| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/07/2005 | US20050073811 Heat dissipating device for electronic component |
| 04/07/2005 | US20050073802 Structure and method of making a capacitor having low equivalent series resistance |
| 04/07/2005 | US20050073800 Metal-insulator-metal capacitor structure |
| 04/07/2005 | US20050073669 Dual sided lithographic substrate imaging |
| 04/07/2005 | US20050073619 Multi-layered complementary wire structure and manufacturing method thereof |
| 04/07/2005 | US20050073414 Device and method for identifying a component surrounded by an outer package |
| 04/07/2005 | US20050073059 Integrated circuit with dual electrical attachment PAD configuration |
| 04/07/2005 | US20050073058 Integrated circuit package bond pad having plurality of conductive members |
| 04/07/2005 | US20050073057 Semiconductor electronic device and method of manufacturing thereof |
| 04/07/2005 | US20050073056 Semiconductor device with electrode pad having probe mark |
| 04/07/2005 | US20050073055 [quad flat no-lead package structure and manufacturing method thereof] |
| 04/07/2005 | US20050073054 Integrated circuit incorporating flip chip and wire bonding |
| 04/07/2005 | US20050073053 Semiconductor devices having a capacitor and methods of manufacturing the same |
| 04/07/2005 | US20050073052 Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium |
| 04/07/2005 | US20050073050 BGA package and printed circuit board for supporting the package |
| 04/07/2005 | US20050073049 Semiconductor device and method of fabricating the same |
| 04/07/2005 | US20050073048 Sealing and protecting integrated circuit bonding pads |
| 04/07/2005 | US20050073044 Plastic packaging with high heat dissipation and method for the same |
| 04/07/2005 | US20050073043 Semiconductor device having heat conducting plates |
| 04/07/2005 | US20050073042 Semiconductor device |
| 04/07/2005 | US20050073040 Wafer level package for micro device and manufacturing method thereof |
| 04/07/2005 | US20050073039 Semiconductor device and method of fabricating the same |
| 04/07/2005 | US20050073038 Conductive trace structure and semiconductor package having the conductive trace structure |
| 04/07/2005 | US20050073036 Overmolded optical package |
| 04/07/2005 | US20050073035 Semiconductor component having stiffener and circuit decal and method of fabrication |
| 04/07/2005 | US20050073034 Package for semiconductor chip |
| 04/07/2005 | US20050073032 Leadless semiconductor package |
| 04/07/2005 | US20050073031 Lead frame, semiconductor device, and method for manufacturing semiconductor device |
| 04/07/2005 | US20050073029 Multichip wafer level packages and computing systems incorporating same |
| 04/07/2005 | US20050073025 Spiral inductor and transformer |
| 04/07/2005 | US20050073024 Integrated semiconductor circuit with an electrically programmable switching element |
| 04/07/2005 | US20050073023 Electronically programmable antifuse and circuits made therewith |
| 04/07/2005 | US20050073020 [input/output structure and integrated circuit using the same] |
| 04/07/2005 | US20050073017 Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof |
| 04/07/2005 | US20050073012 Transistor having multiple gate pads |
| 04/07/2005 | US20050073009 Semiconductor device |
| 04/07/2005 | US20050072984 Light emitting device assembly |
| 04/07/2005 | US20050072974 Wiring substrate and method of manufacturing thereof, and thin film transistor and method of manufacturing thereof |
| 04/07/2005 | US20050072972 Method of semiconductor device protection, package of semiconductor device |
| 04/07/2005 | US20050072835 SnAgAu solder bumps, method of manufacturing the same, and method of bonding light emitting device using the same |
| 04/07/2005 | US20050072834 Connection site coating method and solder joints |
| 04/07/2005 | US20050072595 Method of manufacturing substrate for circuit board and smart label having the substrate |
| 04/07/2005 | US20050072563 Heat sink structure |
| 04/07/2005 | US20050072558 Heat sink assembly and connecting device |
| 04/07/2005 | US20050072557 Heat-conductive structure |
| 04/07/2005 | US20050072556 Heat sink clip mechanism |
| 04/07/2005 | US20050072555 Heat sink fastening device |
| 04/07/2005 | US20050072547 Aluminum/ceramic bonding substrate and method for producing same |
| 04/07/2005 | US20050072334 Thermal interface material |
| 04/07/2005 | US20050072165 Thermoelectrics utilizing thermal isolation |
| 04/07/2005 | DE19782235B4 Lasergestütztes Verfahren und System für die Reparatur oder Neukonfiguration einer integrierten Schaltung Laser-assisted method and system for repair or reconfiguration of an integrated circuit |
| 04/07/2005 | DE10343065A1 Circuit board arrangement for mobile telephones and laptops comprises a circuit board layer, a component arranged on the circuit board layer, and a positioning element formed on the circuit board layer for fixing the component on the layer |
