Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2005
03/03/2005US20050046005 Planar lead frame including die paddle and multiple fingers; wire bonding without inversion; thin, symmetrical package; simple, robust
03/03/2005US20050046003 Stacked-chip semiconductor package and fabrication method thereof
03/03/2005US20050046002 Chip stack package and manufacturing method thereof
03/03/2005US20050046001 High-frequency chip packages
03/03/2005US20050046000 Invertible microfeature device packages and associated methods
03/03/2005US20050045999 Semiconductor device
03/03/2005US20050045998 Amorphous soft magnetic shielding and keeper for MRAM devices
03/03/2005US20050045997 Method for producing self-aligned mask, articles produced by same and composition for same
03/03/2005US20050045993 Semiconductor device with concave patterns in dielectric film and manufacturing method thereof
03/03/2005US20050045991 Computer systems containing resistors which include doped silicon/germanium
03/03/2005US20050045989 Semiconductor device
03/03/2005US20050045988 Integrated circuit package having inductance loop formed from a bridge interconnect
03/03/2005US20050045987 Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure
03/03/2005US20050045986 Integrated circuit package having an inductance loop formed from a multi-loop configuration
03/03/2005US20050045985 High power radio frequency integrated circuit capable of impeding parasitic current loss
03/03/2005US20050045974 Die carrier
03/03/2005US20050045969 Silicide/semiconductor structure and method of fabrication
03/03/2005US20050045958 Semiconductor device and semiconductor integrated circuit device
03/03/2005US20050045957 Processing method of silicon controlled rectifier for ESD protection
03/03/2005US20050045956 Structure and fabrication method of electrostatic discharge protection circuit
03/03/2005US20050045955 Integrated circuit device having input/output electrostatic discharge protection cell equipment with electrostatic discharge protection element and power clamp
03/03/2005US20050045954 Manufacturing method for transistor of electrostatic discharge protection device
03/03/2005US20050045953 Semiconductor device
03/03/2005US20050045919 Semiconductor device
03/03/2005US20050045918 Hybrid vertical twisted bitline architecture
03/03/2005US20050045912 Semiconductor device using bumps, method for fabricating same, and method for forming bumps
03/03/2005US20050045904 Light emitting diode with high heat dissipation
03/03/2005US20050045902 System and method for enhanced LED thermal conductivity
03/03/2005US20050045901 Package for a semiconductor light emitting device
03/03/2005US20050045879 Integrated circuitry and method for manufacturing the same
03/03/2005US20050045878 Gate oxide measurement apparatus
03/03/2005US20050045865 [semiconductor device and fabricating method thereof]
03/03/2005US20050045855 Thermal conductive material utilizing electrically conductive nanoparticles
03/03/2005US20050045729 IC card
03/03/2005US20050045698 Solder-fill application for mounting semiconductor chip on PCB
03/03/2005US20050045697 Wafer-level chip scale package
03/03/2005US20050045379 Circuit board and method of manufacturing the same
03/03/2005US20050045378 Stacked microfeature devices and associated methods
03/03/2005US20050045376 High frequency multilayer circuit structure and method for the manufacture thereof
03/03/2005US20050045374 Flexible circuit boards with tooling cutouts for optoelectronic modules
03/03/2005US20050045372 Heat spreading thermal interface structure
03/03/2005US20050045371 Circuit board
03/03/2005US20050045369 Circuit component built-in module and method for manufacturing the same
03/03/2005US20050045359 Current sensor
03/03/2005US20050045313 Heat sink
03/03/2005US20050045311 Heat dissipating device incorporating clip
03/03/2005US20050045310 Heat pipe, cooling unit having the heat pipe, and electronic apparatus having the cooling unit
03/03/2005US20050045309 Electronic apparatus
03/03/2005US20050045308 Planar heat pipe structure
03/03/2005US20050045307 Variable height thermal interface
03/03/2005US20050045275 Plasma treatment apparatus and surface treatment apparatus of substrate
03/03/2005US20050045223 Fabricating thin films for solid state storage devices without annealing; low cost, efficient energy conversion
03/03/2005US20050044674 Unlocking mechanism
03/03/2005US20050044618 Solid-state imaging device and method for manufacturing the same
03/03/2005DE202004018930U1 Semiconductor housing arrangement e.g. for semiconductor or LED, includes outer frame device formed from opaque material and positioned on substrate
03/03/2005DE202004018929U1 Holder for CPU fan especially for cooling device, has fixture device arranged on lower face of cooling device and provided with fixture apertures for hooking arms
03/03/2005DE19645568B4 Herstellungsverfahren für ein Halbleiterbauelement Manufacturing method of a semiconductor device
03/03/2005DE19600427B4 Verfahren zum Ausrichten und Markieren eines Wafers A method for aligning and marking a wafer
03/03/2005DE10361014A1 Semiconductor component with high frequency (HF) circuit with active circuit components integrated in first semiconductor chip, while at least part of passive circuit components are formed in second semiconductor chip by silicon processing
