| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/01/2005 | US6861010 Copper-based metal polishing composition, method for manufacturing a semiconductor device, polishing composition, aluminum-based metal polishing composition, and tungsten-based metal polishing composition |
| 03/01/2005 | US6860975 Barrier layer and method of depositing a barrier layer |
| 03/01/2005 | US6860643 Optical connector with a surface mounted shield |
| 03/01/2005 | US6860419 Apparatus and method for controlling movement of a device after packaging |
| 03/01/2005 | US6860323 Radiator fan |
| 03/01/2005 | US6860321 Heat-dissipating device |
| 03/01/2005 | US6860006 Method for manufacturing a monolithic ceramic electronic component |
| 03/01/2005 | US6860004 Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink |
| 03/01/2005 | US6860003 I-channel surface-mount connector |
| 02/24/2005 | WO2005018296A1 Land grid array connector |
| 02/24/2005 | WO2005018291A2 Thermally enhanced electronic module with self-aligning heat sink |
| 02/24/2005 | WO2005018008A1 Semiconductor device |
| 02/24/2005 | WO2005018006A1 Array board, liquid crystal display and method for producing array board |
| 02/24/2005 | WO2005018001A1 Semiconductor device |
| 02/24/2005 | WO2005017999A1 Semiconductor device and method for making the same |
| 02/24/2005 | WO2005017998A2 Bipolar transistor with a heterojunction with improved thermal transfer |
| 02/24/2005 | WO2005017995A1 Process for fabricating electronic components using liquid injection molding |
| 02/24/2005 | WO2005017994A1 Integrated circuit package for semiconductor devices with improved electric resistance and inductance |
| 02/24/2005 | WO2005017990A1 Method for forming film, method for manufacturing semiconductor device, semiconductor device and substrate treatment system |
| 02/24/2005 | WO2005017970A2 Module for epas/ehpas applications |
| 02/24/2005 | WO2005017627A1 Method for etching a patterned silicone layyer |
| 02/24/2005 | WO2005016563A1 Methods of thinning a silicon wafer using hf and ozone |
| 02/24/2005 | WO2005001927A3 Stackable integrated circuit package and method therefor |
| 02/24/2005 | WO2005001909A3 Method for efficiently producing removable peripheral cards |
| 02/24/2005 | WO2004113041A3 Method for producing a ceramic/metal substrate |
| 02/24/2005 | WO2004109795A3 Thermal interconnect system and method of production thereof |
| 02/24/2005 | WO2004105127B1 Semiconductor die package with increased thermal conduction |
| 02/24/2005 | WO2004091948A3 Power circuitry with a thermionic cooling system |
| 02/24/2005 | WO2004070769A3 Method for producing a chip panel by means of a heating and pressing process using a thermoplastic material |
| 02/24/2005 | WO2004051745A3 Electronic component comprising a plurality of chips and method for producing the same |
| 02/24/2005 | WO2004051737A3 Split manufacturing method for semiconductor circuits |
| 02/24/2005 | WO2004044946A3 Process for forming fusible links |
| 02/24/2005 | WO2004027801A3 Reduced splattering of unpassivated laser fuses |
| 02/24/2005 | WO2003054928A3 Porous low-k dielectric interconnect structures |
| 02/24/2005 | US20050044517 Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations |
| 02/24/2005 | US20050044403 Detection circuit for a smart card |
| 02/24/2005 | US20050043909 Method for measuring integrated circuit processor power demand and associated system |
| 02/24/2005 | US20050042895 Socket having foam metal contacts |
| 02/24/2005 | US20050042887 Diffusion barrier |
| 02/24/2005 | US20050042883 Method of forming low-k films |
| 02/24/2005 | US20050042873 Method and system to provide electroplanarization of a workpiece with a conducting material layer |
| 02/24/2005 | US20050042872 Process for forming lead-free bump on electronic component |
| 02/24/2005 | US20050042868 Method for forming plating film |
| 02/24/2005 | US20050042867 Semiconductor device having electrical contact from opposite sides |
| 02/24/2005 | US20050042860 Method for eliminating reaction between photoresist and OSG |
| 02/24/2005 | US20050042858 Method of improving stability in low k barrier layers |
| 02/24/2005 | US20050042857 Localized slots for stress relieve in copper |
| 02/24/2005 | US20050042855 Wire bonding for thin semiconductor package |
| 02/24/2005 | US20050042853 Active area bonding compatible high current structures |
| 02/24/2005 | US20050042851 Connector terminal device and its fabrication method |
| 02/24/2005 | US20050042839 Vacuum package fabrication of integrated circuit components |