| 04/07/2005 | DE10343053A1 Elektronisches Bauelement und Anordnung mit einem elektronischen Bauelement And electronic component assembly having an electronic component |
| 04/07/2005 | DE10343020A1 Cooling body for removing waste heat from electronic components comprises a base body in contact with the covering surface of the component on one side and supporting a heat exchanger on the other side |
| 04/07/2005 | DE10341544A1 Strip conductor arrangement used in the electronics industry comprises a strip conductor arranged in a substrate, additional strip conductors, a covering layer, a hollow chamber, wall layers, plugs, and further layers |
| 04/07/2005 | DE10339924A1 ESD-Testanordnung und Verfahren ESD test arrangement and method |
| 04/07/2005 | DE10309689B4 Keramische Platte mit monolithischem Schichtaufbau und Verfahren zu seiner Herstellung Ceramic plate with a monolithic layer structure and process for its production |
| 04/07/2005 | DE102004041346A1 Halbleiter und Verfahren zur Herstellung desselben Semiconductor and method for manufacturing the same |
| 04/07/2005 | DE102004033106A1 System und Verfahren für eine verbesserte thermische LED-Leitfähigkeit System and method for improved thermal conductivity LED |
| 04/07/2005 | DE102004020261A1 Wärmeabfuhrvorrichtung und -verfahren Heat removal apparatus and method |
| 04/07/2005 | DE10047147B4 Integrierte Halbleiterschaltung, insbesondere Halbleiterspeicherschaltung und diese verwendendes Halbleiterschaltungsmodul A semiconductor integrated circuit, in particular semiconductor memory circuit and these-use semiconductor circuit module |
| 04/06/2005 | EP1521304A2 Process for producing resin-sealed type electronic device |
| 04/06/2005 | EP1521302A1 Method for formation of airgaps around an interconnect |
| 04/06/2005 | EP1521301A1 Method of formation of airgaps around interconnecting line |
| 04/06/2005 | EP1521300A1 Circuit structure integrated on a semiconductor substrate and relevant manufacturing method |
| 04/06/2005 | EP1520993A2 Electronic apparatus having cooling pump unit |
| 04/06/2005 | EP1520320A1 Electrical system, especially a microelectronic or microelectromechanical high frequency system |
| 04/06/2005 | EP1520297A2 Integrated strip conductor arrangement |
| 04/06/2005 | EP1520296A1 Wearable silicon chip |
| 04/06/2005 | EP1520294A1 Thin-film electronic device, in particular power device, and method for making same |
| 04/06/2005 | EP1520057A2 Method of making a composite product and in particular a heat sink |
| 04/06/2005 | EP1466352A4 Method of forming copper interconnections for semiconductor integrated circuits on a substrate |
| 04/06/2005 | EP1461386A4 Electroconductive resin composition |
| 04/06/2005 | EP1444731A4 Controlled impedance transmission lines in a redistribution layer |
| 04/06/2005 | EP1350043B1 Device of a plastic control plate in a gearbox control device of a hydraulic motor vehicle |
| 04/06/2005 | EP1285213B1 Microstructured heat exchanger and method for producing the same |
| 04/06/2005 | EP1069437B1 Method for controlling ic handler and control system using the same |
| 04/06/2005 | CN2691157Y Motor vehicle rectifier |
| 04/06/2005 | CN2691057Y Package structure of photosensitive chip |
| 04/06/2005 | CN2691056Y Package structure with power chip |
| 04/06/2005 | CN2691055Y Heat radiator |
| 04/06/2005 | CN2691054Y Heat pipe radiator |
| 04/06/2005 | CN2691053Y Liquid cooling type radiation module |
| 04/06/2005 | CN2691052Y Heat radiator |
| 04/06/2005 | CN2691051Y Package base board structure capable of reducing cutting stress |
| 04/06/2005 | CN1605126A Semiconductor structure with one or more through-holes |
| 04/06/2005 | CN1605124A Large area silicon carbide devices and manufacturing methods therefor |
| 04/06/2005 | CN1605122A Dual cure B-stageable underfill for wafer level |
| 04/06/2005 | CN1605121A Surface mounted package with die bottom spaced from support board |
| 04/06/2005 | CN1605118A Method for production of dielectric layers using polyfunctional carbosilanes |
| 04/06/2005 | CN1604938A Elastomer formed product |
| 04/06/2005 | CN1604831A Wire bonder for ball bonding insulated wire and method of using same |
| 04/06/2005 | CN1604721A Module and method of manufacturing module |
| 04/06/2005 | CN1604719A 电路装置 Circuit device |
| 04/06/2005 | CN1604400A IC socket contact |
| 04/06/2005 | CN1604398A Card connector having a heat radiation member without inhibiting insertion and removal of a card |
| 04/06/2005 | CN1604350A 发光二极管 Led |
| 04/06/2005 | CN1604349A 发光二极管 Led |
| 04/06/2005 | CN1604347A Light emitting device assembly |
| 04/06/2005 | CN1604345A Casing for reflection plate and light emitting diode and light emitting diode |