Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2005
03/02/2005CN2682583Y Heat sink
03/02/2005CN2682582Y 散热器 Heat sink
03/02/2005CN2682581Y Wind guiding structure for heat sink
03/02/2005CN2682580Y Fixing structure for heat sink
03/02/2005CN2682579Y Aluminium silicon carbide packaging casing with metallic packing ring
03/02/2005CN2682472Y Radiating fin fixing device
03/02/2005CN1589498A Semiconductor device
03/02/2005CN1589496A Optimised application of PCMs in chillers
03/02/2005CN1589087A Anti-static protective circuit for luminous tube
03/02/2005CN1588657A High anti-static high efficiency light-emitting diode and producing method
03/02/2005CN1588641A Multiple chip integrated light-emitting diode frame
03/02/2005CN1588632A Package element with heat insulation protective structure and re-welding method
03/02/2005CN1588577A Surface adhesive type high molecular composite voltage sensitive element and its producing method
03/02/2005CN1587884A Combining mode of heat pipe and radiation fin and radiator using said combining method
03/02/2005CN1191742C Heat transfer substrate and method for mfg. same
03/02/2005CN1191636C Semiconductor device
03/02/2005CN1191631C Static discharge protective circuit with function of controlling latchdown
03/02/2005CN1191630C Semicondrctor device and its manufacture
03/02/2005CN1191629C Lead wire frame, semiconductor and its producing method, circuit base board and electronic device
03/02/2005CN1191628C Semiconductor device having alternative long solderig plate and short soldering plate
03/02/2005CN1191622C Method for mfg. semiconductor device
03/02/2005CN1191621C Method for producing conductor with high threshold electromigration and its structure
03/02/2005CN1191619C Circuit device and its producing method
03/02/2005CN1191618C Method for producing circuit device
03/02/2005CN1191615C Semiconductor device, its mfg. method and chip contg. epoxy resin compoistion
03/02/2005CN1191589C Low resistivity tantalum
03/02/2005CN1191503C Method for measuring bridging connection resulted from correction of photo cover cinfiguration and its equipment
03/01/2005US6862725 Method for manufacturing multi-kind and small quantity semiconductor products in a mass-production line and system thereof
03/01/2005US6862720 Interconnect exhibiting reduced parasitic capacitance variation
03/01/2005US6862192 Wiring layout of auxiliary wiring package and printed circuit wiring board
03/01/2005US6862191 Volumetrically efficient electronic circuit module
03/01/2005US6862190 Adapter for plastic-leaded chip carrier (PLCC) and other surface mount technology (SMT) chip carriers
03/01/2005US6862186 Stack up assembly
03/01/2005US6862183 Composite fins for heat sinks
03/01/2005US6862123 Optical scanning device, image forming apparatus, and optical scanning method
03/01/2005US6862001 High frequency communication device
03/01/2005US6861864 Self-timed reliability and yield vehicle array
03/01/2005US6861764 Wiring substrate having position information
03/01/2005US6861763 Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same
03/01/2005US6861762 Flip chip with novel power and ground arrangement
03/01/2005US6861761 Multi-chip stack flip-chip package
03/01/2005US6861760 Semiconductor device with stacked-semiconductor chips and support plate
03/01/2005US6861759 Semiconductor apparatus of which reliability of interconnections is improved and manufacturing method of the same
03/01/2005US6861758 Area around a via of a semiconductor interconnect selectively doped with metallic dopants to reduce electromigration without adding unnecessary, performance-degrading resistance; some of the region extends into the electroconductive layer
03/01/2005US6861757 Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device
03/01/2005US6861756 Semiconductor integrated circuit device and fabrication process thereof
03/01/2005US6861755 Semiconductor device
03/01/2005US6861754 Semiconductor device with anchor type seal ring
03/01/2005US6861753 Method and apparatus for performing power routing on a voltage island within an integrated circuit chip
03/01/2005US6861752 Semiconductor device having wiring line with hole, and manufacturing method thereof
03/01/2005US6861750 Ball grid array package with multiple interposers
03/01/2005US6861749 Semiconductor device with bump electrodes
03/01/2005US6861748 Test structure
03/01/2005US6861747 Radiation type BGA package and production method therefor
03/01/2005US6861746 Electrical circuit apparatus and methods for assembling same
