Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2005
03/10/2005DE202004016737U1 Spring system for holding an adapter for a heat conducting tube in position against an electronic processor chip
03/10/2005DE202004016736U1 Spring system for holding an adapter for a heat conducting tube in position against an electronic processor chip
03/10/2005CA2537688A1 No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance
03/10/2005CA2537259A1 Integrated circuit package having an inductance loop formed from a multi-loop configuration
03/10/2005CA2536799A1 Semiconductor package and method of manufacturing the same
03/09/2005EP1513386A2 Electronic apparatus
03/09/2005EP1513200A2 Solid-state imaging device and method for manufacturing the same
03/09/2005EP1513197A2 Power integrated circuit with distributed gate driver
03/09/2005EP1513195A1 Semiconductor device and its manufacturing method
03/09/2005EP1513194A2 Cooling device for semiconductor component
03/09/2005EP1513170A2 A spiral inductor formed in a semiconductor substrate and a method for forming the inductor
03/09/2005EP1513043A2 Memory card
03/09/2005EP1512176A1 Die connected with integrated circuit component
03/09/2005EP1512175A1 Electrical component
03/09/2005EP1512114A1 Method of producing a digital fingerprint sensor and the corresponding sensor
03/09/2005EP1148976B1 Method and apparatus for deposition on and polishing of a semiconductor surface
03/09/2005EP1145612B1 Method for mounting an electronic component
03/09/2005EP0950263B1 A high power prematched mmic transistor with improved ground potential continuity
03/09/2005CN2684380Y Enclosed type integral liquid cooling radiator
03/09/2005CN2684379Y A radiating apparatus
03/09/2005CN2684378Y Buckling type radiator
03/09/2005CN2684377Y Assembled radiator with radiating airflow leading sand grip
03/09/2005CN2684376Y Radiating backboard and radiating module
03/09/2005CN2684375Y 芯片封装结构 Chip package
03/09/2005CN2684254Y Fixing device for CPU radiator
03/09/2005CN1593075A Electrically isolated module
03/09/2005CN1592968A Module part
03/09/2005CN1592967A Soldered heat sink anchor and method of use
03/09/2005CN1592966A Module part
03/09/2005CN1592965A Chip and wafer integration process using vertical connections
03/09/2005CN1592963A Method of using ternary copper alloy to obtain a low resistance and large grain size interconnect
03/09/2005CN1592959A Method for forming an oxynitride spacer for a metal gate electrode using a PECVD process with a silicon-starving atmosphere
03/09/2005CN1592946A An integrated circuit resistant to the formation of cracks in a passivation layer
03/09/2005CN1592764A Process for producing organic compound epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained with epoxy resin
03/09/2005CN1592659A Hot melt conductor paste composition
03/09/2005CN1592568A High performance cooling device with vapor chamber
03/09/2005CN1592567A Heat pipe having sealing container
03/09/2005CN1592543A Welding disk pattern structure and substrate for carrging electrical components
03/09/2005CN1592538A 电路装置 Circuit means
03/09/2005CN1592098A Electronic component
03/09/2005CN1592010A Cooling device for semiconductor component
03/09/2005CN1591967A Substrate having microstrip line structure, semiconductor device having microstrip line structure, and manufacturing method of substrate having microstrip line structure
03/09/2005CN1591914A Lighting device of LED element
03/09/2005CN1591901A 半导体装置 Semiconductor device
03/09/2005CN1591897A Semiconductor device and its mfg method
03/09/2005CN1591891A Digital image taking module packaging structure and mfg. process
03/09/2005CN1591890A Digital image taking module packaging structure and mfg. process
03/09/2005CN1591889A Solid-state imaging device and method for manufacturing the same
03/09/2005CN1591867A Semiconductor device
03/09/2005CN1591865A High-power RF integrated circuit capable of blocking parasitic loss current and its mfg. method
03/09/2005CN1591863A Semiconductor device, semiconductor module and method of manufacturing semiconductor device
03/09/2005CN1591862A Bridging multi-chip Packaging structure
03/09/2005CN1591861A Circuit component built-in module and method for manufacturing the same
03/09/2005CN1591859A Method for mfg. silicon rectifier as electro static discharge protection
03/09/2005CN1591858A Dual damascene integration of ultra low dielectric constant porous materials
03/09/2005CN1591857A Semiconductor device and production method therefor
03/09/2005CN1591855A Integrated circuit structure with air space and its mfg. method
03/09/2005CN1591854A Method for mfg solid imaging device
03/09/2005CN1591853A Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package
03/09/2005CN1591852A High-frequency IC multi-bus knot tying structure and method
03/09/2005CN1591851A Liquid cooling system and electronic apparatus using the same
03/09/2005CN1591850A Semiconductor package with radiating fins
03/09/2005CN1591849A Electronic apparatus
03/09/2005CN1591848A Method for producing heating degassing heat conducting pipes
03/09/2005CN1591847A Heat radiating component
03/09/2005CN1591846A Heat radiating module
03/09/2005CN1591845A Circular pipe type radiator structure
03/09/2005CN1591844A Semiconductor CPU radiator
03/09/2005CN1591843A Semiconductor assembly device containing nanoparticle isolated layer
03/09/2005CN1591842A Circuit board and method of manufacturing the same
03/09/2005CN1591841A Tape circuit substrate and semiconductor chip package using the same
03/09/2005CN1591840A Flexible substrate, semiconductor package and method of manufacturing the same
03/09/2005CN1591839A BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same
03/09/2005CN1591828A 半导体集成电路 The semiconductor integrated circuit
03/09/2005CN1591827A Method of generating interconnection pattern
03/09/2005CN1591810A Mfg. method for emiconductor device
03/09/2005CN1591809A Adhesive sheet for producing a semiconductor device
03/09/2005CN1591808A Electronic component and method for manufacturing the same
03/09/2005CN1591807A Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device
03/09/2005CN1591806A Ball grid array package and packaging method thereof
03/09/2005CN1591805A Method for mfg. heat reinforced ball grid array IC packaging substrate and packaging substrate
03/09/2005CN1591799A Method for mfg. transistors of static electricity discharging protector
03/09/2005CN1591797A Semiconductor device and its conductive structure forming process
03/09/2005CN1591795A Semiconductor device with concave patterns in dielectric film and manufacturing method thereof
03/09/2005CN1591789A Manufacturing method of semiconductor device
03/09/2005CN1591787A Cutting method, cutting device and method of manufacturing semiconductor device
03/09/2005CN1591785A Self-aligning contact window open mfg. method, internal connecting structure and mfg. method thereof
03/09/2005CN1591776A Semiconductor and method of manufacturing the same
03/09/2005CN1591699A Radiator and radiating method
03/09/2005CN1591695A Test structure for a single-sided buried strap dram memory cell data array
03/09/2005CN1591548A Electrooptical apparatus and electronic apparatus
03/09/2005CN1591475A Semiconductor device and production method theref
03/09/2005CN1591280A Non-fan type computer device radiator
03/09/2005CN1591278A Phase change heat radiator
03/09/2005CN1591191A Etching method and method for mfg circuit device thereby
03/09/2005CN1591167A Light source device, method for manufacturing light source device, and projection type display apparatus
03/09/2005CN1590500A Thermosoftening heat conducting component
03/09/2005CN1590498A Liquid epoxy packaging material and its preparation method and application
03/09/2005CN1590278A Die carrier
03/09/2005CN1589993A Processing method of heat radiator