Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2005
03/09/2005CN1192696C Conducting pulp and method for producing laminated ceramic electronic parts by same
03/09/2005CN1192695C Multilayer substrate module and portable wireless terminal
03/09/2005CN1192692C Multiple printed circuitboard for electronic components esp. acoustic surface wave elements, and method for constructing bumps, soldering frames, spaces on said multiple printed circuitboard
03/09/2005CN1192453C Monolithic microwave integrated circuit-waveguide radio frequency transition structure and correlation method
03/09/2005CN1192430C Semiconductor device and producing method thereof
03/09/2005CN1192429C 线路 Line
03/09/2005CN1192428C Capsule for semiconductor components
03/09/2005CN1192427C Method for producing integrated circuit having at least one metallized surface
03/09/2005CN1192426C Copper wiring
03/09/2005CN1192424C Method for preparing multiple layer inner connection circuit
03/09/2005CN1192421C Substrate element and soft substrate
03/09/2005CN1192420C Semiconductor device and its mfg. method, circuit board and electronic device
03/09/2005CN1191904C Tungsten-copper composite oxide powder and its preparing process
03/09/2005CA2478906A1 Techniques for pin arrangements in circuit chips
03/08/2005US6865381 System and method for on-chip filter tuning
03/08/2005US6865200 Cooling device
03/08/2005US6865089 Module board having embedded chips and components and method of forming the same
03/08/2005US6865084 Thermally enhanced semiconductor package with EMI shielding
03/08/2005US6865083 Clip for heat sink
03/08/2005US6865082 Heat dissipating assembly
03/08/2005US6865081 Microstructure cooler and use thereof
03/08/2005US6865079 Cooling fan
03/08/2005US6864701 Test patterns for measurement of effective vacancy diffusion area
03/08/2005US6864700 System for electronically coupling a device to an electrical apparatus
03/08/2005US6864590 Alignment mark for aligning wafer of semiconductor device
03/08/2005US6864588 MCM package with bridge connection
03/08/2005US6864587 Semiconductor device
03/08/2005US6864584 High speed transmission of electrical signals; reducing electrical resistance; copper and aluminum, or alloy thereof, wires
03/08/2005US6864583 Wiring structure of semiconductor device
03/08/2005US6864582 Semiconductor interconnect and method of providing interconnect using a contact region
03/08/2005US6864581 Etched metal trace with reduced RF impendance resulting from the skin effect
03/08/2005US6864579 Carrier with a metal area and at least one chip configured on the metal area
03/08/2005US6864578 Internally reinforced bond pads
03/08/2005US6864577 Via plug adapter
03/08/2005US6864576 Large line conductive pads for interconnection of stackable circuitry
03/08/2005US6864575 Electronic interface structures and methods
03/08/2005US6864574 Semiconductor package
03/08/2005US6864573 Two piece heat sink and device package
03/08/2005US6864572 Base for heat sink
03/08/2005US6864571 Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking
03/08/2005US6864570 Method and apparatus for fabricating self-assembling microstructures
03/08/2005US6864569 Stackable module
03/08/2005US6864566 Duel die package
03/08/2005US6864565 Post-passivation thick metal pre-routing for flip chip packaging
03/08/2005US6864564 Flash-preventing semiconductor package
03/08/2005US6864563 Exposure die to electrical charging; prevent electrical stresses; reactive ion etching
03/08/2005US6864562 Semiconductor device having active element connected to an electrode metal pad via a barrier metal layer and interlayer insulating film
03/08/2005US6864545 Semiconductor device including low-resistance wires electrically connected to impurity layers
03/08/2005US6864544 Semiconductor device having active regions connected together by interconnect layer and method of manufacture thereof
03/08/2005US6864541 Semiconductor device having a protruded active region, memory system having the same, and electronic apparatus having the same
03/08/2005US6864534 Semiconductor wafer
03/08/2005US6864526 Capacitor with via plugs forming first and second electrodes in a multilayer wiring structure of a semiconductor device
03/08/2005US6864515 Pressure contact type semiconductor device having dummy segment
03/08/2005US6864509 Packaging optically coupled integrated circuits using flip-chip methods
03/08/2005US6864435 Electrical contacts for flexible displays
03/08/2005US6864434 Warpage-preventive circuit board and method for fabricating the same
03/08/2005US6864424 Electronic component and package
03/08/2005US6864423 Bump chip lead frame and package
03/08/2005US6864183 Method for manufacturing a semiconductor device
03/08/2005US6864176 Fabrication process for bonded wafer precision layer thickness control and its non-destructive measurement method
03/08/2005US6864172 Manufacturing method of semiconductor device
03/08/2005US6864171 Via density rules
03/08/2005US6864170 Compact semiconductor structure
03/08/2005US6864169 Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device
03/08/2005US6864168 Bump and fabricating process thereof
03/08/2005US6864165 Method of fabricating integrated electronic chip with an interconnect device
03/08/2005US6864153 Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another
03/08/2005US6864137 MIM capacitor with diffusion barrier
03/08/2005US6864124 Method of forming a fuse
03/08/2005US6864122 Multi-chip module having content addressable memory
03/08/2005US6864121 Method of manufacturing circuit device
03/08/2005US6864120 Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion
03/08/2005US6864119 COF semiconductor device and a manufacturing method for the same
03/08/2005US6864118 Electronic devices containing organic semiconductor materials
03/08/2005US6864117 Method for producing solid-state imaging device
03/08/2005US6864116 Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof
03/08/2005US6863962 Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same
03/08/2005US6863787 Dummy copper deprocessing
03/08/2005US6863119 Cooling device boiling and condensing refrigerant
03/08/2005US6862895 Semiconductor cooling device and method of controlling same
03/08/2005US6862804 Method of mounting camera module on wiring board
03/03/2005WO2005020651A1 Method for manufacturing an electronic module, and an electronic module
03/03/2005WO2005020383A1 Pressure contact spring for a contact arrangement in a power semiconductor module
03/03/2005WO2005020343A1 Method for sealing thin film transistors
03/03/2005WO2005020339A1 Thermoelectric material, thermoelectric element and thermoelectric module, and method for manufacturing same
03/03/2005WO2005020322A1 Press-fit diode comprising a silver-plated wire terminal
03/03/2005WO2005020321A1 Integrated connection arrangement and production method
03/03/2005WO2005020320A1 Semiconductor device, method for manufacturing same, and power converter using such semiconductor device
03/03/2005WO2005020319A2 Method for ltcc zero x-y shrinkage
03/03/2005WO2005020315A1 Substrate for device bonding, device bonded substrate, and method for producing same
03/03/2005WO2005020297A2 Technique for evaluating a fabrication of a semiconductor component and wafer
03/03/2005WO2005020288A2 Multiple cavity/compartment package
03/03/2005WO2005020285A2 Extrusion thermo-electric temperature control unit
03/03/2005WO2005020281A2 Process and electronic assembly for removing heat from a circuit device
03/03/2005WO2005020279A2 Semiconductor device having electrical contact from opposite sides and method therefor
03/03/2005WO2005019938A1 Proportional variable resistor structures to electrically measure mask misalignment
03/03/2005WO2005019342A1 Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance
03/03/2005WO2005019195A2 Nano-filled composite materials with exceptionally high glass transition temperature
03/03/2005WO2005019132A1 Highly heat-conductive member, method for producing same, and heat dissipating system using same
03/03/2005WO2005019095A1 Fabricating nanoscale and atomic scale devices
1 ... 1399 1400 1401 1402 1403 1404 1405 1406 1407 1408 1409 1410 1411 1412 1413 1414 1415 1416 1417 1418 1419 ... 2262