Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2005
03/24/2005US20050062167 Package assembly for electronic device and method of making same
03/24/2005US20050062166 Single chip and stack-type chip semiconductor package and method of manufacturing the same
03/24/2005US20050062165 Method of forming closed air gap interconnects and structures formed thereby
03/24/2005US20050062162 Pad structure of semiconductor device for reducing or inhibiting wire bonding cracks
03/24/2005US20050062161 Conductor line structure and method for improved borderless contact process tolerance
03/24/2005US20050062159 electrical and electronic apparatus having metal layers on substrates, interlayer dielectric layer on the metal layer, apertures in the interlayer dielectric layer that exposes a portion of the metal layer and diffusion barriers made of tantalum silicon nitride having low resistivity
03/24/2005US20050062158 Manufacturing a bump electrode with roughened face
03/24/2005US20050062156 Integrating chip scale packaging metallization into integrated circuit die structures
03/24/2005US20050062155 Window ball grid array semiconductor package and method for fabricating the same
03/24/2005US20050062154 Electronically grounded heat spreader
03/24/2005US20050062153 Mounting structure of electronic component, electro-optic device, electronic equipment, and method for mounting electronic component
03/24/2005US20050062152 Window ball grid array semiconductor package with substrate having opening and mehtod for fabricating the same
03/24/2005US20050062151 Semiconductor integrated circuit and electronic apparatus having the same
03/24/2005US20050062150 Packaged electroosmotic pumps using porous frits for cooling integrated circuits
03/24/2005US20050062149 Integral heatsink ball grid array
03/24/2005US20050062148 Semiconductor package
03/24/2005US20050062147 Semiconductor device having heat dissipation layer
03/24/2005US20050062146 Semiconductor device and method of fabricating semiconductor device
03/24/2005US20050062144 Memory expansion and chip scale stacking system and method
03/24/2005US20050062143 Integrated circuit package design
03/24/2005US20050062142 Chip on glass package
03/24/2005US20050062141 Electronic package having a folded flexible substrate and method of manufacturing the same
03/24/2005US20050062139 Reinforced die pad support structure
03/24/2005US20050062137 Vertically-stacked co-planar transmission line structure for IC design
03/24/2005US20050062135 Semiconductor device and method for fabricating the same
03/24/2005US20050062126 Receptacle for a programmable, electronic processing device
03/24/2005US20050062122 Wafer-level packaging of optoelectronic devices
03/24/2005US20050062120 Packaging microelectromechanical structures
03/24/2005US20050062119 Optical receiver package
03/24/2005US20050062117 Optical receiver package
03/24/2005US20050062110 Semiconductor over-voltage protection structure for integrated circuit and for diode
03/24/2005US20050062107 Semiconductor and method of manufacturing the same
03/24/2005US20050062081 Semiconductor device and method for fabricating the same
03/24/2005US20050062067 Method for manufacturing electronic device including package
03/24/2005US20050062063 Semiconductor integrated circuit device and method of producing the same
03/24/2005US20050062059 Light emission diode (LED)
03/24/2005US20050062058 Semiconductor light emitting device and manufacturing method for the same
03/24/2005US20050062056 Optoelectronic device packaging with hermetically sealed cavity and integrated optical element
03/24/2005US20050062045 Processes of forming stacked resistor constructions
03/24/2005US20050061856 Fabrication method of semiconductor integrated circuit device
03/24/2005US20050061854 Method for mounting a semiconductor package onto PCB
03/24/2005US20050061780 Wiring repair apparatus
03/24/2005US20050061545 Via placement for layer transitions in flexible circuits with high density ball grid arrays
03/24/2005US20050061496 Thermal interface material with aligned carbon nanotubes
03/24/2005US20050061485 Heat exchanger
03/24/2005US20050061482 Integrated liquid cooling system for electrical components
03/24/2005US20050061480 Heat sinks and method of formation
03/24/2005US20050061479 Radiator with streamline airflow guiding structure
03/24/2005US20050061478 Circular heat sink assembly
03/24/2005US20050061477 Fan sink heat dissipation device
03/24/2005US20050061476 Heat sink with intermediate fan element
03/24/2005US20050061474 Method and apparatus for chip-cooling
03/24/2005US20050061107 Coated silver-containing particles, method and apparatus of manufacture, and silver-containing devices made therefrom
