Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2005
03/29/2005US6872995 Ferroelectric capacitor, method of manufacturing same, and semiconductor memory device
03/29/2005US6872994 Semiconductor device having an active region whose width varies
03/29/2005US6872671 Insulators for high density circuits
03/29/2005US6872661 Leadless plastic chip carrier with etch back pad singulation and die attach pad array
03/29/2005US6872656 Semiconductor device and method of fabricating the same
03/29/2005US6872651 Manufacturing a bump electrode with roughened face
03/29/2005US6872650 Ball electrode forming method
03/29/2005US6872648 Reduced splattering of unpassivated laser fuses
03/29/2005US6872639 Fabrication of semiconductor devices with transition metal boride films as diffusion barriers
03/29/2005US6872630 Using V-groove etching method to reduce alignment mark asymmetric damage in integrated circuit process
03/29/2005US6872612 Local interconnect for integrated circuit
03/29/2005US6872603 Method for forming interconnections including multi-layer metal film stack for improving corrosion and heat resistances
03/29/2005US6872600 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
03/29/2005US6872599 Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)
03/29/2005US6872597 Method of manufacturing a semiconductor device and a semiconductor device
03/29/2005US6872594 Method of fabricating an electronic component
03/29/2005US6872592 Methods for providing an integrated circuit package with an alignment mechanism
03/29/2005US6872591 Method of making a semiconductor chip assembly with a conductive trace and a substrate
03/29/2005US6872590 Package substrate for electrolytic leadless plating and manufacturing method thereof
03/29/2005US6872589 High density chip level package for the packaging of integrated circuits and method to manufacture same
03/29/2005US6872583 Test structure for high precision analysis of a semiconductor
03/29/2005US6872579 Thin-film coil and method of forming same
03/29/2005US6872465 Solder
03/29/2005US6872081 Electronic device, method of manufacturing the same and method of designing the same, and circuit board and electronic instrument
03/29/2005US6871702 Heat dissipator
03/29/2005US6871701 Plate-type heat pipe and method for manufacturing the same
03/29/2005US6871698 Heat dissipation device with interlocking fins
03/29/2005US6871388 Method of forming an electronic component located on a surface of a package member with a space therebetween
03/29/2005CA2340108C Semiconductor package, semiconductor device, electronic device, and method for producing semiconductor package
03/26/2005CA2482483A1 Use of graphite foam materials in pumped liquid, two phase cooling, cold plates
03/24/2005WO2005027609A1 Liquid cooling system
03/24/2005WO2005027607A1 Laser monitoring and control in a transmitter optical subassembly having a ceramic feedthrough header assembly
03/24/2005WO2005027602A1 Method for manufacturing an electronic module
03/24/2005WO2005027225A1 Stackable electronic assembly
03/24/2005WO2005027223A1 Semiconductor module including circuit device and insulating film, method for manufacturing same, and application of same
03/24/2005WO2005027222A2 Assembly of an electrical component comprising an electrical insulation film on a substrate and method for producing said assembly
03/24/2005WO2005027221A1 Chip on flex tape with dimension retention pattern
03/24/2005WO2005027200A2 Method and device for contacting vo semiconductor chips on a metallic substrate
03/24/2005WO2005027198A2 Doped alloys for electrical interconnects, methods of production and uses thereof
03/24/2005WO2005027197A2 Coupler resource module
03/24/2005WO2005027196A2 Radiation shielded semiconductor device package
03/24/2005WO2005027193A2 Embedded toroidal inductors
03/24/2005WO2005026749A1 Current sensor
03/24/2005WO2005025940A1 Control unit and method for producing the same
03/24/2005WO2005025688A1 Exercise machine
03/24/2005WO2005013364A3 Electronic component and panel for producing the same
03/24/2005WO2005010984A3 Pecvd silicon-rich oxide layer for reduced uv charging in an eeprom
03/24/2005WO2005006433A3 Mold compound cap in a flip chip multi-matrix array package and process of making same
03/24/2005WO2004114336A3 Method for forming a high-voltage / high-power die package
03/24/2005WO2004109816A3 Encapsulant for opto-electronic devices and method for making it
03/24/2005WO2004109771A3 Stackable semiconductor device and method of manufacturing the same
