Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2005
03/10/2005US20050054753 Comprising a crosslinkable fluoroelastomer, a crosslinking agent, and a polyimide resin powder as a reinforcing material; seals free from metals and sulfur, suitable for the production unit for semiconductor devices
03/10/2005US20050054200 Fast firing flattening method and apparatus for sintered multilayer ceramic electronic substrates
03/10/2005US20050054195 Semiconductor device and method for fabricating the same
03/10/2005US20050054190 Semiconductor device and method of manufacturing the same
03/10/2005US20050054189 Methods of fabricating integrated circuit devices providing improved short prevention
03/10/2005US20050054188 Semiconductor device and method of manufacturing the same
03/10/2005US20050054187 Method for forming ball pads of BGA substrate
03/10/2005US20050054184 Method for fabricating microstructures and arrangement of microstructures
03/10/2005US20050054155 Semiconductor device having fuse circuit on cell region and method of fabricating the same
03/10/2005US20050054154 Solder bump structure and method for forming the same
03/10/2005US20050054152 Symmetric inducting device for an integrated circuit having a ground shield
03/10/2005US20050054151 Symmetric inducting device for an integrated circuit having a ground shield
03/10/2005US20050054147 Semiconductor component circuit with a reduced oscillation tendency
03/10/2005US20050054143 Using benzocyclobutene based polymers as underfill materials
03/10/2005US20050054142 Semiconductor device and manufacturing method of semiconductor device
03/10/2005US20050054141 Thin semiconductor package having stackable lead frame and method of manufacturing the same
03/10/2005US20050054139 Enhanced electrically-aligned proximity communication
03/10/2005US20050054126 System and method for marking the surface of a semiconductor package
03/10/2005US20050054125 Method and apparatus for thermally assisted testing of integrated circuits
03/10/2005US20050052924 Memory card
03/10/2005US20050052848 Liquid cooling system
03/10/2005US20050052847 Liquid cooling system
03/10/2005US20050052822 Capacitor structure, a multi-layer wiring board including the same, and a semiconductor device using the multi-layer wiring board
03/10/2005US20050052799 ESD protecting circuit embedded in an SIP chip using a plurality of power sources
03/10/2005US20050052442 Display device
03/10/2005US20050052272 Inductive component
03/10/2005US20050052268 Embedded toroidal inductors
03/10/2005US20050052196 Active cooling to reduce leakage power
03/10/2005US20050052191 In situ determination of resistivity, mobility and dopant concentration profiles
03/10/2005US20050051927 Placing a desired volume of thermoplastic adhesive in a mold having opposing concave inner surfaces and applying heat and pressure to adhesive until it conforms to concave inner surfaces of mold, thereby forming a thermoplastic preform having opposing convex outer surfaces; avoids entrapment of air
03/10/2005US20050051910 Capacitance type dynamic quantity sensor device
03/10/2005US20050051909 Semiconductor device
03/10/2005US20050051908 Diode exhibiting a high breakdown voltage
03/10/2005US20050051907 Integrated circuit package
03/10/2005US20050051906 I/O architecture for integrated circuit package
03/10/2005US20050051905 Semiconductor component having a plastic housing and methods for its production
03/10/2005US20050051904 Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow
03/10/2005US20050051903 Stackable electronic assembly
03/10/2005US20050051902 Semiconductor substrate and test pattern for the same
03/10/2005US20050051901 Memory device with discrete layers of phase change memory material
03/10/2005US20050051900 Method for forming dielectric barrier layer in damascene structure
03/10/2005US20050051899 Semiconductor device and production method therefor
03/10/2005US20050051898 Semiconductor device
03/10/2005US20050051897 Bonding pad design for impedance matching improvement
03/10/2005US20050051896 Arrangement for improving module reliability
03/10/2005US20050051895 BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same
03/10/2005US20050051894 Thick metal layer integrated process flow to improve power delivery and mechanical buffering
03/10/2005US20050051893 SBGA design for low-k integrated circuits (IC)
