Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2005
03/23/2005CN1599064A Narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink jet head
03/23/2005CN1599063A Semiconductor device having a pair of heat sinks and method for manufacturing the same
03/23/2005CN1599062A Large-area heat sink structure for large power semiconductor device
03/23/2005CN1599061A Method for forming packaging structure with cavity
03/23/2005CN1599060A Packaging structure with cavity
03/23/2005CN1599059A 光接收器封装件 The optical receiver package
03/23/2005CN1599057A Semiconductor device, and wiring-layout design system for automatically designing wiring-layout in such semiconductor device
03/23/2005CN1599048A Method for manufacturing an electronic circuit device and electronic circuit device
03/23/2005CN1599047A Fabrication method of semiconductor integrated circuit device
03/23/2005CN1599024A Tin-doped indium oxide film and making process of fine pattern
03/23/2005CN1598737A Centrifugal fan
03/23/2005CN1598736A Computer heat sink with compression cooling function
03/23/2005CN1194470C Swith circuit
03/23/2005CN1194466C Radiator with built-in integrated circuit module
03/23/2005CN1194418C Manufacturing method of integrated element
03/23/2005CN1194417C Multilayer capacitor structure having array of concentric ring-shaped plates for deep sub-micron CMOS
03/23/2005CN1194410C Chip conducting lug and re-distributed wire layer configuration
03/23/2005CN1194409C Circuit board and its manufacturing method and high output module
03/23/2005CN1194394C Semiconductor device and fabrication method thereof
03/23/2005CN1194393C Fabrication process of a semiconductor device
03/22/2005US6871308 Semiconductor inspection method
03/22/2005US6870738 Power semiconductor module
03/22/2005US6870736 Heat sink and package surface design
03/22/2005US6870735 Heat sink with visible logo
03/22/2005US6870590 Electrooptical unit with a flexible board and electronic apparatus
03/22/2005US6870456 Integrated transformer
03/22/2005US6870380 Conductive material for integrated circuit fabrication
03/22/2005US6870361 System with nano-scale conductor and nano-opening
03/22/2005US6870276 Apparatus for supporting microelectronic substrates
03/22/2005US6870275 Semiconductor device, image scanning unit including the semiconductor device, and image forming apparatus including the image scanning unit
03/22/2005US6870274 Flash-preventing window ball grid array semiconductor package, method for fabricating the same, and chip carrier used in the semiconductor package
03/22/2005US6870273 High speed I/O pad and pad/cell interconnection for flip chips
03/22/2005US6870272 Methods of making microelectronic assemblies including compliant interfaces
03/22/2005US6870271 Integrated circuit assembly module that supports capacitive communication between semiconductor dies
03/22/2005US6870270 Method and structure for interfacing electronic devices
03/22/2005US6870268 Integrated circuit devices formed through selective etching of an insulation layer to increase the self-aligned contact area adjacent a semiconductor region
03/22/2005US6870265 Semiconductor device and manufacturing method thereof
03/22/2005US6870264 Multi-level circuit substrate, method for manufacturing same and method for adjusting a characteristic impedance therefor
03/22/2005US6870263 Device interconnection
03/22/2005US6870261 Discrete circuit component having an up-right circuit die with lateral electrical connections
03/22/2005US6870260 Semiconductor module
03/22/2005US6870259 Wafer scale fiber optic termination
03/22/2005US6870257 Power delivery through a flex tape in decoupled I/O-power hybrid substrate
03/22/2005US6870256 Semiconductor device having a thin-film circuit element provided above an integrated circuit
03/22/2005US6870255 Integrated circuit wiring architectures to support independent designs
03/22/2005US6870254 Flip clip attach and copper clip attach on MOSFET device
03/22/2005US6870252 Chip packaging and connection for reduced EMI
03/22/2005US6870251 High-power LGA socket
03/22/2005US6870250 Chip package structure having π filter
03/22/2005US6870249 Semiconductor device and manufacturing method thereof
03/22/2005US6870248 Semiconductor chip with external connecting terminal
03/22/2005US6870247 Interposer with a lateral recess in a slot to facilitate connection of intermediate conductive elements to bond pads of a semiconductor die with which the interposer is assembled
03/22/2005US6870246 Method and apparatus for providing an integrated circuit cover
