| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/06/2005 | CN1604334A Semiconductor device and method of fabricating the same |
| 04/06/2005 | CN1604326A Integrated circuitry and method for manufacturing the same |
| 04/06/2005 | CN1604325A Chip with a plurality of internal functional blocks and method for power supply and noise reduction |
| 04/06/2005 | CN1604324A Semiconductor device and method for producing the same |
| 04/06/2005 | CN1604323A Circuit device and method for manufacturing same |
| 04/06/2005 | CN1604322A 半导体器件 Semiconductor devices |
| 04/06/2005 | CN1604321A Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
| 04/06/2005 | CN1604320A Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
| 04/06/2005 | CN1604319A Interlinkage of chip core device and its making method |
| 04/06/2005 | CN1604318A 半导体器件 Semiconductor devices |
| 04/06/2005 | CN1604317A Tungsten plugged barrier layer deposition process and structure thereof |
| 04/06/2005 | CN1604316A Semiconductor device which prevents peeling of low-permittivity film by using multilevel interconnection |
| 04/06/2005 | CN1604315A Contact structure of semiconductor device and method of manufacturing the same |
| 04/06/2005 | CN1604314A Power module and its connecting method |
| 04/06/2005 | CN1604313A Semiconductor module and method for producing a semiconductor module |
| 04/06/2005 | CN1604312A Flip chip mounting circuit board, its manufacturing method and integrated circuit device |
| 04/06/2005 | CN1604310A Semiconductor device and method for manufacturing same |
| 04/06/2005 | CN1604309A Method for producing a multichip module and multichip module |
| 04/06/2005 | CN1604306A Three dimensional CMOS integrated circuits having device layers built on different crystal oriented wafers |
| 04/06/2005 | CN1604297A Semiconductor device and method for producing the same |
| 04/06/2005 | CN1604295A Method of manufacturing wafer level chip size package |
| 04/06/2005 | CN1604293A Method for manufacturing semiconductor device and semiconductor device |
| 04/06/2005 | CN1604279A Wiring substrate and method of manufacturing thereof, and thin film transistor and method of manufacturing thereof |
| 04/06/2005 | CN1604271A Simulation circuit pattern evaluation method, manufacturing method of semiconductor integrated circuit, test substrate, and test substrate group |
| 04/06/2005 | CN1603958A Alignment mark forming method, substrate in which devices are formed, and liquid discharging head using substrate |
| 04/06/2005 | CN1603883A Microelectromechanical system and method for fabricating the same |
| 04/06/2005 | CN1603591A Electronic apparatus having pump unit |
| 04/06/2005 | CN1603382A 热界面材料 Thermal interface material |
| 04/06/2005 | CN1603300A Cyclohexanetricarboxylic monoester and its use |
| 04/06/2005 | CN1603054A Snagau solder bumps, method of manufacturing the same, and method of bonding light emitting device using the same |
| 04/06/2005 | CN1196395C Electronic device with built-in heating unit and cooling device of electronic system |
| 04/06/2005 | CN1196392C Wiring base plate and its manufacture method |
| 04/06/2005 | CN1196387C Carrying strip for connecting integrated circuit to external circuit and making method thereof |
| 04/06/2005 | CN1196208C Silicon based conductive material and process for production thereof |
| 04/06/2005 | CN1196193C Semiconductor device and its manufacturing method |
| 04/06/2005 | CN1196192C Method of mfg. carrying band and carrying band type semiconductor device |
| 04/06/2005 | CN1196188C Method for mfg. semiconductor device |
| 04/06/2005 | CN1196185C Image sensor single-layer conductor rest secondary semi-etching mfg. method |
| 04/06/2005 | CN1196179C Semiconductor chip manufacturing and wiring design method thereof |
| 04/06/2005 | CN1196174C Method for making ceramic base plate form flat surface by using porous material |
| 04/06/2005 | CN1196151C Microelectronic Component carrier and method of its manufacture |
| 04/06/2005 | CN1195906C Metal fine machining apparatus and method |
| 04/06/2005 | CN1195888C Conductor track structures arranged on nonconductive material, espectially fine conductor track structure, and method for producing the same |
| 04/05/2005 | US6876846 High frequency module |
| 04/05/2005 | US6876565 Semiconductor memory device |
| 04/05/2005 | US6876554 Printing wiring board and method of producing the same and capacitor to be contained in printed wiring board |
| 04/05/2005 | US6876553 Enhanced die-up ball grid array package with two substrates |
| 04/05/2005 | US6876551 Heat sink assembly including clip with pressing and operating members |
| 04/05/2005 | US6876550 Active heat sink for high power microprocessors |
