Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2005
04/05/2005US6875638 Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board
04/05/2005US6875637 Semiconductor package insulation film and manufacturing method thereof
04/05/2005US6875636 Wafer applied thermally conductive interposer
04/05/2005US6875635 Method of attaching a die to a substrate
04/05/2005US6875634 Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the same
04/05/2005US6875632 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography
04/05/2005US6875630 Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same
04/05/2005US6875560 Testing multiple levels in integrated circuit technology development
04/05/2005US6875372 Fine particle size; monodispersion; crystal structure
04/05/2005US6875332 Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied
04/05/2005US6874573 Thermal interface material
04/05/2005US6874568 Bottom fixation type integrated circuit chip cooling structure
04/05/2005US6874566 Heat sink with intermediate fan element
04/05/2005US6874565 Cooling apparatus
04/05/2005US6874225 Electronic component mounting apparatus
04/03/2005CA2444411A1 Silicon slab and block
03/2005
03/31/2005WO2005029937A1 Electromagnetic interference shield unit and method of manufacturing the same
03/31/2005WO2005029932A1 Electronic component, and arrangement comprising an electronic component
03/31/2005WO2005029931A1 Bulk high thermal conductivity feedstock and method of making thereof
03/31/2005WO2005029594A1 A structure of light emitting diode
03/31/2005WO2005029584A1 Semiconductor integrated circuit
03/31/2005WO2005029582A1 Fuse structure having reduced heat dissipation towards the substrate
03/31/2005WO2005029581A1 Interposer and multilayer printed wiring board
03/31/2005WO2005029573A1 Fabrication of semiconductor devices
03/31/2005WO2005029572A1 Fabrication of conductive metal layer on semiconductor devices
03/31/2005WO2005029557A2 Fuse structure for maintaining passivation integrity
03/31/2005WO2005029555A2 Nanostructure augmentation of surfaces for enhanced thermal transfer
03/31/2005WO2005029498A2 Nanoscale wire coding for stochastic assembly
03/31/2005WO2005029295A2 Dynamic fluid spray jet delivery system
03/31/2005WO2005028549A2 Nano-composite materials for thermal management applications
03/31/2005WO2005028536A1 Alicyclic epoxy resin, process for producing the same, composition thereof, cured epoxy resin, and use of alicyclic epoxy resin composition
03/31/2005WO2004100259A3 Semi-conductor component and method for the production of a semi-conductor component
03/31/2005WO2004093135A3 Low profile small outline leadless semiconductor device package
03/31/2005WO2004091269A3 Method for production of (opto)electronic housings with a ceramic base for thermal regulation and dissipation by means of a thermoelectric (peltier) effect
03/31/2005WO2004081990A3 Coated metal stud bump formed by a coated wire for flip chip
03/31/2005WO2004073031A3 Alternative flip chip in leaded molded package design and method for manufacture
03/31/2005US20050071799 Routing for reducing impedance distortions
03/31/2005US20050071798 Power supply layout for an integrated circuit
03/31/2005US20050070664 Curing mixture of polyolefin and thermosetting resin; sealing, encapsulating semiconductor
03/31/2005US20050070175 IC socket contact
03/31/2005US20050070138 Slim USB Plug and Flash-Memory Card with Supporting Underside Ribs Engaging Socket Springs
03/31/2005US20050070131 Electrical circuit assembly with micro-socket
03/31/2005US20050070105 Small volume process chamber with hot inner surfaces
03/31/2005US20050070098 Pre-anneal of cosi, to prevent formation of amorphous layer between ti-o-n and cosi
03/31/2005US20050070096 Unidirectionally conductive materials for interconnection
03/31/2005US20050070094 Semiconductor device having multilayer interconnection structure and manufacturing method thereof
03/31/2005US20050070092 Method for creating electrical pathways for semiconductor device structures using laser machining processes
03/31/2005US20050070090 Method of forming metal pattern using selective electroplating process
03/31/2005US20050070088 Circuit structures and methods of forming circuit structures with minimal dielectric constant layers
03/31/2005US20050070087 Wafer-level thick film standing-wave clocking
03/31/2005US20050070086 Semiconductor device and method for fabricating the same
03/31/2005US20050070085 Reliable metal bumps on top of I/O pads after removal of test probe marks
03/31/2005US20050070083 Wafer-level moat structures
03/31/2005US20050070080 Method of forming self-aligned contact pads of non-straight type semiconductor memory device
03/31/2005US20050070074 Method for dicing semiconductor wafer