03/01/2005US6861745 Method and apparatus for conducting heat in a flip-chip assembly
03/01/2005US6861744 Multilayer ceramic substrate utilizing an intaglio plate with a plurality of grooves having different depths
03/01/2005US6861743 Integrated circuit carrier socket
03/01/2005US6861742 Wafer level chip size package having rerouting layers
03/01/2005US6861741 Circuit configuration
03/01/2005US6861740 Flip-chip die and flip-chip package substrate
03/01/2005US6861739 Minimum metal consumption power distribution network on a bonded die
03/01/2005US6861738 Laminated-chip semiconductor device
03/01/2005US6861737 Semiconductor device packages having semiconductor chips attached to circuit boards, and stack packages using the same
03/01/2005US6861736 Replacement for a bismaleimide triazine substrate or film to make construction less complex and more cost efficient without having to include a lidding process; includes a chip-supporting structure in a downset position to the support
03/01/2005US6861735 Resin molded type semiconductor device and a method of manufacturing the same
03/01/2005US6861734 External terminals are arranged/exposed in lines on the package bottom with no resin residue left on; the inclined land electrode is forced into and strongly adheres to the seal sheet when pressure is applied through dies
03/01/2005US6861732 Power source circuit device
03/01/2005US6861731 Module and electronic device
03/01/2005US6861730 Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material
03/01/2005US6861727 Antifuse structures, methods, and applications
03/01/2005US6861705 Driver circuits and methods for manufacturing driver circuits
03/01/2005US6861686 Structure of a CMOS image sensor and method for fabricating the same
03/01/2005US6861683 Thermal stress relieving of the bonding wires to avoid undesired cracking or tearing by encapsulating to the top of the component with a seal having a low thermal expansion; filling over with a transparent sealant with window
03/01/2005US6861682 Laser link structure capable of preventing an upper crack and broadening an energy window of a laser beam, and fuse box using the same
03/01/2005US6861666 Apparatus and methods for determining and localization of failures in test structures using voltage contrast
03/01/2005US6861588 Laminated ceramic electronic component and method of producing the same
03/01/2005US6861370 Bump formation method
03/01/2005US6861366 Packaged semiconductor device having stacked die
03/01/2005US6861356 Method of forming a barrier film and method of forming wiring structure and electrodes of semiconductor device having a barrier film
03/01/2005US6861354 Method and structure to reduce defects in integrated circuits and substrates
03/01/2005US6861344 Method of manufacturing a semiconductor integrated circuit device
03/01/2005US6861343 Buffer metal layer
03/01/2005US6861332 Air gap interconnect method
03/01/2005US6861331 Method for aligning and exposing a semiconductor wafer
03/01/2005US6861313 Semiconductor memory device and fabrication method thereof using damascene bitline process
03/01/2005US6861311 Semiconductor processing methods of forming integrated circuitry, forming conductive lines, forming a conductive grid, forming a conductive network, forming an electrical interconnection to a node location, forming an electrical interconnection with a transistor source/drain region, and integrated circuitry
03/01/2005US6861295 Low-pin-count chip package and manufacturing method thereof
03/01/2005US6861294 Semiconductor devices and methods of making the devices
03/01/2005US6861293 Stacked fin heat sink and method of making
03/01/2005US6861292 Composite lid for land grid array (LGA) flip-chip package assembly
03/01/2005US6861291 Method producing a contact connection between a semiconductor chip and a substrate and the contact connection
03/01/2005US6861290 Flip-chip adaptor package for bare die
03/01/2005US6861289 Moisture-sensitive device protection system
03/01/2005US6861286 Method for making power chip scale package
03/01/2005US6861285 Flip chip underfill process
03/01/2005US6861284 Semiconductor device and production method thereof
03/01/2005US6861282 Semiconductor package and semiconductor package mounting method
03/01/2005US6861269 Electric-circuit fabricating method and system, and electric-circuit fabricating program
03/01/2005US6861030 Method of manufacturing high purity zirconium and hafnium
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