Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2005
03/17/2005US20050056400 Heat pipe type heat dissipation device
03/17/2005US20050056399 Radiator including a heat sink and a fan
03/17/2005US20050056398 Stackable heat sink
03/17/2005US20050056365 Thermal interface adhesive
03/17/2005US20050056102 Gas collecting device, test head and IC device testing apparatus
03/17/2005US20050056030 Dynamic fluid sprayjet delivery system
03/17/2005US20050055828 Method for programming a routing layout design through one via layer
03/17/2005DE19650148B4 Halbleitervorrichtung und zugehöriges Herstellungsverfahren A semiconductor device and manufacturing method thereof
03/17/2005DE10346855A1 Einpressdiode mit versilbertem Drahtanschluss Press-fit diode with silver plated wire connection
03/17/2005DE10337640A1 Power semiconductor module for fitting on a heat sink has a casing, power semiconductor components and an insulating substrate with metal layers on both sides
03/17/2005DE10336747A1 Semiconductor component used as a power transistor comprises a layer structure with a semiconductor chip, a support for the chip and an electrically insulating layer made from nano-particles of an electrically insulating material
03/17/2005DE10335813A1 IC-Chip mit Nanowires IC chip with nanowires
03/17/2005DE10334575A1 Elektronisches Bauteil und Nutzen zur Herstellung desselben Electronic component and benefits of manufacturing the same
03/17/2005DE10334502A1 Kühlvorrichtung zum Abführen von Verlustwärme von einem elektrischen oder elektronischen Bauelement oder einer Baugruppe sowie Kühler Cooling means for dissipating the heat loss of an electric or electronic component or assembly and cooler
03/17/2005DE10045534B4 Elektronisches Bauteil mit Außenanschlußelementen ausgebildet als Kapillarelement, Verfahren zur Herstellung und Anordnung An electronic part having external connection elements formed as capillary element, methods of making and arrangement
03/17/2005CA2538077A1 Fabrication of single or multiple gate field plates
03/17/2005CA2537830A1 Thermal conductive material utilizing electrically conductive nanoparticles
03/17/2005CA2537828A1 Solvent-modified resin system containing filler that has high tg, transparency and good reliability in wafer level underfill applications
03/17/2005CA2537827A1 Solvent-modified resin compositions and methods of use thereof
03/17/2005CA2536803A1 Thin bond-line silicone adhesive composition and method for preparing the same
03/16/2005EP1515595A2 Circuit support
03/16/2005EP1515399A2 Anisotropic conductive film, production method thereof and method of use thereof
03/16/2005EP1515389A1 Multilayer high frequency device with planar antenna thereon and manufacturing method thereof
03/16/2005EP1515366A2 Techniques for pad arrangements on circuit chips
03/16/2005EP1515365A2 Electronic assembly comprising substrate with embedded capacitors and methods of manufacture
03/16/2005EP1515364A2 Device package and methods for the fabrication and testing thereof
03/16/2005EP1514459A1 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate
03/16/2005EP1514307A1 Electronics circuit manufacture
03/16/2005EP1514306A2 Quad flat non-leaded package comprising a semiconductor device
03/16/2005EP1514304A1 Method for the production of an nrom memory cell arrangement
03/16/2005EP1514303A2 Layer assembly and method for producing a layer assembly
03/16/2005EP1514301A1 Optical fiber arrays with precise hole sizing
03/16/2005EP1454349A4 Trilayered beam mems device and related methods
03/16/2005EP1446841B1 A method of manufacturing a semiconductor device
03/16/2005EP1442481A4 Integrated circuit bus grid having wires with pre-selected variable widths
03/16/2005EP1353693B1 Pharmaceutical combination containing a 4-quinazolineamine and paclitaxel, carboplatin or vinorelbine for the treatment of cancer
03/16/2005EP1287063B1 Epoxy-resin systems, which are resistant to ageing, moulding materials and components produced therefrom and the use thereof
03/16/2005EP1212726B1 Method for producing a chip card module
03/16/2005EP1098757A4 Transferrable compliant fibrous thermal interface
03/16/2005EP1097477A4 Electronic device having fibrous interface
03/16/2005EP0932328B1 Substrate for mounting electronic part and process for manufacturing the same
03/16/2005CN2686095Y Electrooptical apparatus and semiconductor device
03/16/2005CN2686094Y 电子元件 Electronic component