03/31/2005US20050070068 Alignment mark forming method, substrate in which devices are formed, and liquid discharging head using substrate
03/31/2005US20050070050 Method of mounting wafer on printed wiring substrate
03/31/2005US20050070048 Devices and methods employing high thermal conductivity heat dissipation substrates
03/31/2005US20050070047 Method of manufacturing a semiconductor device
03/31/2005US20050070046 Method of manufacturing electronic device and method of manufacturing electro-optical device
03/31/2005US20050070045 FBAR based duplexer device and manufacturing method thereof
03/31/2005US20050069815 Forming a water soluble protective film on substrate irradiation with light followed by removal with water
03/31/2005US20050069790 Method for reducing an overlay error and measurement mark for carrying out the same
03/31/2005US20050069715 A curable compound, or adduct, or epoxy resins of anthrahydroquinone and epichlorohydrin; phenolic resin as curing agents; cured product is used for semiconductor encapsulation; solid, low melt viscosity, flame retardance, halogen-free; mechanical strength, heat resistance, moisture resistance
03/31/2005US20050069432 Electronic apparatus having pump unit
03/31/2005US20050069410 Volute inlet of fan
03/31/2005US20050068757 Stress compensation layer systems for improved second level solder joint reliability
03/31/2005US20050068748 Thin film circuit board device and method for manufacturing the same
03/31/2005US20050068742 Clip for mounting heat sink to circuit board
03/31/2005US20050068741 System and method for mounting processor and heat transfer mechanism
03/31/2005US20050068740 Heat sink mounting and interface mechanism and method of assembling same
03/31/2005US20050068739 Method and structure for cooling a dual chip module with one high power chip
03/31/2005US20050068738 Display apparatus having heat transfer sheet
03/31/2005US20050068737 Heatsink device and method
03/31/2005US20050068735 Module for solid state relay for engine cooling fan control
03/31/2005US20050068730 Heat dissipation method for microprocessors
03/31/2005US20050068729 Dual-fan heat dissipator
03/31/2005US20050068727 Heat dissipating structure of accelerated graphic port card
03/31/2005US20050068726 Electro-fluidic device and interconnect and related methods
03/31/2005US20050068725 Thermal management systems for micro-components
03/31/2005US20050068707 Semiconductor device provided with overheat protection circuit and electronic circuit using the same
03/31/2005US20050068310 Electro-optical device and electronic apparatus
03/31/2005US20050068146 Variable inductor for integrated circuit and printed circuit board
03/31/2005US20050067899 Semiconductor device and method for producing the same
03/31/2005US20050067722 Semiconductor device which prevents peeling of low-permittivity film by using multilevel interconnection
03/31/2005US20050067721 Method of producing an electronic component and a panel with a plurality of electronic components
03/31/2005US20050067720 Heating mold and moving the mold surface to press the encapsulation layer on back surface of wafer so as not only to form a flat protection layer on back surface of wafer more quickly but also simplify the process flow by eliminating the step of smoothing the protecting layer
03/31/2005US20050067719 Semiconductor device and method for producing the same
03/31/2005US20050067718 An encapsulated organic optoelectronic device comprising a substrate, an organic optoelectronic device on the substrate and includes a cathode, a diffusion layer on the organic device
03/31/2005US20050067717 Substrate having built-in semiconductor apparatus and manufacturing method thereof
03/31/2005US20050067716 Group III nitride based flip-chip integrated circuit and method for fabricating
03/31/2005US20050067714 Method and apparatus for a dual substrate package
03/31/2005US20050067713 Semiconductor device and method of manufacturing semiconductor device
03/31/2005US20050067712 Semiconductor apparatus and method of fabricating the same
03/31/2005US20050067711 Providing a via with an increased via contact area
03/31/2005US20050067710 Define via in dual damascene process
03/31/2005US20050067709 metal reinforcing layer formed under and in contact with the wire bonding pad, stiffening the brittle inter-level dielectric, distributing bonding forces over an extended area
03/31/2005US20050067708 Semiconductor device having a composite layer in addition to a barrier layer between copper wiring and aluminum bond pad
03/31/2005US20050067707 Semiconductor device and method for fabricating the same
03/31/2005US20050067706 Semiconductor device and production method thereof
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