| 04/05/2005 | US6876482 MEMS device having contact and standoff bumps and related methods |
| 04/05/2005 | US6876324 Radar apparatus |
| 04/05/2005 | US6876285 High density multi-layer microcoil and method for fabricating the same |
| 04/05/2005 | US6876250 Low-power band-gap reference and temperature sensor circuit |
| 04/05/2005 | US6876227 Simplifying the layout of printed circuit boards |
| 04/05/2005 | US6876093 Capacitance type dynamic quantity sensor device |
| 04/05/2005 | US6876091 Wiring board |
| 04/05/2005 | US6876090 Encapsulation; covering connecting pads and bonding wires; surface roughness altered by radiation |
| 04/05/2005 | US6876089 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer |
| 04/05/2005 | US6876088 Flex-based IC package construction employing a balanced lamination |
| 04/05/2005 | US6876087 Exposured bonding pads; lead frame carrier; controlling thickness; printed circuit |
| 04/05/2005 | US6876084 Chip package structure |
| 04/05/2005 | US6876083 Electrode alloy containing niobium, titanium, tungsten and, or aluminum overcoated with dielectric |
| 04/05/2005 | US6876081 Composite dielectric layers |
| 04/05/2005 | US6876079 Embedding aluminum wire in groove in dielectric interface; vapor deposition |
| 04/05/2005 | US6876078 Includes diffusion barrier layer pattern, conductive layer pattern, adhesion layer pattern, and tantalum nitride layer pattern that are sequentially stacked over substrate; resists process failures such as ring defects |
| 04/05/2005 | US6876077 Semiconductor device and its manufacturing method |
| 04/05/2005 | US6876076 Multilayer semiconductor device for transmitting microwave signals and associated methods |
| 04/05/2005 | US6876075 Heat resistance; dimensional stability; accuracy; package for semiconductor substrate; heat dissipation, lightweigth |
| 04/05/2005 | US6876074 Stack package using flexible double wiring substrate |
| 04/05/2005 | US6876073 Semiconductor device and contractor for inspection |
| 04/05/2005 | US6876072 Semiconductor chip assembly with chip in substrate cavity |
| 04/05/2005 | US6876071 Masking layer in substrate cavity |
| 04/05/2005 | US6876070 Repatterned integrated circuit chip package |
| 04/05/2005 | US6876069 Ground plane for exposed package |
| 04/05/2005 | US6876068 Semiconductor package with increased number of input and output pins |
| 04/05/2005 | US6876067 Semiconductor device |
| 04/05/2005 | US6876066 Packaged microelectronic devices and methods of forming same |
| 04/05/2005 | US6876064 Semiconductor device having superior resistance to moisture |
| 04/05/2005 | US6876062 Seal ring and die corner stress relief pattern design to protect against moisture and metallic impurities |
| 04/05/2005 | US6876061 Chip scale surface mount package for semiconductor device and process of fabricating the same |
| 04/05/2005 | US6876059 Semiconductor integrated circuit device and method of manufacturing the same |
| 04/05/2005 | US6876058 Wiring protection element for laser deleted tungsten fuse |
| 04/05/2005 | US6876057 Semiconductor devices including fuses and dummy fuses |
| 04/05/2005 | US6876047 MEMS device having a trilayered beam and related methods |
| 04/05/2005 | US6876015 Semiconductor devices |
| 04/05/2005 | US6876014 Interconnection structure of a semiconductor device |
| 04/05/2005 | US6875997 Test patterns and methods of controlling CMP process using the same |
| 04/05/2005 | US6875921 Capacitive interposer |
| 04/05/2005 | US6875920 Semiconductor device and design support method of electronic device using the same |
| 04/05/2005 | US6875690 Semiconductor device having self-aligned contact plug and method for fabricating the same |
| 04/05/2005 | US6875685 Method of forming gas dielectric with support structure |
| 04/05/2005 | US6875683 Method of forming bump |
| 04/05/2005 | US6875682 Mesh pad structure to eliminate IMD crack on pad |
| 04/05/2005 | US6875681 Wafer passivation structure and method of fabrication |
| 04/05/2005 | US6875672 Method of manufacturing a semiconductor device with penetration electrodes that protrude from a rear side of a substrate formed by thinning the substrate |
| 04/05/2005 | US6875651 Dual-trench isolated crosspoint memory array and method for fabricating same |
| 04/05/2005 | US6875645 Pixel structure and fabricating method thereof |
| 04/05/2005 | US6875641 Three-dimensional memory |
| 04/05/2005 | US6875640 Stereolithographic methods for forming a protective layer on a semiconductor device substrate and substrates including protective layers so formed |
| 04/05/2005 | US6875639 Semiconductor device and method of manufacturing the same |