Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2005
03/03/2005WO2005002294A3 Gas-collecting unit, test head, and ic device testing apparatus
03/03/2005WO2004106454A3 Foamable underfill encapsulant
03/03/2005WO2004105134A8 An integrated circuit package
03/03/2005WO2004102618A3 Card with embedded ic and electrochemical cell
03/03/2005WO2004100179A8 Insulated conductive ball for anisotropic conductive connection, method of preparing the same, and product using the same
03/03/2005WO2004097933A3 Method and apparatus for optically aligning integrated circuit devices
03/03/2005WO2004093506A3 Electomagnetic interference shielding for a printed circuit board
03/03/2005WO2004053931B1 Package having exposed integrated circuit device
03/03/2005WO2004028748A3 Clamping assembly for high-voltage solid state devices
03/03/2005WO2004025729A3 Integrated circuit comprising intermediate materials and corresponding components
03/03/2005US20050050507 Basic cell, edge cell, wiring shape, wiring method, and shield wiring structure
03/03/2005US20050050505 Integrated Circuit Chip Having A Ringed Wiring Layer Interposed Between A Contact Layer And A Wiring Grid
03/03/2005US20050049357 Thermal interface containing filler particles in polymer matrix; mating surfaces
03/03/2005US20050049352 Solvent-modified resin compositions and methods of use thereof
03/03/2005US20050049350 Thermal interface containing filler particles in polymer matrix; mating surfaces
03/03/2005US20050049334 Mixture of polymer, silica filler and solvent; encapsulation of electron chips
03/03/2005US20050048807 Electrical contact and connector and method of manufacture
03/03/2005US20050048806 Electrical contact and connector and method of manufacture
03/03/2005US20050048784 Semiconductor devices and methods of manufacturing such semiconductor devices
03/03/2005US20050048782 Method of fabricating a semiconductor device
03/03/2005US20050048775 Depositing a tantalum film
03/03/2005US20050048773 Semiconductor process and composition for forming a barrier material overlying copper
03/03/2005US20050048772 Bond pad techniques for integrated circuits
03/03/2005US20050048767 Method for fabricating electronic device
03/03/2005US20050048764 Method of generating interconnection pattern
03/03/2005US20050048759 Method for fabricating thermally enhanced semiconductor device
03/03/2005US20050048755 Method of forming a bond pad
03/03/2005US20050048748 Method of making a circuitized substrate
03/03/2005US20050048740 Semiconductor device and manufacturing method thereof
03/03/2005US20050048700 No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance
03/03/2005US20050048699 Method and system for integrated circuit packaging
03/03/2005US20050048698 Semiconductor device, method for manufacturing the same, circuit board, and electronic apparatus
03/03/2005US20050048697 Self-assembled nanometer conductive bumps and method for fabricating
03/03/2005US20050048696 Microbeam assembly and associated method for integrated circuit interconnection to substrates
03/03/2005US20050048695 Super high density module with integrated wafer level packages
03/03/2005US20050048694 Dual gauge lead frame
03/03/2005US20050048693 Method of manufacturing wafer-level chip-size package and molding apparatus used in the method
03/03/2005US20050048680 Printing one or more electrically conductive bonding lines to provide electrical conductivity in a circuit
03/03/2005US20050048676 Method for producing an electronic component, especially a memory chip
03/03/2005US20050048308 Surface of an intermetallic having regions that include a metal and a metal alloy that is different from the intermetallic compound, a plug or an electrical contact element for the electrical connection of component parts; relays; switches; hardness; wear resistance; automobiles
03/03/2005US20050048291 Nano-filled composite materials with exceptionally high glass transition temperature
03/03/2005US20050048259 Substrate frame
03/03/2005US20050047543 Method and apparatus for personalization of semiconductor
03/03/2005US20050047248 Memory module
03/03/2005US20050047186 Vertical laminated electrical switch circuit
03/03/2005US20050047106 Substrate reinforcing in an LGA package
03/03/2005US20050047105 Heat dissipation apparatus and method
03/03/2005US20050047101 Electronic part mounting substrate and method for producing same
03/03/2005US20050047094 Heat sink structure with embedded electronic components for semiconductor package
03/03/2005US20050047093 Direct plugging CPU cooling fan
