Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2005
03/30/2005CN2689461Y Electrothermal modules
03/30/2005CN2689457Y LED luminescent device for signal light
03/30/2005CN2689456Y Fin and Module therefrom
03/30/2005CN2689455Y Liquid and gas cooling radiators
03/30/2005CN2689454Y Radiators
03/30/2005CN2689453Y Air-conditioner style radiators
03/30/2005CN2689452Y Universal radiator buckle apparatus
03/30/2005CN2689451Y Diode radiating structure
03/30/2005CN2689450Y Radiators
03/30/2005CN2689449Y Radiators
03/30/2005CN2689448Y Circuit carried boards
03/30/2005CN1602548A Semiconductor package device and method of formation and testing
03/30/2005CN1602406A Cooling device, electronic equipment, and method of manufacturing cooling device
03/30/2005CN1602151A Display apparatus
03/30/2005CN1602144A Method of mounting wafer on printed wiring substrate
03/30/2005CN1602139A Hybrid integrated circuit device and method of manufacturing the same
03/30/2005CN1602137A 电路装置 Circuit means
03/30/2005CN1602136A 电路装置 Circuit means
03/30/2005CN1601771A Semiconductor light emitting device and manufacturing method for the same
03/30/2005CN1601768A LED structure
03/30/2005CN1601767A Backlight plate of LED
03/30/2005CN1601757A High frequncy diode
03/30/2005CN1601748A Semiconductor device provided with overheat protection circuit and electronic circuit using the same
03/30/2005CN1601747A Turn-on-efficient bipolar structures with deep N-well for on-chip ESD protection
03/30/2005CN1601746A Protector for electrostatic discharging
03/30/2005CN1601745A Electrostatic discharging protective circuit of controlling substrate potential and its method
03/30/2005CN1601744A Method of preventing electrostatic discharging of drive
03/30/2005CN1601743A Semiconductor device and method of fabricating semiconductor device
03/30/2005CN1601741A Semiconductor device and method for fabricating the same
03/30/2005CN1601740A Carrier-belt automatic bonding type semiconductor device
03/30/2005CN1601738A Mfg method of virtul welding lug structure avoiding generation of capacity
03/30/2005CN1601737A Crystal coated packing structure and its mfg method
03/30/2005CN1601736A Semiconductor integrated circuit and electronic apparatus having the same
03/30/2005CN1601735A Semiconductor device and method for fabricating the same
03/30/2005CN1601734A Elastic lug structure and its mfg method
03/30/2005CN1601733A Active evaporating radiation tech of power semiconductor device or modular
03/30/2005CN1601732A Temp regulator of semiconductor substrate
03/30/2005CN1601731A 冷却模块 Cooling Module
03/30/2005CN1601730A Structure of heat sink for radiation of electronic component
03/30/2005CN1601729A Semiconductor device and its manufacturing method
03/30/2005CN1601728A Semiconductor device
03/30/2005CN1601727A Intermediate chip module, semiconductor element, circuit substrate and electronic equipment
03/30/2005CN1601725A CMOS and its forming method
03/30/2005CN1601716A Method of evaluating solution for coating film of semiconductor
03/30/2005CN1601714A Semiconductor device and its mfg.method
03/30/2005CN1601713A Method of manufacturing semiconductor device
03/30/2005CN1601712A Reinforced solder bump structure and method for forming a reinforced solder bump
03/30/2005CN1601711A Method of manufacturing a semiconductor device
03/30/2005CN1601705A Method for dicing semiconductor wafer
03/30/2005CN1601700A Method of fabricating crystalline silicon and switching device using crystalline silicon
03/30/2005CN1601698A Method of forming alignment mark
03/30/2005CN1601558A 可携带的电子装置 Portable electronic device may be
03/30/2005CN1601360A Thin film transistor circuit device, production method thereof and liquid crystal display using the thin film transistor circuit device
03/30/2005CN1601343A Electro-optical device, method for making the same, and electronic apparatus
03/30/2005CN1600809A Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device
03/30/2005CN1195324C 半导体集成电路 The semiconductor integrated circuit
03/30/2005CN1195323C Package structure of chip with pad array
03/30/2005CN1195322C Method for forming double-layer low-dielectric barrier-layer using for interconnection and its forming apparatus
03/30/2005CN1195253C Electronic apparatus
03/30/2005CN1195038C Sealing agent and liquid crystal display element using same
03/29/2005US6873563 Semiconductor circuit device adaptable to plurality of types of packages
03/29/2005US6873530 Stack up assembly
03/29/2005US6873529 High frequency module
03/29/2005US6873527 Heat transfer apparatus
03/29/2005US6873525 Liquid cooling system and personal computer using the same
03/29/2005US6873513 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
03/29/2005US6873511 Rectifier system
03/29/2005US6873242 Magnetic component
03/29/2005US6873230 High-frequency wiring board
03/29/2005US6873170 Method for detecting the reliability of integrated semiconductor components at high temperatures
03/29/2005US6873143 On-chip reference current and voltage generating circuits
03/29/2005US6873069 Very thin fan motor with attached heat sink
03/29/2005US6873065 Non-optical signal isolator
03/29/2005US6873060 Electronic component with a semiconductor chip, method of producing an electronic component and a panel with a plurality of electronic components
03/29/2005US6873059 Semiconductor package with metal foil attachment film
03/29/2005US6873058 Multilayer; substrate, semiconductor, dielectric
03/29/2005US6873057 Damascene interconnect with bi-layer capping film
03/29/2005US6873055 Integrated circuit arrangement with field-shaping electrical conductor
03/29/2005US6873054 Semiconductor device and a method of manufacturing the same, a circuit board and an electronic apparatus
03/29/2005US6873053 Semiconductor device with smoothed pad portion
03/29/2005US6873052 Porous, film, wiring structure, and method of forming the same
03/29/2005US6873051 Nickel silicide with reduced interface roughness
03/29/2005US6873049 Near hermetic power chip on board device and manufacturing method therefor
03/29/2005US6873047 Semiconductor device and manufacturing method thereof
03/29/2005US6873046 Chip-scale package and carrier for use therewith
03/29/2005US6873045 Semiconductor module and power conversion device
03/29/2005US6873044 Microwave monolithic integrated circuit package
03/29/2005US6873043 Electronic assembly having electrically-isolated heat-conductive structure
03/29/2005US6873041 Power semiconductor package with strap
03/29/2005US6873040 Semiconductor packages for enhanced number of terminals, speed and power performance
03/29/2005US6873039 Methods of making microelectronic packages including electrically and/or thermally conductive element
03/29/2005US6873038 Capacitor and semiconductor device and method for fabricating the semiconductor device
03/29/2005US6873036 Die stacking scheme
03/29/2005US6873035 Semiconductor device having capacitors for reducing power source noise
03/29/2005US6873034 Solid-state imaging device, method for producing same, and mask
03/29/2005US6873032 Thermally enhanced chip scale lead on chip semiconductor package and method of making same
03/29/2005US6873027 Encapsulated energy-dissipative fuse for integrated circuits and method of making the same
03/29/2005US6873017 ESD protection for semiconductor products
03/29/2005US6873015 Semiconductor constructions comprising three-dimensional thin film transistor devices and resistors
03/29/2005US6873014 Semiconductor device and method of manufacturing the same
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