03/16/2005CN2686093Y Semi-closed air-cooling radiator
03/16/2005CN2686092Y Vacuum heat conduction used for radiating fin integral forming structure
03/16/2005CN2686091Y Improved heat radiation module
03/16/2005CN2686090Y Fixing device for cooling fin
03/16/2005CN2686089Y Fastening structure for heat radiation assembly
03/16/2005CN2686088Y Radiating structural member fastening with integral forming elastic assembly
03/16/2005CN2686087Y Internal hook clasping heat radiating structural fastening
03/16/2005CN2686086Y Heat radiator holding device
03/16/2005CN1596473A Multi-chip module semiconductor devices
03/16/2005CN1596472A High power semiconductor module
03/16/2005CN1596471A Semiconductor device, card, system, and methods of initializing and checking the authenticity and the identify of the semiconductor device
03/16/2005CN1596470A Semiconductor device, card, methods of initializing checking the authenticity and the identity thereof
03/16/2005CN1596469A Receptacle for a programmable, electronic processing device
03/16/2005CN1596468A Arrangements to increase structural rigidity of semiconductor package
03/16/2005CN1596466A Improved metal barrier behavior by SIC:H deposition on porous materials
03/16/2005CN1595753A Static discharging protection device
03/16/2005CN1595675A A cooling arrangement for high temperature superconducting device
03/16/2005CN1595671A Semiconductor package
03/16/2005CN1595649A Electronic element and manufacturing method thereof
03/16/2005CN1595648A A high-frequency integrated circuit multi-in-line throwing structure
03/16/2005CN1595647A 半导体装置 Semiconductor device
03/16/2005CN1595646A 半导体器件 Semiconductor devices
03/16/2005CN1595645A Bonding wire arrangement structure of semiconductor chip package
03/16/2005CN1595644A Inverter device and method of manufacturing the device thereof, and electric automobile incorporating the inverter device thereof
03/16/2005CN1595643A High-frequency throwing structure
03/16/2005CN1595642A Bridging chip package structure
03/16/2005CN1595641A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
03/16/2005CN1595635A Semiconductor device and method for fabricating the same
03/16/2005CN1595629A Apparatus and method for mounting or wiring semiconductor chips
03/16/2005CN1595628A Memory chip manufacturing method and structure thereof
03/16/2005CN1595621A Semiconductor device and method of manufacturing the same
03/16/2005CN1595590A Plasma display panel structure for decreasing capacitance between electrodes
03/16/2005CN1595442A Memory card
03/16/2005CN1193649C Method and device for producing electrical connecting elementf
03/16/2005CN1193646C Printed circuit boards and their manufacture
03/16/2005CN1193469C Assembly of optical semiconductor parts and optical pick-up device
03/16/2005CN1193426C 半导体器件 Semiconductor devices
03/16/2005CN1193425C Multilayer substrate for semiconductor device
03/16/2005CN1193424C 半导体装置 Semiconductor device
03/16/2005CN1193418C Semiconductor device and mfg. method thereof, circuit substrate and electronic apparatus
03/16/2005CN1193417C Method for producing circuit device
03/16/2005CN1193416C Electronic device and method of manufacturing the electronic device
03/16/2005CN1193375C Non-volatile semiconductor memory and system
03/16/2005CN1193325C Component provided with a description
03/16/2005CN1193253C Platform and optical module, and producing method and optical transmission device
03/16/2005CN1193206C Method for manufacture of radiator
03/16/2005CN1192989C Silicon nitride powder, its sintered body, substrate and circuit board and thermoelectric element module thereof
03/16/2005CN1192954C Electric component containing metal box with magnetic loss material
03/16/2005CN1192837C Method for preparing even tungsten-copper fake alloy
03/15/2005US6868104 Compact laser package with integrated temperature control
03/15/2005US6868001 Semiconductor memory device
03/15/2005US6867983 sheet, a web, or a plate that is embedded with tiny electronic elements
03/15/2005US6867978 Integrated heat spreader package for heat transfer and for bond line thickness control and process of making
03/15/2005US6867977 Protective layer and an encapsulant for a thermal interface
03/15/2005US6867975 Heat sink, fixing method thereof and electronic apparatus using heat sink
03/15/2005US6867974 Heat-dissipating device
03/15/2005US6867973 Heat dissipation device with liquid coolant
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