Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2005
03/17/2005WO2005024939A1 SOLVENT-MODIFIED RESIN SYSTEM CONTAINING FILLER THAT HAS HIGH Tg, TRANSPARENCY AND GOOD RELIABILITY IN WAFER LEVEL UNDERFILL APPLICATIONS
03/17/2005WO2005024938A1 Solvent-modified resin compositions and methods of use thereof
03/17/2005WO2005024937A1 Electronic component comprising a cooling surface
03/17/2005WO2005024935A1 Semiconductor device
03/17/2005WO2005024933A1 Semiconductor device manufacturing method
03/17/2005WO2005024931A1 Semiconductor device and its manufacturing method
03/17/2005WO2005024913A1 Integrated circuit with a capacitor and method for the production thereof
03/17/2005WO2005024912A2 Methods of processing thick ild layers using spray coating or lamination for c4 wafer level thick metal integrated flow
03/17/2005WO2005024902A2 Method of forming a bond pad
03/17/2005WO2005024672A1 Esd test array and corresponding method
03/17/2005WO2005024611A2 Cooling system for electronic devices, especially computers
03/17/2005WO2005023936A1 Thin bond-line silicone adhesive composition and method for preparing the same
03/17/2005WO2005023702A1 Metal nanoparticle and method for producing same, liquid dispersion of metal nanoparticle and method for producing same, metal thin line, metal film and method for producing same
03/17/2005WO2005015633A3 Cooling device for dissipating thermal losses from an electric or electronic component or a sub-assembly and cooler
03/17/2005WO2005008767A3 Metal bump with an insulation for the side walls and method of fabricating a chip with such a metal bump
03/17/2005WO2005006403A9 Thermal paste for improving thermal contacts
03/17/2005WO2004100219A3 Electronic component packaging
03/17/2005WO2004090737A3 Sense amplifying latch with low swing feedback
03/17/2005WO2004073019B1 Semiconductor die package with reduced inductance and reduced die attach flow out
03/17/2005WO2004061901A3 Heatsink with multiple, selectable fin densities
03/17/2005WO2004016055A8 An electronic product, a body and a method of manufacturing
03/17/2005US20050060673 Method and apparatus for packaging test integrated circuits
03/17/2005US20050059772 Metal particles in cured sealant is sulfided using sulfur gas; corrosion resistance
03/17/2005US20050059273 Manufacturing Methods for Ultra-Slim USB Flash-Memory Card with Supporting Dividers or Underside Ribs
03/17/2005US20050059255 Wafer processing techniques with enhanced alignment
03/17/2005US20050059238 Cooling system for a semiconductor device and method of fabricating same
03/17/2005US20050059237 Method for manufacturing semiconductor device
03/17/2005US20050059236 Semiconductor device and a method of manufacturing the same
03/17/2005US20050059231 Semiconductor device and method for fabricating the same
03/17/2005US20050059230 Method for the lateral contacting of a semiconductor chip
03/17/2005US20050059221 Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices
03/17/2005US20050059219 Process for fabricating a thin film semiconductor device, thin film semiconductor device, and liquid crystal display
03/17/2005US20050059217 Methods of forming backside connections on a wafer stack
03/17/2005US20050059206 Integrated circuit devices having barrier layers between upper electrodes and dielectric layers and methods of fabricating the same
03/17/2005US20050059204 Semiconductor structure with one or more through-holes
03/17/2005US20050059202 Silicon on insulator device and layout method of the same
03/17/2005US20050059200 Semiconductor apparatus and method for fabricating the same
03/17/2005US20050059188 Image sensor packages and methods of fabrication
03/17/2005US20050059171 Method of laser annealing to form an epitaxial growth layer
03/17/2005US20050058543 Centrifugal Fan
03/17/2005US20050057908 Multi-layered interconnect structure using liquid crystalline polymer dielectric
03/17/2005US20050057903 Cooling structure for electronic element
03/17/2005US20050057902 Mold-type electronic control unit
03/17/2005US20050057901 Inverter device and method of manufacturing the device thereof, and electric automobile incorporating the inverter device thereof
03/17/2005US20050057900 Heat dissipating circulatory system with sputtering assembly
03/17/2005US20050057897 Heat dissipating device with heat conductive posts
03/17/2005US20050057883 Moisture-resistant electronic device package and methods of assembly
03/17/2005US20050057856 Head assembly, disk unit, and bonding method and apparatus
03/17/2005US20050057655 Method for automated testing of the modulation transfer function in image sensors