03/24/2005WO2004093190A3 Multichip module comprising a plurality of semiconductor chips and printed circuit board comprising a plurality of components
03/24/2005WO2004084269A3 Low dielectric materials and methods of producing same
03/24/2005WO2004061900A3 Thermal interface material and methods for assembling and operating devices using such material
03/24/2005US20050064732 Circuit carrier and production thereof
03/24/2005US20050064712 Method of polishing a semiconductor substrate, post-cmp cleaning process, and method of cleaning residue from registration alignment markings
03/24/2005US20050064707 Process and integration scheme for fabricating conductive components, through-vias and semiconductor components including conductive through-wafer vias
03/24/2005US20050064704 Manufacturing method of electronic components embedded substrate
03/24/2005US20050064703 Substrate processing method
03/24/2005US20050064695 System having semiconductor component with encapsulated, bonded, interconnect contacts
03/24/2005US20050064694 Method and system for packaging ball grid arrays
03/24/2005US20050064693 Novel bonding pad structure to minimize IMD cracking
03/24/2005US20050064676 Method of forming alignment mark
03/24/2005US20050064675 Method of fabricating crystalline silicon and switching device using crystalline silicon
03/24/2005US20050064660 Methods of fabricating integrated circuit devices that utilize doped poly-Si1-xGex conductive plugs as interconnects
03/24/2005US20050064657 Interdigital capacitor and method for adjusting the same
03/24/2005US20050064635 METHOD FOR AVOIDING OXIDE UNDERCUT DURING PRE-SILICIDE CLEAN FOR THIN SPACER FETs
03/24/2005US20050064630 Method for producing a protection for chip edges and system for the protection of chip edges
03/24/2005US20050064628 Electrical or electronic component and method of producing same
03/24/2005US20050064627 Method for manufacturing an electronic circuit device and electronic circuit device
03/24/2005US20050064626 Connection components with anistropic conductive material interconnector
03/24/2005US20050064625 Method for mounting passive components on wafer
03/24/2005US20050064624 Method of manufacturing wafer level chip size package
03/24/2005US20050064612 Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
03/24/2005US20050064607 Magnetically shielded circuit board
03/24/2005US20050064230 Bulk high thermal conductivity feedstock and method of making thereof
03/24/2005US20050064201 Resin composition for encapsulating semiconductor device
03/24/2005US20050064139 Sheet material having metal points and method for the production thereof
03/24/2005US20050064098 thin metal films by atomic layer deposition: tungsten nucleation layer over a silicon wafer; copper film from CuCl and triethylboron; vapor phase pulses in inert gas
03/24/2005US20050064065 Apparatus for molding a semiconductor wafer and process therefor
03/24/2005US20050063822 Airflow guiding structure for a heat dissipation fan
03/24/2005US20050063635 Wiring board and a semiconductor device using the same
03/24/2005US20050063580 Method and system for positioning articles with respect to a processing tool
03/24/2005US20050063432 Communication semiconductor component
03/24/2005US20050063165 Placement of sacrificial solder balls underneath the PBGA substrate
03/24/2005US20050063164 Integrated circuit die/package interconnect
03/24/2005US20050063161 Heat sink and method for its production
03/24/2005US20050063160 Heat-dissipating plate module
03/24/2005US20050063159 Heat-dissipating fin module
03/24/2005US20050063158 Cooling device for electronic and electrical components
03/24/2005US20050063157 Temperature control system which sprays liquid coolant droplets against an IC-module and directs radiation against the IC-module
03/24/2005US20050063127 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
03/24/2005US20050063033 Microelectronic devices and methods for packaging microelectronic devices
03/24/2005US20050062575 Integrated transformer
03/24/2005US20050062173 Microelectronic substrates with integrated devices
03/24/2005US20050062172 Semiconductor package
03/24/2005US20050062171 Bridge connection type of chip package and fabricating method thereof
03/24/2005US20050062170 Method of forming a bond pad on an I/C chip and resulting structure
03/24/2005US20050062169 Designs and methods for conductive bumps
03/24/2005US20050062168 Bonded structure using conductive adhesives, and a manufacturing method thereof
1 ... 1391 1392 1393 1394 1395 1396 1397 1398 1399 1400 1401 1402 1403 1404 1405 1406 1407 1408 1409 1410 1411 ... 2262