Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2014
03/20/2014US20140077364 Semiconductor Device and Method of Forming Wire Studs as Vertical Interconnect in FO-WLP
03/20/2014US20140077363 Semiconductor Device and Method of Forming Dual-Sided Interconnect Structures in Fo-WLCSP
03/20/2014US20140077362 Semiconductor Device and Method of Forming Dual-Sided Interconnect Structures in FO-WLCSP
03/20/2014US20140077361 Semiconductor Device and Method of Forming Build-Up Interconnect Structures Over Carrier for Testing at Interim Stages
03/20/2014US20140077360 Interconnection Structure and Method of Forming Same
03/20/2014US20140077359 Ladder Bump Structures and Methods of Making Same
03/20/2014US20140077358 Bump Structure and Method of Forming Same
03/20/2014US20140077357 Circuit substrate and process for fabricating the same
03/20/2014US20140077356 Post Passivation Interconnect Structures and Methods for Forming the Same
03/20/2014US20140077355 Three-dimensional semiconductor package device having enhanced security
03/20/2014US20140077354 Semiconductor module and an inverter mounting said semiconductor module
03/20/2014US20140077353 Heat dissipating substrate and semiconductor apparatus equipped with heat dissipating substrate
03/20/2014US20140077352 Matrix Lid Heatspreader for Flip Chip Package
03/20/2014US20140077351 Microelectronic packages with nanoparticle joining
03/20/2014US20140077350 Semiconductor device, method for manufacturing semiconductor device, and electronic device
03/20/2014US20140077349 Thermally Enhanced Package with Lid Heat Spreader
03/20/2014US20140077348 Semiconductor device and lead frame used for the same
03/20/2014US20140077347 Semiconductor device and method for manufacturing thereof
03/20/2014US20140077346 Method and system for pre-migration of metal ions in a semiconductor package
03/20/2014US20140077345 Semiconductor package, method and mold for producing same, input and output terminals of semiconductor package
03/20/2014US20140077344 Semiconductor Device with Protective Layer Over Exposed Surfaces of Semiconductor Die
03/20/2014US20140077341 Integrated circuit and seal ring
03/20/2014US20140077340 Device substrate and fabrication method thereof
03/20/2014US20140077335 Semiconductor device having a fuse element
03/20/2014US20140077334 Electronic Fuse Vias in Interconnect Structures
03/20/2014US20140077320 Scribe Lines in Wafers
03/20/2014US20140077308 Encapsulation of closely spaced gate electrode structures
03/20/2014US20140077280 Semiconductor device
03/20/2014US20140077278 Semiconductor device and manufacturing method of the same
03/20/2014US20140077259 Semiconductor device
03/20/2014US20140077255 Semiconductor device
03/20/2014US20140076234 Multi chamber processing system
03/20/2014DE112010006098T5 Package mit einem unter einem MEMS-Chip angeordneten CMOS-Chip Package with one arranged under a MEMS chip CMOS chip
03/20/2014DE112010002791B4 SCHALTKREISSTRUKTUR UND VERFAHREN ZUM PROGRAMMIEREN UNDUMPROGRAMMIEREN EINER ELEKTRONISCHEN SICHERUNG (eFUSE) FÜRGERINGE LEISTUNG UND MIT MEHREREN ZUSTÄNDEN CIRCUIT STRUCTURE AND METHOD FOR PROGRAMMING UNDUMPROGRAMMIEREN AN ELECTRONIC CONTROL (eFUSE) FÜRGERINGE PERFORMANCE AND MULTIPLE STATES
03/20/2014DE102013215389A1 Halbleitervorrichtung Semiconductor device
03/20/2014DE102013109654A1 Feldeffekt-Halbleiterbauelement und Verfahren zu seiner Herstellung Field-effect semiconductor device and process for its preparation
03/20/2014DE102013109095A1 Halbleitergehäusevorrichtung mit passiven energiebauteilen Semiconductor package device with passive energy ponents
03/20/2014DE102013105400A1 Bump structure e.g. ladder-bump structure, for bump-on-trace assembly, has copper pillar provided on metallurgy structure and including tapering arc-shaped profile, and metal cap mounted on pillar, where solder structure is mounted on cap
03/20/2014DE102013103206A1 Durchkontaktierungsstruktur sowie Verfahren Via structure and processes
03/20/2014DE102012216389A1 Power electronics module of power electronic system, has electrically conductive layers that are connected by short-circuit branch, and short-circuit branch that is separated by separating element for activation of electronics module
03/20/2014DE102012108627A1 Optoelektronische Halbleitervorrichtung und Trägerverbund Optoelectronic semiconductor device and carrier assembly
03/20/2014DE102012107959A1 Electronic components, useful for passivating metal oxide layer functional layer, include functional layer that comprises metal oxides and is coated with protective layer comprising epoxide compound and/or rearrangement product
03/20/2014DE102012107668A1 Bauelementanordnung Component arrangement
