Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2005
03/31/2005US20050067705 Semiconductor device
03/31/2005US20050067704 Semiconductor device and method of manufacturing the same
03/31/2005US20050067703 Electronic member, method for making the same, and semiconductor device
03/31/2005US20050067700 Semiconductor device and method of manufacturing the same
03/31/2005US20050067699 Diffusion barrier layer for lead free package substrate
03/31/2005US20050067698 Optical semiconductor device
03/31/2005US20050067697 Apparatus for connecting an IC terminal to a reference potential
03/31/2005US20050067696 Semiconductor device and electronic apparatus equipped with the semiconductor device
03/31/2005US20050067693 Semiconductor device and manufacturing method thereof
03/31/2005US20050067692 Integrating thermoelectric elements into wafer for heat extraction
03/31/2005US20050067691 Power delivery using an integrated heat spreader
03/31/2005US20050067690 Highly heat dissipative chip module and its substrate
03/31/2005US20050067689 Semiconductor module and method for producing a semiconductor module
03/31/2005US20050067688 Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps
03/31/2005US20050067686 Semiconductor device containing stacked semiconductor chips and manufacturing method thereof
03/31/2005US20050067685 Fabrication of semiconductor dies with micro-pins and structures produced therewith
03/31/2005US20050067683 Memory expansion and chip scale stacking system and method
03/31/2005US20050067682 Semiconductor device containing stacked semiconductor chips and manufacturing method thereof
03/31/2005US20050067681 Package having integral lens and wafer-scale fabrication method therefor
03/31/2005US20050067680 Castellated chip-scale packages and methods for fabricating the same
03/31/2005US20050067679 Stitched micro-via to enhance adhesion and mechanical strength
03/31/2005US20050067677 Packaged integrated circuit providing trace access to high-speed leads
03/31/2005US20050067676 Method of forming a semiconductor package and structure thereof
03/31/2005US20050067673 Adjustable self-aligned air gap dielectric for low capacitance wiring
03/31/2005US20050067671 Semiconductor device having fuse and capacitor at the same level and method of fabricating the same
03/31/2005US20050067670 Method and apparatus for using cobalt silicided polycrystalline silicon for a one time programmable non-volatile semiconductor memory
03/31/2005US20050067669 Fuse circuit and semiconductor device including the same
03/31/2005US20050067666 Device for electrical connection between two wafers and fabrication process of a microelectronic component comprising such a device
03/31/2005US20050067658 Dry etching method for semiconductor device
03/31/2005US20050067657 Semiconductor device
03/31/2005US20050067655 Metal-oxide-semiconductor device including a buried lightly-doped drain region
03/31/2005US20050067654 Pressure-contactable power semiconductor module
03/31/2005US20050067635 Method of manufacturing electronic component, method of manufacturing electro-optical device, electronic component, and electro-optical device
03/31/2005US20050067633 Microelectromechanical system and method for fabricating the same
03/31/2005US20050067628 Light emitting diode
03/31/2005US20050067620 Three dimensional CMOS integrated circuits having device layers built on different crystal oriented wafers
03/31/2005US20050067619 Thin film semiconductor device and fabrication method therefor
03/31/2005US20050067617 Semiconductor device and manufacturing method thereof
03/31/2005US20050067616 Ground-signal-ground pad layout for device tester structure
03/31/2005US20050067587 Integrated circuit having radiation sensor arrangement
03/31/2005US20050067186 Hybrid integrated circuit device and method of manufacturing the same
03/31/2005US20050067179 Hermetically sealed micro-device package with window
03/31/2005US20050067178 Electronic assembly with thermally separated support
03/31/2005US20050067177 Module and method of manufacturing module
03/31/2005US20050067152 Heat dissipation device
03/31/2005US20050067150 Integratied liquid cooling system for electrical components
03/31/2005US20050067149 Heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins
03/31/2005US20050067145 Liquid cooling module
03/31/2005US20050067144 Cooling device
03/31/2005US20050067143 Heat conductive seat with liquid
03/31/2005US20050066523 Method of making an interposer with contact structures
03/31/2005US20050066487 Heat sink clip
03/31/2005DE69728648T2 Halbleitervorrichtung mit hochfrequenz-bipolar-transistor auf einem isolierenden substrat A semiconductor device having high-frequency bipolar transistor on an insulating substrate
03/31/2005DE19906841B4 Funkenstreckenanordnung und Verfahren zur Herstellung einer vertikalen Funkenstrecke The spark gap arrangement and method for manufacturing a vertical spark gap
03/31/2005DE19781846B4 Schaltungsgehäuse, insbesondere Flip-Chip- oder C4-Gehäuse mit Stromversorgungs- und Masseebenen Circuit case, in particular flip-chip or C4-housing with power and ground planes
03/31/2005DE10341453A1 Schaltungsträger Circuit board
03/31/2005DE10341186A1 Verfahren und Vorrichtung zum Kontaktieren von Halbleiterchips Method and apparatus for bonding semiconductor chips
03/31/2005DE10339990A1 Metalleitung mit einer erhöhten Widerstandsfähigkeit gegen Elektromigration entlang einer Grenzfläche einer dielektrischen Barrierenschicht mittels Implantieren von Material in die Metalleitung Metal line with an increased resistance to electromigration along a boundary surface of a dielectric barrier layer by implanting material into the metal line
03/31/2005DE10339890A1 Packaged semiconductor component with ball grid array connections below, has second connection surface on top to permit connection for automatic testing.