| 02/24/2005 | US20050042838 Fluxless assembly of chip size semiconductor packages |
| 02/24/2005 | US20050042835 Metal-insulator-metal capacitor and method of fabricating same |
| 02/24/2005 | US20050042829 Semiconductor memory device having low-resistance tungsten line and method of manufacturing the semiconductor memory device |
| 02/24/2005 | US20050042827 Method of manufacturing semiconductor integrated circuit device having capacitor element |
| 02/24/2005 | US20050042824 Semiconductor structures, DRAM cells and electronic systems |
| 02/24/2005 | US20050042821 Methods of forming semiconductor circuitry, and semiconductor circuit constructions |
| 02/24/2005 | US20050042818 Analog capacitor in dual damascene process |
| 02/24/2005 | US20050042816 Semiconductor device and method for manufacturing the same |
| 02/24/2005 | US20050042808 Semiconductor device and method of fabricating the same |
| 02/24/2005 | US20050042806 Silicon on insulator device and layout method of the same |
| 02/24/2005 | US20050042803 Semiconductor device and method for production thereof |
| 02/24/2005 | US20050042802 Method of fabricating an array of wafer scale polymeric caps |
| 02/24/2005 | US20050042801 Electronic parts packaging structure and method of manufacturing the same |
| 02/24/2005 | US20050042786 Process for making contact with and housing integrated circuits |
| 02/24/2005 | US20050042780 Integrated circuit identification |
| 02/24/2005 | US20050042779 Method of detecting misalignment of ion implantation area |
| 02/24/2005 | US20050042776 Method of producing an integrated circuit arrangement with field-shaping electrical conductor |
| 02/24/2005 | US20050042549 electroplating; gallium/arsenic substrate with photosensitive silicone resist |
| 02/24/2005 | US20050041836 Information media using information of defect in an article |
| 02/24/2005 | US20050041508 Current limiting antifuse programming path |
| 02/24/2005 | US20050041507 Fuse circuit |
| 02/24/2005 | US20050041454 Failure analysis vehicle for yield enhancement with self test at speed burnin capability for reliability testing |
| 02/24/2005 | US20050041406 Phase change thermal interface materials including polyester resin |
| 02/24/2005 | US20050041404 Integrated circuit stacking system and method |
| 02/24/2005 | US20050041403 Integrated circuit stacking system and method |
| 02/24/2005 | US20050041402 Integrated circuit stacking system and method |
| 02/24/2005 | US20050041399 Volumetrically efficient electronic circuit module |
| 02/24/2005 | US20050041397 Thermoelectric cooling of low-noise amplifier transistors in wireless communications networks |
| 02/24/2005 | US20050041396 Thermally enhanced component substrate: thermal bar |
| 02/24/2005 | US20050041394 Heatsink device |
| 02/24/2005 | US20050041393 Temperature control system which sprays liquid coolant droplets against an IC-module at a sub-atmospheric pressure |
| 02/24/2005 | US20050041373 Boron nitride agglomerated powder |
| 02/24/2005 | US20050041358 Electromagnetic noise reduction device |
| 02/24/2005 | US20050041357 Enriched macromolecular materials having temperature-independent high electrical conductivity and methods of making same |
| 02/24/2005 | US20050041346 Circuit and method for ESD protection |
| 02/24/2005 | US20050041192 Liquid crystal display device |
| 02/24/2005 | US20050041187 Thin film transistor array panel for liquid crystal display and method for manufacturing the same |
| 02/24/2005 | US20050040839 System and method for testing devices utilizing capacitively coupled signaling |
| 02/24/2005 | US20050040810 System for and method of controlling a VLSI environment |
| 02/24/2005 | US20050040561 Sealing material tablet method of manufacturing the tablet and electronic component device |
| 02/24/2005 | US20050040546 Radiation hardened microelectronic device |
| 02/24/2005 | US20050040544 Electric circuit substrate |
| 02/24/2005 | US20050040543 Semiconductor device and method of manufacturing same |
| 02/24/2005 | US20050040542 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 02/24/2005 | US20050040541 Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device |
| 02/24/2005 | US20050040540 Microelectronic assemblies with springs |
| 02/24/2005 | US20050040539 Flip chip die bond pads, die bond pad placement and routing optimization |
| 02/24/2005 | US20050040538 Semiconductor integrated circuit device |
| 02/24/2005 | US20050040537 Semiconductor integrated circuit device |