03/20/2014DE102010035980B4 Anschlusseinrichtung für ein Leistungshalbleitermodul Connection device for a power semiconductor module
03/20/2014DE102010033374B4 Einrichtung zur elektrischen Verbindung einer Leistungsbaugruppe mit Terminalflächenelementen Means for electrically connecting a power module with the terminal surface elements
03/20/2014DE102006017101B4 Leiterplatte und elektrisches Gerät PCB and electrical equipment
03/19/2014EP2709431A1 Cooler and manufacturing method for cooler
03/19/2014EP2709157A2 Heterostructure transistor with multiple gate dielectric layers
03/19/2014EP2709153A2 Metal-insulator-metal capacitors
03/19/2014EP2709152A2 Cooling circuit with sufficiently small dimensioned heat exchanger
03/19/2014EP2709151A1 Electronic assembly with a three-dimensional injection-moulded electronic circuit carrier
03/19/2014EP2709150A1 Humidity protection of semiconductor modules
03/19/2014EP2709149A1 Semiconductor device and manufacturing method thereof
03/19/2014EP2709148A1 Semiconductor device and manufacturing method thereof
03/19/2014EP2709144A2 Matrix lid heatspreader for flip chip package
03/19/2014EP2709143A1 Moulding method for manufacturing an electronic package
03/19/2014EP2707904A2 Optical recording device
03/19/2014EP2707898A1 Circuit module comprising cooling by means of a phase change material
03/19/2014EP2707897A1 Control device with a getter layer for use in a motor vehicle
03/19/2014EP2707653A2 Heat sink assembly for opto-electronic components and a method for producing the same
03/19/2014CN203492321U Novel radiator with crimping structure
03/19/2014CN203491266U Photoresistor lead
03/19/2014CN203491265U High-voltage glass-bead fast recovery diode
03/19/2014CN203491264U High-power glass-bead instantaneous-inhibition diode with high temperature resistance
03/19/2014CN203491260U Optical module and electronic device using same
03/19/2014CN203491256U A high-voltage silicon stack diode
03/19/2014CN203491255U Noise reduction and electrostatic discharge protection circuit
03/19/2014CN203491254U Base pin fall-off resistance support of encapsulated electronic product
03/19/2014CN203491253U Plastic packaging structure for semiconductors
03/19/2014CN203491252U Diode jumper wire
03/19/2014CN203491251U Sheet-type rectifier-bridge pile-packaging structure
03/19/2014CN203491250U Surface mounting chip
03/19/2014CN203491249U Chip heat dissipation device
03/19/2014CN203491248U Quick connection silicon controlled rectifier
03/19/2014CN203491247U Fixed block applied to radiator
03/19/2014CN203491246U Semiconductor packaging carrier
03/19/2014CN203491245U SMD diode with cooling plate
03/19/2014CN203491244U Packaging structure
03/19/2014CN103650357A Wireless apparatus and method for manufacturing same
03/19/2014CN103650335A Piezoelectric device
03/19/2014CN103650149A Display panel device and method for manufacturing same
03/19/2014CN103650144A Method for generating electric power within an integrated three-dimensional structure, and corresponding connection device
03/19/2014CN103650138A Semiconductor device and semiconductor device manufacturing method
03/19/2014CN103650136A Three-dimensional integrated circuit having stabilization structure for power supply voltage, and method for manufacturing same
03/19/2014CN103650135A Expanded semiconductor chip and semiconductor device
03/19/2014CN103650134A Semiconductor device
03/19/2014CN103650133A Techniques for wafer-level processing of QFN packages
03/19/2014CN103650132A Wireless module
03/19/2014CN103650131A Semiconductor device
03/19/2014CN103650130A Submount for electronic, optoelectronic, optical, or photonic components
03/19/2014CN103650129A Chip stacking
03/19/2014CN103650123A Method for manufacturing electronic component and adhesive sheet used in method for manufacturing electronic component
03/19/2014CN103650067A Method for forming conductive film, conductive film, insulation method, and insulation film
03/19/2014CN103649762A Current sensor substrate and current sensor
03/19/2014CN103649217A Curable epoxy resin composition
03/19/2014CN103649216A Resin composition for sealing optical semiconductor, and optical semiconductor device using same
03/19/2014CN103648256A Intermittent impact jet flow separately-shaped-fin cooling device
03/19/2014CN103647014A Transparent packaging LED light source and manufacturing technology thereof
03/19/2014CN103646968A A HEMT gate leakage current separating structure and method based on capacitor structure
03/19/2014CN103646953A Semiconductor device and method of manufacturing the same, and electronic apparatus
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