03/03/2005DE10336091A1 Component used as a micro-acoustic component, preferably SAW or FBAR component, comprises a component body consisting of a crystalline or ceramic layer and a metallization arranged on the body
03/03/2005DE10335329A1 Cooling fan for radiator of central processing unit, has supporting sections extending from opposite sides of driving section in direction parallel with radiation fin of radiator to support driving section in seat
03/03/2005DE10335155A1 Anordnung eines elektrischen Bauelements auf einem Substrat und Verfahren zur Herstellung der Anordnung Arrangement of an electrical component on a substrate and methods of making the arrangement
03/03/2005DE10335153A1 Schaltungsanordnung auf einem Substrat und Verfahren zum Herstellen der Schaltungsanordnung auf dem Substrat A circuit arrangement on a substrate and methods for producing the circuitry on the substrate
03/03/2005DE10335078A1 Process for the form shaping covering of a lead frame with a housing in a tool uses a sealing material in the region of a separation plane
03/03/2005DE10334576A1 Verfahren zum Herstellen eines Halbleiterbauelements mit einem Kunststoffgehäuse und Trägerplatte zur Durchführung des Verfahrens A method of manufacturing a semiconductor device with a plastic housing and carrier plate for carrying out the method
03/03/2005DE10334433A1 Device for interrupting current flow to semiconductor body of semiconductor component for power MOSFET comprises connecting unit for connecting component to external current cycle, and connecting line
03/03/2005DE10333465A1 Elektronisches Bauteil mit Halbleiterchip und Halbleiterwafer mit Kontaktflecken, sowie Verfahren zur Herstellung derselben An electronic part having semiconductor chip and semiconductor wafer having contact pads, and to methods of making the same
03/03/2005DE10333089A1 Current processor unit has housing containing conductor and signal areas with chip running temperature compensation program connected through bond wires to current and signal pins
03/03/2005DE10332017A1 Elektronisches Bauteil und Flachleiterrahmen zur Herstellung des Bauteils Electronic component and leadframe for producing the component
03/03/2005DE10204157B4 Drahtbondverbindung für Leistungshalbleiterbauelemente Wire bonding for power semiconductor components
03/03/2005DE102004037085A1 Drahtlose Halbleiterpackung und Herstellungsverfahren zum fertigen einer solchen drahtlosen Halbleiterpackung Wireless semiconductor package and fabrication method of fabricating a semiconductor package such wireless
03/03/2005DE102004036898A1 Semiconductor integrated circuit incorporating logic gates and with protection against reverse engineering using transistors without supplementary treatment circuits
03/03/2005DE102004029507A1 Kunststoffgehäuse und Halbleiterbaustein mit Verwendung eines Kunststoffgehäuses Plastic housing and semiconductor device with use of a plastic housing
03/03/2005DE102004024924A1 Verfahren zum Herstellen polykristallinen Siliciums sowie Schaltbauteil unter Verwendung polykristallinen Siliciums A method for producing polycrystalline silicon as well as switching device using polycrystalline silicon
03/03/2005DE102004004789B3 Electrostatic discharge protection circuit for electronic circuit with several supply voltages has control bus connecting protection element control inputs, overvoltage detector controlling bus depending on potential at first supply node
03/03/2005CA2537634A1 Nano-filled composite materials with exceptionally high glass transition temperature
03/02/2005EP1511369A2 Liquid cooling system and electronic apparatus using the same
03/02/2005EP1511345A1 Mobile station supervision of the foward dedicated control channel when in the discontinuous transmission mode
03/02/2005EP1511090A2 Package for a semiconductor light emitting device
03/02/2005EP1511080A2 Direct Plugging CPU Cooling Fan
03/02/2005EP1511079A2 Cooling device
03/02/2005EP1511078A2 Multi-chip press-connected type semiconductor device
03/02/2005EP1511075A2 Electronic part mounting substrate and method for producing same
03/02/2005EP1511072A2 Post-etch clean process for porous low dielectric constant materials
03/02/2005EP1511070A2 Integrated circuit capacitor in multi-level metallization
03/02/2005EP1510825A1 Sensor package
03/02/2005EP1510500A2 Die carrier for a MEMS with a fluid chamber
03/02/2005EP1510113A1 Cooling element for an electronic device
03/02/2005EP1509954A1 Arrangement for reducing current density in a transistor in an ic
03/02/2005EP1509951A1 Thermally or electrically conductive gap filler
03/02/2005EP1509947A2 Nickel silicide with reduced interface roughness
03/02/2005EP1509940A1 Thermionic vacuum diode device with adjustable electrodes
03/02/2005EP1509831A2 Method and apparatus for cooling a circuit component
03/02/2005EP1509572A2 Thermally conductive phase change materials
03/02/2005EP1509567A1 Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition
03/02/2005EP1509479A1 Ltcc tape composition
03/02/2005EP1317701B1 Method for jamming power consumption of an integrated circuit
03/02/2005CN2682586Y Heat sink
03/02/2005CN2682585Y 散热器成型结构 Radiator forming structure
03/02/2005CN2682584Y 散热器 Heat sink
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