Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2014
03/19/2014CN103646948A Two-terminal multi-channel ESD device and method thereof
03/19/2014CN103646943A Wafer packaging structure
03/19/2014CN103646942A Semiconductor packaging structure applied to power switcher circuit
03/19/2014CN103646941A Package structure for DC-DC converter
03/19/2014CN103646940A TO-220 waterproof sealing lead frame
03/19/2014CN103646939A Secondary plating-prior-to-etching metal frame subtraction imbedded chip normal-installation bump structure and process method
03/19/2014CN103646938A Primary plating-prior-to-etching metal frame subtraction imbedded chip flip bump structure and process method
03/19/2014CN103646937A Secondary etching-prior-to-plating metal frame subtraction imbedded chip flip bump structure and process method
03/19/2014CN103646936A Secondary plating-prior-to-etching metal frame subtraction imbedded chip flip flat pin structure and process method
03/19/2014CN103646935A Secondary plating-prior-to-etching metal frame subtraction imbedded chip flip bump structure and process method
03/19/2014CN103646934A Secondary plating-prior-to-etching metal frame subtraction imbedded chip normal-installation flat pin structure and process method
03/19/2014CN103646933A Secondary etching-prior-to-plating metal frame subtraction imbedded chip normal-installation bump structure and process method
03/19/2014CN103646932A Primary plating-prior-to-etching metal frame subtraction imbedded chip normal-installation bump structure and process method
03/19/2014CN103646931A Primary plating-prior-to-etching metal frame subtraction imbedded chip flip plat pin structure and process method
03/19/2014CN103646930A Secondary etching-prior-to-plating metal frame subtraction imbedded chip flip flat pin structure and process method
03/19/2014CN103646929A Primary plating-prior-to-etching metal frame subtraction imbedded chip normal-installation flat pin structure and process method
03/19/2014CN103646928A Connection structure and connection method of chip
03/19/2014CN103646927A High-power square-piece silicon controlled rectifier packaging structure
03/19/2014CN103646926A Pressure sensor chip installation structure
03/19/2014CN103646925A Installation structure of chip with glass substrate
03/19/2014CN103646880A Packaging technology based on board-level functional substrate and packaging structure
03/19/2014CN103642441A Adhesive composition, method for manufacturing semiconductor device, and semiconductor device
03/19/2014CN102778157B Flat plate soaking plate and manufacturing method thereof
03/19/2014CN102471831B Preparation method of copper alloy for electronic equipment
03/19/2014CN102386125B Method for preparing semiconductor structure for detection by transmission electron microscope, and semiconductor structure
03/19/2014CN102376737B Integrated circuit embedded into MRAM(Magnetic Random Access Memory) and preparation method of integrated circuit
03/19/2014CN102376625B Semiconductor device and manufacturing method thereof
03/19/2014CN102365735B Interconnect structure for a semiconductor device with a resilient stress absorber and related method of manufacture
03/19/2014CN102270619B Pad configurations for an electronic package assembly
03/19/2014CN102263040B Method for encapsulating semiconductor electronic component
03/19/2014CN102256442B Welding pad structure for ball grid array packaging chip and multilayer printed circuit board for mobile phone
03/19/2014CN102214691B Groove metal oxide semiconductor field effect tube (MOSFET) and manufacturing method thereof
03/19/2014CN102082115B Aluminum interconnection structure and method for forming aluminum interconnection structure
03/19/2014CN102067320B Method of producing flexible semiconductor device
03/19/2014CN102067306B Integrated circuit inductors with reduced magnetic coupling
03/19/2014CN101996976B Semiconductor device and method of manufacturing the same
03/19/2014CN101728826B An input surge protection device using JFET
03/19/2014CN101673716B Silicone laminated substrate, method of producing same, silicone resin composition, and led device
03/18/2014US8675371 Distributed computing
03/18/2014US8674524 Alignment marks and a semiconductor workpiece
03/18/2014US8674523 Apparatus and method for predetermined component placement to a target platform
03/18/2014US8674521 Semiconductor device package including a paste member
03/18/2014US8674519 Microelectronic package and method of manufacturing same
03/18/2014US8674518 Chip package and method for forming the same
03/18/2014US8674517 Method of assembling two integrated circuits and corresponding structure
03/18/2014US8674516 Integrated circuit packaging system with vertical interconnects and method of manufacture thereof