03/17/2005US20050057277 Signal isolators using micro-transformer
03/17/2005US20050056950 Integrated circuit suitable for use in radio receivers
03/17/2005US20050056949 Discrete semiconductor component
03/17/2005US20050056947 Apparatus and method for mounting or wiring semiconductor chips
03/17/2005US20050056944 Super-thin high speed flip chip package
03/17/2005US20050056943 Integrated electronic chip and interconnect device and process for making the same
03/17/2005US20050056942 Method of fabricating integrated electronic chip with an interconnect device
03/17/2005US20050056941 Etching openings in dielectric; forming barrier
03/17/2005US20050056938 Semiconductor device
03/17/2005US20050056937 Connection device and method of forming a connection device
03/17/2005US20050056936 Multi-layered metal routing technique
03/17/2005US20050056935 Semiconductor devices having a pocket line and methods of fabricating the same
03/17/2005US20050056934 Wiring and manufacturing method thereof, semiconductor device comprising said wiring, and dry etching method
03/17/2005US20050056933 Bumped wafer with adhesive layer encompassing bumps and manufacturing method thereof
03/17/2005US20050056932 Semiconductor device, and wiring-layout design system for automatically designing wiring-layout in such semiconductor device
03/17/2005US20050056931 High frequency circuit block unit, method for producing same, high frequency module device and method for producing same
03/17/2005US20050056930 Semiconductor device
03/17/2005US20050056928 Semiconductor package
03/17/2005US20050056927 Semiconductor device having a pair of heat sinks and method for manufacturing the same
03/17/2005US20050056926 Heat dissipating structure and semiconductor package with the same
03/17/2005US20050056925 High-frequency module and method for manufacturing the same
03/17/2005US20050056924 Semiconductor apparatus with decoupling capacitor
03/17/2005US20050056923 Apparatus and method for stacking integrated circuits
03/17/2005US20050056922 Expansion constrained die stack
03/17/2005US20050056921 Stacked module systems and methods
03/17/2005US20050056920 Lead frame with flag support structure
03/17/2005US20050056918 Power module package having improved heat dissipating capability
03/17/2005US20050056917 Wafer level package type FBAR device and manufacturing method thereof
03/17/2005US20050056916 Circuit device and manufacturing method of circuit device
03/17/2005US20050056915 Film carrier tape for mounting electronic devices thereon
03/17/2005US20050056914 Lead frame
03/17/2005US20050056913 Stereolithographic method for forming insulative coatings for via holes in semiconductor devices, insulative coatings so formed, systems for forming the insulative coatings, and semiconductor devices including via holes with the insulative coatings
03/17/2005US20050056912 Semiconductor device
03/17/2005US20050056911 Semiconductor-on-insulator constructions
03/17/2005US20050056906 Semiconductor device
03/17/2005US20050056903 Semiconductor package and method of manufacturing same
03/17/2005US20050056902 Solid state image pickup device and method of producing solid state image pickup device
03/17/2005US20050056897 Semiconductor device and manufacturing method thereof
03/17/2005US20050056896 Electrostatic discharge protection device with complementary dual drain implant
03/17/2005US20050056894 Semiconductor-on-insulator constructions
03/17/2005US20050056878 Thin film capacitor and method of manufacturing the same
03/17/2005US20050056851 Optoelectronic component and optoelectronic arrangement with an optoelectronic component
03/17/2005US20050056839 Thin film transistor circuit device, production method thereof and liquid crystal display using the thin film transistor circuit device
03/17/2005US20050056837 Wiring line and manufacture process thereof, and semiconductor device and manufacturing process thereof
03/17/2005US20050056834 Semiconductor integrated circuit device with test element group circuit
03/17/2005US20050056793 Process for precise arrangement of micro-bodies
03/17/2005US20050056446 Electronic component and method of manufacturing the same
03/17/2005US20050056445 Junction structure and junction method for conductive projection
03/17/2005US20050056405 Cooling apparatus and electronic equipment
03/17/2005US20050056404 Integrated liquid cooling system for electrical components
03/17/2005US20050056403 Thermosyphon and method for producing it
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