03/22/2005US6870245 A package is housed a semiconductor device, dimensional stable, adhesively bonded, nondeforming; electronics are embedded in a castings or plastic molding materials
03/22/2005US6870244 Lead frame and production process thereof and production process of thermally conductive substrate
03/22/2005US6870243 Thin GaAs die with copper back-metal structure
03/22/2005US6870240 Anti-fuse and method for writing information into the anti-fuse
03/22/2005US6870230 Semiconductor device utilizing dummy features to form uniform sidewall structures
03/22/2005US6870206 Semiconductor chip, fabrication method, and device for fabricating a semiconductor chip
03/22/2005US6870184 Mechanically-stable BJT with reduced base-collector capacitance
03/22/2005US6870127 Chip scale marker and marking method
03/22/2005US6869887 Method for manufacturing thin film semiconductor device and method for forming resist pattern thereof
03/22/2005US6869875 Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process
03/22/2005US6869873 Copper silicide passivation for improved reliability
03/22/2005US6869872 Method of manufacturing a semiconductor memory device having a metal contact structure
03/22/2005US6869870 High performance system-on-chip discrete components using post passivation process
03/22/2005US6869869 Alignment and orientation features for a semiconductor package
03/22/2005US6869861 Back-side wafer singulation method
03/22/2005US6869840 Compensated-well electrostatic discharge protection devices
03/22/2005US6869832 Method for planarizing bumped die
03/22/2005US6869831 Adhesion by plasma conditioning of semiconductor chip surfaces
03/22/2005US6869829 Semiconductor chip, chip-on-chip structure device, and assembling method thereof
03/22/2005US6869827 Semiconductor/printed circuit board assembly, and computer system
03/22/2005US6869826 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
03/22/2005US6869825 Folded BGA package design with shortened communication paths and more electrical routing flexibility
03/22/2005US6869824 Fabrication method of window-type ball grid array semiconductor package
03/22/2005US6869823 Cerdip type of solid-state image sensing device, structure and method for gripping cerdip type of solid-state image sensing device
03/22/2005US6869822 Method of making a semiconductor device with adhesive sealing subjected to two-fold hardening
03/22/2005US6869819 Recognition method of a mark provided on a semiconductor device
03/22/2005US6869818 Method for producing and testing a corrosion-resistant channel in a silicon device
03/22/2005US6869813 Chip-type LED and process of manufacturing the same
03/22/2005US6869811 Methods for transfer molding encapsulation of a semiconductor die with attached heat sink
03/22/2005US6869810 Manufacturing method of semiconductor device
03/22/2005US6869752 Forming a high melting-point metal on an SOI (Silicon-on-Insulator) layer; transforming a layer of the high melting-point metal into a metal silicide layer by heat treatment; forming an interlayer insulating film; dry etching
03/22/2005US6869665 Wiring board with core layer containing inorganic filler
03/22/2005US6869642 Blend of paraffin and petrolatum having quantities of thermally-conductive particles, namely, graphite, applied to thermal interfaces
03/22/2005US6869487 Process and apparatus for treating a workpiece such as a semiconductor wafer
03/22/2005US6869290 Circuitized connector for land grid array
03/22/2005US6868899 Variable height thermal interface
03/22/2005US6868604 Method for forming an electrical structure
03/22/2005CA2462762A1 Light emission diode (led)
03/17/2005WO2005024994A1 Electromagnetic contact waveguide, its assembly, process for producing the same and recording medium
03/17/2005WO2005024947A1 Circuit device and method for manufacturing same
03/17/2005WO2005024946A1 Semiconductor device and method for manufacturing same
03/17/2005WO2005024945A1 Integrated circuit component and mounting method
03/17/2005WO2005024944A1 Lead frame and method of manufacturing the lead frame
03/17/2005WO2005024943A1 Active area bonding compatible high current structures
03/17/2005WO2005024942A1 Thermal conductive material utilizing electrically conductive nanoparticles
03/17/2005WO2005024941A1 Semiconductor device
03/17/2005WO2005024940A1 Package structure, printed board mounted with same, and electronic device having such printed board
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