03/18/2014US8674515 3D integrated circuits structure
03/18/2014US8674514 Wiring board, manufacturing method of the wiring board, and semiconductor package
03/18/2014US8674513 Interconnect structures for substrate
03/18/2014US8674512 Method to align mask patterns
03/18/2014US8674511 Method of forming a semiconductor device with a contact pad on a sloped silicon dioxide surface
03/18/2014US8674509 Integrated circuit die assembly with heat spreader
03/18/2014US8674508 Seal ring structures with reduced moisture-induced reliability degradation
03/18/2014US8674507 Wafer level processing method and structure to manufacture two kinds of interconnects, gold and solder, on one wafer
03/18/2014US8674506 Structures and methods to reduce maximum current density in a solder ball
03/18/2014US8674504 Wire-based methodology of widening the pitch of semiconductor chip terminals
03/18/2014US8674503 Circuit board, fabricating method thereof and package structure
03/18/2014US8674502 Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device
03/18/2014US8674501 Semiconductor integrated circuit device
03/18/2014US8674500 Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
03/18/2014US8674499 Heat radiation component and semiconductor package including same
03/18/2014US8674498 MEMS package and method for the production thereof
03/18/2014US8674497 Stacked half-bridge package with a current carrying layer
03/18/2014US8674495 Package systems having a eutectic bonding material and manufacturing methods thereof
03/18/2014US8674494 Semiconductor package having supporting plate and method of forming the same
03/18/2014US8674493 IC card and booking-account system using the IC card
03/18/2014US8674492 Power module
03/18/2014US8674491 Semiconductor device
03/18/2014US8674490 Semiconductor die package including IC driver and bridge
03/18/2014US8674489 Interconnect structure with cavity having one or several contact rises on the wall of the cavity and method for producing same
03/18/2014US8674488 Light emitting diode (LED) packages
03/18/2014US8674487 Semiconductor packages with lead extensions and related methods
03/18/2014US8674486 Isolation barrier device and methods of use
03/18/2014US8674485 Semiconductor device including leadframe with downsets
03/18/2014US8674484 Dielectric separator layer
03/18/2014US8674475 Antifuse and methods of operating and manufacturing the same
03/18/2014US8674445 Electrostatic discharge failure protective element, electrostatic discharge failure protective circuit, semiconductor device and semiconductor device manufacturing method
03/18/2014US8674418 Method and apparatus for achieving galvanic isolation in package having integral isolation medium
03/18/2014US8674411 Semiconductor device employing circuit blocks having the same characteristics
03/18/2014US8674405 Gallium—nitride-on-diamond wafers and devices, and methods of manufacture
03/18/2014US8674367 Organic light-emitting display device having protrusions and recesses formed on conductive layer in pad portion and method of manufacturing the same
03/18/2014US8674357 Method for measuring impurity concentration profile, wafer used for same, and method for manufacturing semiconductor device using same
03/18/2014US8674355 Integrated circuit test units with integrated physical and electrical test regions
03/18/2014US8674046 Source material for preparing low dielectric constant material
03/18/2014US8673761 Reflow method for lead-free solder
03/18/2014US8673462 Low viscosity electrostatic discharge (ESD) dissipating adhesive substantially free of agglomerates
03/18/2014US8672844 Analyte monitoring device and methods of use
03/18/2014US8672517 Light-emitting module
03/17/2014DE202014000992U1 Halbleiterkühlstruktur Semiconductor cooling structure
03/13/2014WO2014039928A1 Systems and methods related to ablation and cleaning during manufacture of radio-frequency modules
03/13/2014WO2014039565A1 Low cost programmable multi-state device
03/13/2014WO2014038899A1 Heat radiation member, heat radiation circuit board, and heat emission device package
03/13/2014WO2014038676A1 Method for producing water-resistant aluminum nitride powder
03/13/2014WO2014038643A1 Semiconductor device and method for producing same
03/13/2014WO2014038587A1 Semiconductor device and production method for same
03/13/2014WO2014038326A1 Process for producing intermediate for interposer, and intermediate for interposer
03/13/2014WO2014038268A1 Piezoelectric vibration component
03/13/2014WO2014038179A1 Cooling device, electric automobile equipped with said cooling device, and electronic device
03/13/2014WO2014038176A1 Semiconductor device producing method
03/13/2014WO2014038128A1 Semiconductor device and method for producing same
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