03/31/2005DE10339770A1 Fine pitch ball grid array device for face-down integrated circuit chips has balls of solder on underside in contact with through-connectors under copper layer and chip
03/31/2005DE10339762A1 Halbleiterbauteil mit einer Umverdrahtungslage und Verfahren zur Herstellung desselben Of the same semiconductor device with a rewiring and methods for preparing
03/31/2005DE10339692A1 Heat sink with electrically-insulating, thermally-conductive layer on which semiconductor components are mounted, comprises metallic body with surface-oxidation
03/31/2005DE10339689A1 Control system for n-channel MOSFET load transistor is connected to transistor gate and incorporates voltage limiter and deactivation switching network with current sensor and switch
03/31/2005DE102004042761A1 Sensoranordnung eines Kapazitätstyps für eine dynamische Grösse A capacitance type sensor arrangement for a dynamic size
03/31/2005DE102004042042A1 Memory module has secondary memory chips mounted over one of primary memory chips electrically connected to conductive pattern, so that primary memory chip mounted below secondary memory chip is disabled
03/31/2005DE102004039831A1 Multi-chip module with semiconductor store, includes comparator coupled to non-volatile store for comparing address at write/read accesses with stored address
03/31/2005DE102004004074A1 Elektronisches Bauelement mit Kühlfläche Electronic device with cooling surface
03/31/2005DE10022341B4 Elektronisches Leistungsmodul Electronic power module
03/31/2005DE10022268B4 Halbleiterbauelement mit zwei Halbleiterkörpern in einem gemeinsamen Gehäuse Semiconductor component having two semiconductor bodies in a common housing
03/30/2005EP1519646A2 Use of graphite foam materials in pumped liquid, two phase cooling, cold plates
03/30/2005EP1519645A2 Liquid cooling module
03/30/2005EP1519643A2 Integrated circuit socket contact
03/30/2005EP1519641A2 Module and method of manufacturing module
03/30/2005EP1519414A1 Multilayer wiring circuit module and method for fabricating the same
03/30/2005EP1519413A1 Via placement for layer transitions in flexible circuits with high density ball grid arrays
03/30/2005EP1519412A2 Method of mounting wafer on printed wiring substrate
03/30/2005EP1519411A2 Semiconductor device and method for fabricating the same
03/30/2005EP1519410A1 Method for producing electrical through hole interconnects and devices made thereof
03/30/2005EP1519310A2 Portable electronic device
03/30/2005EP1519309A1 Radio card with a reinforced chip
03/30/2005EP1519217A1 Display apparatus having heat transfer sheet
03/30/2005EP1518847A2 Aluminum/ceramic bonding substrate and method for producing same
03/30/2005EP1518451A1 Magnetic shielding for electronic circuits which include magnetic materials
03/30/2005EP1518279A2 Device for maintaining an object under vacuum and methods for making same, use in non-cooled infrared sensors
03/30/2005EP1518276A1 Integrated circuit structure for mixed-signal rf applications and circuits
03/30/2005EP1518275A2 Method for producing a component comprising a conductor structure that is suitable for use at high frequencies and corresponding component
03/30/2005EP1518274A1 Electronic component comprising a multilayer wiring frame and method for producing the same
03/30/2005EP1518273A2 Emi shielding including a lossy medium
03/30/2005EP1518272A1 Semiconductor structure integrated under a pad
03/30/2005EP1518271A1 Method and apparatus using nanotubes for cooling and grounding die
03/30/2005EP1518270A1 Packaging for semiconductor components and method for producing the same
03/30/2005EP1518267A2 Electronic component with a housing packaging
03/30/2005EP1518160A2 Cooling unit for cooling heat generating component
03/30/2005EP1461816A4 Mems device having contact and standoff bumps and related methods
03/30/2005EP1425109A4 Electro-optical component including a fluorinated poly (phenylene ether ketone) protective coating and related methods
03/30/2005EP1384263B1 Support for electrical circuit elements
03/30/2005EP1334370B1 Method for locating defects in a test structure
03/30/2005EP1226589B1 Infiltrated nanoporous materials and methods of producing same
03/30/2005EP1064828B1 Electronic ballast with a piezoelectric cooling fan
03/30/2005EP1018160A4 Hydrogenated oxidized silicon carbon material
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