP1508162A2 Method for producing an electrical circuit |
| 02/23/2005 | EP1508014A1 Vapor augmented heatsink with multi-wick structure |
| 02/23/2005 | EP1508003A1 Control arrangement for heating devices |
| 02/23/2005 | EP1444729B1 Large area silicon carbide devices and manufacturing methods therefor |
| 02/23/2005 | CN2681351Y Shielding device capable of suppressing radiation interference of radiator |
| 02/23/2005 | CN2681350Y Chip packaging arrangement and electric connection structure between chip and base plate |