03/24/2005US20050060887 Method for producing metal/ceramic bonding circuit board
03/24/2005DE19964055B4 Anordnung zur Abführung von Verlustwärme Arrangement for dissipation of heat loss
03/24/2005DE10340974A1 Control unit for motor vehicles braking systems comprises a frame having a recess filled with a sealing gel which is viscous enough the flow around electrical strip conductors in the recess
03/24/2005DE10340118A1 Electric component with subsequently increased external air flow and creep paths for external terminals of embedded, or impregnated transformers, chokes, capacitors, converters, etc.,
03/24/2005DE10338078A1 Semiconductor substrate for semiconductor devices comprises metallic surfaces and non-metallic surfaces having a layer with irregularities to increase the adhesion between the non-metallic surfaces and a pressing composition
03/24/2005DE10337569A1 Integrierte Anschlussanordnung und Herstellungsverfahren Integrated terminal assembly and manufacturing processes
03/24/2005DE10336657A1 Compound aluminum and silicon carbide foam metal for use as heat exchanger, heat storage element, thermal insulation, noise insulation etc. has an open pored metal alloy of aluminum and silicon carbide
03/24/2005DE10217747B4 Verfahren zur Herstellung eines akustischen Oberflächenwellenfilterchippakets A process for producing a surface acoustic wave filter chip package
03/24/2005DE102004018634A1 System und Verfahren zum Steuern einer VLSI-Umgebung System and method for controlling a VLSI environment
03/24/2005DE10151394B4 Wafer und Verfahren zum Überwachen eines Halbleiterproduktionsprozesses A method of monitoring wafer and a semiconductor production process
03/24/2005CA2539463A1 Method and device for contacting vo semiconductor chips on a metallic substrate
03/24/2005CA2538214A1 Coupler resource module
03/23/2005EP1517603A1 Cooling device for electronic and electrical components
03/23/2005EP1517602A2 Cooling structure of electronic element
03/23/2005EP1517372A2 Electronic component, method for making the same, and lead frame and mold assembly for use therein
03/23/2005EP1517371A2 Electronic component, method for making the same, and lead frame and mold assembly for use therein
03/23/2005EP1517370A2 Method for producing metal/ceramic bonding circuit board
03/23/2005EP1517369A2 Method of manufacturing wafer level chip size package
03/23/2005EP1517368A2 Protection of a SiC surface via a GaN-layer
03/23/2005EP1517367A2 Resin composition for encapsulating semiconductor device
03/23/2005EP1517364A1 Semiconductor device and its producing method
03/23/2005EP1517363A2 Thin film semiconductor device and fabrication method therefor
03/23/2005EP1517166A2 Device package and methods for the fabrication and testing thereof
03/23/2005EP1516031A1 Heat curable adhesive composition, article, semiconductor apparatus and method
03/23/2005EP1516030A1 Photocurable adhesive compositions, reaction products of which have low halide ion content
03/23/2005EP1516026A1 Method for sealing porous materials during chip production and compounds therefor
03/23/2005EP1417712A4 Integrated arrays of modulators and lasers on electronics
03/23/2005EP1410433B1 Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices
03/23/2005CN2687849Y Four-side flat chip packaging structure
03/23/2005CN2687848Y Water choke connection structure of water-cooled high-power semiconductor device module
03/23/2005CN2687847Y Improved water-cooled radiator
03/23/2005CN2687846Y Radiating device
03/23/2005CN2687845Y Radiating fin
03/23/2005CN2687844Y Radiating fin
03/23/2005CN2687843Y Combined radiating device
03/23/2005CN2687842Y Radiating device
03/23/2005CN2687734Y Water-cooled type cooling device of computer CPU
03/23/2005CN1599957A Controlled impedance transmission lines in a redistribution layer
03/23/2005CN1599956A Semiconductor device and method of enveloping an integrated circuit
03/23/2005CN1599955A Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices
03/23/2005CN1599949A Interconnects with improved barrier layer adhesion
03/23/2005CN1599858A Heat exchanger
03/23/2005CN1599806A Support for microelectronic, microoptoelectronic or micromechanical devices
03/23/2005CN1599158A Optoelectronic device packaging with hermetically sealed cavity and integrated optical element
03/23/2005CN1599069A Semiconductor structure and application, especially for over-voltage
03/23/2005CN1599067A Process for fabricating a thin film semiconductor device, thin film semiconductor device, and liquid crystal display
03/23/2005CN1599065A Esd protection device
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