03/10/2005US20050051891 Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it
03/10/2005US20050051890 Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same
03/10/2005US20050051889 Integrated circuit packaging architecture
03/10/2005US20050051888 Heat sink and display panel including heat sink
03/10/2005US20050051887 Clock distribution networks and conductive lines in semiconductor integrated circuits
03/10/2005US20050051886 Semiconductor device and method of manufacturing the same
03/10/2005US20050051884 Multiple cavity/compartment package
03/10/2005US20050051883 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
03/10/2005US20050051882 Stacked chip package having upper chip provided with trenches and method of manufacturing the same
03/10/2005US20050051881 Method and structure for prevention leakage of substrate strip
03/10/2005US20050051880 Tape substrates with mold gate support structures that are coplanar with conductive traces thereof and associated methods
03/10/2005US20050051879 Plating tail design for IC packages
03/10/2005US20050051878 Flip chip substrate design
03/10/2005US20050051877 Semiconductor package having high quantity of I/O connections and method for fabricating the same
03/10/2005US20050051876 Integrated circuit package with leadframe enhancement and method of manufacturing the same
03/10/2005US20050051875 Lead frame, manufacturing method of the same, and semiconductor device using the same
03/10/2005US20050051872 Method of manufacturing an IC coil mounted in an imformation carrier
03/10/2005US20050051871 Symmetric inducting device for an integrated circuit having a ground shield
03/10/2005US20050051870 Semiconductor device and a method of manufacturing the same
03/10/2005US20050051869 Semiconductor device
03/10/2005US20050051868 Method of closing an antifuse
03/10/2005US20050051865 Control of air gap position in a dielectric layer
03/10/2005US20050051864 Control of air gap position in a dielectric layer
03/10/2005US20050051855 Semiconductor device
03/10/2005US20050051848 Method of manufacturing an ESD protection device with the same mask for both LDD and ESD implantation
03/10/2005US20050051841 Stress-controlled dielectric integrated circuit
03/10/2005US20050051838 Protection against in-process charging in silicon-oxide-nitride-oxide-silicon (SONOS) memories
03/10/2005US20050051814 Semiconductor device and a method of manufacturing the same
03/10/2005US20050051810 Semiconductor package and method of manufacturing the same
03/10/2005US20050051809 Dummy fill for integrated circuits
03/10/2005US20050051803 Wiring layout of semiconductor device and design method of the same
03/10/2005US20050051792 Semiconductor package
03/10/2005US20050051765 Test structure for a single-sided buried strap DRAM memory cell array
03/10/2005US20050051605 Process of manufacturing a solder-fill for applying to semiconductor package
03/10/2005US20050051604 Method and system for forming ball grid array ("BGA") packages
03/10/2005US20050051359 Coupler resource module
03/10/2005US20050051356 Copper paste and wiring board using the same
03/10/2005US20050051352 Semiconductor package, electronic circuit device, and mounting method of semiconducter device
03/10/2005US20050051351 Semiconductor device, card, system, and methods of initializing and checking the authenticity and the identify of the semiconductor device
03/10/2005US20050051349 Radiation shielded semiconductor device package
03/10/2005US20050051307 Integrated circuit heat pipe heat spreader with through mounting holes
03/10/2005US20050051306 Heat transfer apparatus
03/10/2005US20050051304 Heat transport device and electronic device
03/10/2005US20050051303 Heat transport device and electronic apparatus
03/10/2005US20050051302 Cooling apparatus
03/10/2005US20050051300 Apparatus and method for passive phase change thermal management
03/10/2005US20050051298 Cooler for cooling both sides of semiconductor device
03/10/2005US20050051297 Heat sink
03/10/2005US20050051296 Heat sink
03/10/2005US20050050946 Cleaning evaluation method for a substrate
03/10/2005DE202004017271U1 Cooler for integrated electronic circuit module has heat sink that is easily fixed to frame of cooling fan
03/10/2005DE202004016742U1 Spring system for holding an adapter for a heat conducting tube in position against an electronic processor chip
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