03/03/2005US20050047092 Method of assembly of a wedge thermal interface to allow expansion after assembly
03/03/2005US20050047091 Liquid cooling system and electronic apparatus using the same
03/03/2005US20050047090 Cooling device, electronic equipment device, and method of manufacturing cooling device
03/03/2005US20050047089 Ceramic heat sink with micro-pores structure
03/03/2005US20050047088 Heat dissipating device
03/03/2005US20050047086 Heat dissipation apparatus and method
03/03/2005US20050047064 High quality factor spiral inductor that utilizes active negative capacitance
03/03/2005US20050047047 Protection circuit for semiconductor device and semiconductor device including the same
03/03/2005US20050047042 Semiconductor integrated circuit device having an ESD protection unit
03/03/2005US20050047036 ESD protection structure and method utilizing substrate triggering for a high-voltage tolerant pad
03/03/2005US20050046801 Light source device, method for manufacturing light source device, and projection type display apparatus
03/03/2005US20050046773 Device with upper conductive element, lower conductive element, and insulating element
03/03/2005US20050046544 Ball grid array resistor network having a ground plane
03/03/2005US20050046536 Plated terminations
03/03/2005US20050046524 Substrate having microstrip line structure, semiconductor device having microstrip line structure, and manufacturing method of substrate having microstrip line structure
03/03/2005US20050046435 Method and apparatus for evaluating and adjusting microwave integrated circuit
03/03/2005US20050046047 Resin-encapsulated semiconductor apparatus and process for its fabrication
03/03/2005US20050046046 Semiconductor package structure and method for manufacturing the same
03/03/2005US20050046045 Resin-encapsulated package, lead member for the same and method of fabricating the lead member
03/03/2005US20050046043 Semiconductor device with staggered electrodes and increased wiring width
03/03/2005US20050046039 Flip-chip package
03/03/2005US20050046038 Multi-dice chip scale semiconductor components
03/03/2005US20050046037 Buried solder bumps for AC-coupled microelectronic interconnects
03/03/2005US20050046036 Semiconductor device, semiconductor module and method of manufacturing semiconductor device
03/03/2005US20050046035 Semiconductor device
03/03/2005US20050046033 Tape circuit substrate and semiconductor chip package using the same
03/03/2005US20050046032 Lead free solder containing bismuth and silver; cracking and short circuiting prevention
03/03/2005US20050046031 Metal line having an increased resistance to electromigration along an interface of a dielectric barrier layer by implanting material into the metal line
03/03/2005US20050046029 Zero capacitance bondpad utilizing active negative capacitance
03/03/2005US20050046028 Semiconductor device and method for fabricating the same
03/03/2005US20050046027 Semiconductor device having a capping layer including cobalt and method of fabricating the same
03/03/2005US20050046025 Semiconductor devices and methods of fabricating the same
03/03/2005US20050046024 Flip-chip interconnect with increased current-carrying capability
03/03/2005US20050046023 Semiconductor device
03/03/2005US20050046022 Semiconductor devices integrated with wafer-level packaging
03/03/2005US20050046021 Adhesive sheet for producing a semiconductor device
03/03/2005US20050046020 Semiconductor device with pipe for passing refrigerant liquid
03/03/2005US20050046019 Voltage contrast monitor for integrated circuit defects
03/03/2005US20050046018 Electronic devices with small functional elements supported on a carrier
03/03/2005US20050046017 System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
03/03/2005US20050046016 Electronic package with insert conductor array
03/03/2005US20050046015 Array-molded package heat spreader and fabrication method therefor
03/03/2005US20050046014 Isolating temperature sensitive components from heat sources in integrated circuits
03/03/2005US20050046013 Semiconductor integrated circuit
03/03/2005US20050046012 Leadframe-based mold array package heat spreader and fabrication method therefor
03/03/2005US20050046011 System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards
03/03/2005US20050046010 Semiconductor package
03/03/2005US20050046009 Multi-layer staggered power bus layout design
03/03/2005US20050046008 Leadless semiconductor package
03/03/2005US20050046006 Unit semiconductor chip and multi chip package with center bonding pads and methods for manufacturing the same
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